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    Method of producing multilayer wired circuit board
    1.
    发明申请
    Method of producing multilayer wired circuit board 审中-公开
    生产多层布线电路板的方法

    公开(公告)号：US20050079652A1

    公开(公告)日：2005-04-14

    申请号：US10959108

    申请日：2004-10-07

    申请人： Mineyoshi Hasegawa ,  Kei Nakamura ,  Toshikazu Baba

    发明人： Mineyoshi Hasegawa ,  Kei Nakamura ,  Toshikazu Baba

    IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L21/44

    CPC分类号： H05K3/0038 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195

    摘要： A method of producing a multilayer wired circuit board that can suppress making gouge in an adhesive layer when a hole is formed by irradiation with a laser beam, to provide a smoothened inside surface of the hole so as to provide enhanced reliability of electrical connection. A first substrate 4 having the structure wherein a first metal foil 2 and a second metal foil 3 are formed on both sides of a first insulating layer 1 and a second substrate 7 having the structure wherein a third metal foil 6 is formed on a single side of a second insulating layer 5 are prepared, separately. Then, the first metal foil 2 of the first substrate 4 and the second insulating layer 5 of the second substrate 7 are bonded together through an adhesive layer 8. Thereafter, the resultant laminate is irradiated with a laser beam emitting from the first substrate 4 side toward the second substrate 7 side, to form a through hole 9. When the through hole 9 is formed, the adhesive layer 8 is irradiated with the laser beam decayed in energy after applied to the second metal foil 3 and the first metal foil 2. Hence, the adhesive layer can be prevented from being gouged by thermal decomposition, and as such can permit a smoothened inside surface of the through hole 9.

    摘要翻译： 一种制造多层布线电路板的方法，该多层布线电路板可以通过用激光束照射形成孔而能够抑制在粘合剂层中产生气泡，从而提供孔的光滑的内表面，从而提高电连接的可靠性。 具有这样的结构的第一基板4，其中在第一绝缘层1和第二基板7的两侧形成有第一金属箔2和第二金属箔3，第二基板7具有在第一金属箔6的单侧上形成第三金属箔6 分别制备第二绝缘层5。 然后，第一基板4的第一金属箔2和第二基板7的第二绝缘层5通过粘合层8接合在一起。然后，用从第一基板4侧发射的激光束照射所得到的层压体 朝向第二基板7侧形成通孔9.当形成通孔9时，在施加到第二金属箔3和第一金属箔2上之后，用能量衰减的激光束照射粘合剂层8。 因此，可以防止粘合剂层因热分解而被破坏，因此能够使通孔9的内表面平滑化。

    Multilayer flexible wiring circuit board and its manufacturing method
    2.
    发明授权
    Multilayer flexible wiring circuit board and its manufacturing method 失效
    多层柔性布线电路板及其制造方法

    公开(公告)号：US06887560B2

    公开(公告)日：2005-05-03

    申请号：US10363165

    申请日：2002-07-03

    申请人： Kei Nakamura ,  Satoshi Tanigawa ,  Hiroshi Yamazaki ,  Mineyoshi Hasegawa

    发明人： Kei Nakamura ,  Satoshi Tanigawa ,  Hiroshi Yamazaki ,  Mineyoshi Hasegawa

    IPC分类号： H05K3/40 ,  H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/28 ,  H05K3/46 ,  B32B3/00

    CPC分类号： H05K3/4658 ,  H05K1/0393 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917

    摘要： A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

    摘要翻译： 一种可提供高密度布线并且还可以提供厚度和尺寸的减小的多层柔性布线电路板及其制造方法。 通过制备在第一绝缘层的两侧上层叠有第一导体层和第二导体层的双面基板来制造四层柔性布线电路板; 制备其中在第二绝缘层的一个表面上层叠第三导体层的第一单面基板和在第三绝缘层的一个表面上层叠第四导体层的第二单面基板; 通过第一热固性粘合剂层将第一导体层和第三导体层彼此接合; 以及通过第二热固性粘合剂层将所述第二导体层和所述第四导体层彼此接合。

    Optical sensor module
    4.
    发明授权
    Optical sensor module 失效
    光学传感器模块

    公开(公告)号：US08452138B2

    公开(公告)日：2013-05-28

    申请号：US13361230

    申请日：2012-01-30

    申请人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    发明人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    IPC分类号： G02B6/10 ,  G02B6/42

    CPC分类号： G02B6/423

    摘要： An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

    摘要翻译： 提供一种光传感器模块，其中板单元的接合部分装配在光波导单元的凹槽中，并且即使具有单个接合部分，板单元也被稳定地支撑。 光传感器模块包括光波导单元和安装有光学元件并耦合到光波导单元的板单元。 光波导单元包括沿着上包层的一个侧边缘轴向延伸的单个边缘延伸部分，设置在单个边缘延伸部分中的基板单元接合槽，以及设置在垂直槽的侧壁上并保持的突起 与基板单元的接合部抵接。 板单元包括装配在垂直槽中的接合部分，其垂直于垂直槽内的突起。

    Mounted structure of circuit board and multi-layer circuit board therefor
    7.
    发明授权
    Mounted structure of circuit board and multi-layer circuit board therefor 失效
    电路板和多层电路板的安装结构

    公开(公告)号：US06310391B1

    公开(公告)日：2001-10-30

    申请号：US09334631

    申请日：1999-06-17

    申请人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    发明人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    IPC分类号： H01L23053

    CPC分类号： H05K3/462 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

    摘要： The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.

    摘要翻译： 本发明提供了一种电路板的安装结构，其可以通过简单的方法制备，并且显示出来自芯片的良好散热并经受松弛的热应力，并且将多层电路板并入安装的结构中。 提供一种电路板的新型安装结构，其包括嵌入绝缘层中的芯材，所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层 箔，所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件，其特征在于，设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间，使得所述半导体元件和所述 芯材彼此连接。 电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。 在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。 芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。

    Printed circuit board and magnetic head driving device including the same
    9.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个