SPUTTERING APPARATUS AND MANUFACTURING METHOD OF MAGNETORESISTIVE ELEMENT
    10.
    发明申请
    SPUTTERING APPARATUS AND MANUFACTURING METHOD OF MAGNETORESISTIVE ELEMENT 审中-公开
    电子元件的溅射装置和制造方法

    公开(公告)号:US20150259788A1

    公开(公告)日:2015-09-17

    申请号:US14479216

    申请日:2014-09-05

    IPC分类号: C23C14/35 H01J37/34

    摘要: According to one embodiment, a sputtering apparatus includes a first chamber configured to form a magnetic film on a substrate and a second chamber configured to form a non-magnetic film on the substrate, which are disposed to be adjacent to each other so that the substrate is conveyable between the chambers. A magnetic target is provided in the first chamber, and a non-magnetic target and a low dielectric-constant target having a dielectric constant lower than that of the non-magnetic target are provided in the second chamber. Here, before the non-magnetic target is formed on the substrate by sputtering, the low dielectric-constant target is subjected to sputtering in the second chamber, thereby depositing a low dielectric-constant material on the inner surface of the second chamber.

    摘要翻译: 根据一个实施例,溅射装置包括:第一室,被配置为在基板上形成磁膜;以及第二室,被配置为在所述基板上形成非磁性膜,所述非磁性膜设置成彼此相邻,使得所述基板 是可以在房间之间传送的。 在第一室中设置有磁性靶,在第二室中设置介电常数低于非磁性靶的介电常数的非磁性靶和低介电常数靶。 这里,在通过溅射在基板上形成非磁性靶之前,在第二室中对低介电常数靶进行溅射,从而在第二室的内表面上沉积低介电常数材料。