EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE
    2.
    发明申请
    EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE 有权
    外延基板和制造外延基板的方法

    公开(公告)号:US20120161152A1

    公开(公告)日:2012-06-28

    申请号:US13414104

    申请日:2012-03-07

    摘要: Provided is a crack-free epitaxial substrate having a small amount of warping, in which a silicon substrate is used as a base substrate. The epitaxial substrate includes a (111) single crystal Si substrate, a buffer layer, and a crystal layer. The buffer layer is formed of a first lamination unit and a second lamination unit being alternately laminated. The first lamination unit includes a composition modulation layer and a first intermediate layer. The composition modulation layer is formed of a first unit layer and a second unit layer having different compositions being alternately and repeatedly laminated so that a compressive strain exists therein. The first intermediate layer enhances the compressive strain existing in the composition modulation layer. The second lamination unit is a second intermediate layer that is substantially strain-free.

    摘要翻译: 提供了具有少量翘曲的无裂纹外延基板,其中使用硅基板作为基底。 外延衬底包括(111)单晶Si衬底,缓冲层和晶体层。 缓冲层由第一层叠单元和第二层压单元交替层叠形成。 第一层压单元包括组成调制层和第一中间层。 组成调制层由具有不同组成的第一单位层和第二单位层形成,以便在其中存在压缩应变。 第一中间层增强了存在于组成调制层中的压缩应变。 第二层压单元是基本上无应变的第二中间层。

    LIGHT-RECEIVING DEVICE AND MANUFACTURING METHOD FOR A LIGHT-RECEIVING DEVICE
    3.
    发明申请
    LIGHT-RECEIVING DEVICE AND MANUFACTURING METHOD FOR A LIGHT-RECEIVING DEVICE 失效
    收光装置的收光装置及其制造方法

    公开(公告)号:US20100078679A1

    公开(公告)日:2010-04-01

    申请号:US12543706

    申请日:2009-08-19

    IPC分类号: H01L31/108 H01L31/18

    摘要: Provided is a light-receiving device which has light-receiving sensitivity superior to that of a conventional Schottky diode type light-receiving device and also has sufficiently-strengthened junction of a Schottky electrode. A first contact layer formed of AlGaN and having conductivity, a light-receiving layer formed of AlGaN, and a second contact layer formed of AlN and having a thickness of 5 nm are epitaxially formed on a predetermined substrate in the stated order, and a second electrode is brought into Schottky junction with the second contact layer, to thereby form MIS junction. Further, after the Schottky junction, heat treatment is performed under a nitrogen gas atmosphere at 600° C. for 30 seconds.

    摘要翻译: 提供一种光接收装置,其具有优于常规肖特基二极管型光接收装置的光接收灵敏度,并且还具有足够强的肖特基电极的结。 由AlGaN形成并具有导电性的第一接触层,由AlGaN形成的光接收层和由AlN形成的厚度为5nm的第二接触层按照所述顺序外延形成在预定基板上,第二接触层 电极与第二接触层进入肖特基结,从而形成MIS结。 此外,在肖特基结之后,在氮气气氛下在600℃下进行30秒的热处理。

    EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE
    4.
    发明申请
    EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE 有权
    外延基板和制造外延基板的方法

    公开(公告)号:US20130032781A1

    公开(公告)日:2013-02-07

    申请号:US13570665

    申请日:2012-08-09

    IPC分类号: H01L29/15 H01L21/20

    摘要: Provided is a crack-free epitaxial substrate with reduced warping, in which a silicon substrate is used as a base substrate. The epitaxial substrate includes a (111) single crystal Si substrate, a superlattice layer group in which a plurality of superlattice layers are laminated, and a crystal layer. The superlattice layer is formed of a first unit layer and a second unit layer made of group-III nitrides having different compositions being alternately and repeatedly laminated. The crystal layer is made of a group-III nitride and formed above the base substrate so as to be positioned at an upper side of the superlattice layer group relative to the base substrate. The superlattice layer group has a compressive strain contained therein. In the superlattice layer group, the more distant the superlattice layer is from the base substrate, the greater the compressive strain becomes.

    摘要翻译: 提供了一种具有减小翘曲的无裂纹外延衬底,其中硅衬底用作基底衬底。 外延衬底包括(111)单晶Si衬底,层叠有多个超晶格层的超晶格层组和晶体层。 超晶格层由第一单位层和由具有不同组成的III-III族氮化物制成的第二单元层交替地和重复地层叠形成。 晶体层由III族氮化物制成,并且形成在基底基板上方,以便相对于基底衬底位于超晶格层组的上侧。 超晶格层组中含有压应变。 在超晶格层组中,超晶格层离基底越远,压应变越大。

    SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20070215885A1

    公开(公告)日:2007-09-20

    申请号:US11685941

    申请日:2007-03-14

    IPC分类号: H01L33/00

    摘要: A semiconductor device having small leakage current and high breakdown voltage during reverse blocking, small on-state resistance and large output current at forward conduction, short reverse recovery time at shutoff, and high peak surge current value is provided. An n-type layer is made of a group-III nitride, and a p-type layer is made of a group-IV semiconductor material having a smaller band gap than the group-III nitride. The energy level at the top of the valence band of the n-type layer is lower than the energy level at the top of the valence band of the p-type layer, so that a P—N junction semiconductor device satisfying the above requirements is obtained. Further, a combined structure of P—N junction and Schottky junction by additionally providing an anode electrode to be in Schottky contact with the n-type layer also achieves the effect of decreasing voltage at the rising edge of current resulting from the Schottky junction.

    摘要翻译: 提供了在反向阻断时具有小的漏电流和高击穿电压的半导体器件,小导通状态电阻和正向导通时的大输出电流,关断时的反向恢复时间短以及高峰值浪涌电流值。 n型层由III族氮化物制成,p型层由具有比III族氮化物更小的带隙的IV族半导体材料制成。 n型层的价带顶部的能级低于p型层的价带顶部的能级,从而获得满足上述要求的P-N结半导体器件。 此外,通过额外提供与n型层肖特基接触的阳极电极,P-N结和肖特基结的组合结构也实现了在肖特基结的电流上升沿降低电压的效果。