公开(公告)号：US20070160097A1

公开(公告)日：2007-07-12

申请号：US10580972

申请日：2004-11-24

申请人： Martin Behringer ,  Gerhard Herrmann ,  Stefan Morgott ,  Frank Mollmer

发明人： Martin Behringer ,  Gerhard Herrmann ,  Stefan Morgott ,  Frank Mollmer

IPC分类号： H01S3/10 ,  H01S3/04

CPC分类号： H01S5/02423 ,  H01L33/648 ,  H01S5/02272 ,  H01S5/06216 ,  H01S5/4025

摘要： A radiation-emitting optoelectronic component (1) which is connected to a heat sink (3) and is intended for pulsed operation with the pulse duration D, and in which temperature changes of the optoelectronic component (1) take place with a thermal time constant τ during pulsed operation. The thermal time constant τ is matched to the pulse duration D in order to reduce the amplitude of the temperature changes.

摘要翻译： 辐射发射光电子部件（1），其连接到散热器（3）并且用于脉冲持续时间D的脉冲操作，并且其中光电子部件（1）的温度变化发生在热时间常数 τ在脉冲操作期间。 热时间常数τ与脉冲持续时间D相匹配，以减小温度变化的幅度。

公开(公告)号：US20070040101A1

公开(公告)日：2007-02-22

申请号：US10573095

申请日：2004-08-24

申请人： Heinz Haas ,  Frank Mollmer ,  Michael Schwind

发明人： Heinz Haas ,  Frank Mollmer ,  Michael Schwind

IPC分类号： H01L31/00 ,  G01J3/50 ,  H01J5/16

CPC分类号： H01L31/02162 ,  H01L31/0304 ,  H01L33/44 ,  H01L2224/4847 ,  Y02E10/544

摘要： The invention concerns a radiation detector for detecting radiation having a defined spectral sensitivity distribution (14) that exhibits a sensitivity maximum at a defined wavelength λ0, wherein the radiation detector preferably contains a III-V semiconductor material and particularly preferably comprises at least one semiconductor chip (1) and at least one optical filter disposed after the semiconductor chip, the semiconductor chip containing at least one III-V semiconductor material and the optical filter absorbing radiation of a wavelength that is greater than the wavelength λ of the sensitivity maximum.

摘要翻译： 本发明涉及一种用于检测辐射的辐射检测器，其具有定义的光谱灵敏度分布（14），该分布灵敏度分布（14）在确定的波长λ0 <0>处表现出灵敏度最大值，其中辐射检测器优选地包含III-V半导体材料， 特别优选地包括至少一个半导体芯片（1）和设置在半导体芯片之后的至少一个滤光器，所述半导体芯片包含至少一个III-V半导体材料，并且所述滤光器吸收大于波长的波长的辐射 λ的灵敏度最大值。

公开(公告)号：US4622856A

公开(公告)日：1986-11-18

申请号：US614265

申请日：1984-05-25

申请人： Josef Binder ,  David Cutter ,  Wolfgang Henning ,  Hans-Christian Schaber ,  Frank Mollmer ,  Hansjorg Reichert

发明人： Josef Binder ,  David Cutter ,  Wolfgang Henning ,  Hans-Christian Schaber ,  Frank Mollmer ,  Hansjorg Reichert

IPC分类号： G01L1/22 ,  G01L9/00 ,  G01L9/06

CPC分类号： G01L1/2262 ,  G01L1/2293 ,  G01L9/0055 ,  Y10S73/04 ,  Y10T29/49004 ,  Y10T29/49103

摘要： Sensor with polycrystalline silicon resistors which are applied to a substrate and are covered with a dielectric passivating layer, characterized by the feature that the resistors are thermally adapted by targeted adjustment of their dopings and by suitable healing, and are balanced by laser trimming.

摘要翻译： 具有多晶硅电阻器的传感器，其被施加到衬底并被电介质钝化层覆盖，其特征在于，电阻器通过其掺杂的目标调整和适当的愈合热适应，并且通过激光修整来平衡。

公开(公告)号：US20080105886A1

公开(公告)日：2008-05-08

申请号：US11577526

申请日：2005-10-25

申请人： Mike Borner ,  Frank Mollmer

发明人： Mike Borner ,  Frank Mollmer

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component includes a component housing and a body comprising a carrier substrate and a radiation emitting layer sequence. In certain embodiments, the body is arranged in a reflector cup of the component housing and is electrically conductively connected to external electrical leads of the component housing. The component housing can also be further provided with a lens that produces a desired aperture angle for the radiation cone. Uses for the component are also described.

摘要翻译： 光电子部件包括部件壳体和包括载体基板和辐射发射层序列的主体。 在某些实施例中，主体被布置在部件壳体的反射杯中，并且电连接到部件壳体的外部电引线。 部件壳体还可以设置有为辐射锥体产生期望的孔径角度的透镜。 还描述了组件的用途。

公开(公告)号：US20070269927A1

公开(公告)日：2007-11-22

申请号：US11880717

申请日：2007-07-23

申请人： Thomas Hofer ,  Herbert Brunner ,  Frank Mollmer ,  Gunter Waitl ,  Rainer Sewald ,  Markus Zeiler

发明人： Thomas Hofer ,  Herbert Brunner ,  Frank Mollmer ,  Gunter Waitl ,  Rainer Sewald ,  Markus Zeiler

IPC分类号： H01L21/58 ,  B27N7/00

CPC分类号： H01L33/60 ,  B29C45/14639 ,  B29C45/1671 ,  B29C2045/0079 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

摘要翻译： 一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种 形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。 还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

公开(公告)号：US20050161813A1

公开(公告)日：2005-07-28

申请号：US11018548

申请日：2004-12-20

申请人： Wolfgang Pammer ,  Ulrich Steegmuller ,  Thomas Hofer ,  Frank Mollmer

发明人： Wolfgang Pammer ,  Ulrich Steegmuller ,  Thomas Hofer ,  Frank Mollmer

IPC分类号： H01L23/02 ,  H01L23/08 ,  H01L23/495 ,  H01L33/62 ,  H01S5/02 ,  H01S5/022 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L33/62 ,  H01L24/32 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/351 ,  H01S5/02216 ,  H01S5/02244 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/02492 ,  H01L2924/00

摘要： A radiation-emitting semiconductor component having a prefabricated composite having a leadframe (8) and a housing part (9), which is integrally formed onto the leadframe (8) and contains a plastic, and at least one semiconductor chip (1), which is fixed on the leadframe (8) of the composite with a hard solder connection (5). Furthermore, a method is disclosed for fixing semiconductor chips (1) with a hard solder on the chip mounting region (24) of a leadframe (23) with an integrally formed housing part (9) is specified.

摘要翻译： 一种辐射发射半导体部件，其具有一体地形成在引线框架（8）上并且包含塑料的引线框架（8）和壳体部分（9）的预制复合材料，以及至少一个半导体芯片（1），其中 通过硬焊料连接（5）固定在复合材料的引线框架（8）上。 此外，公开了一种用于将具有硬焊料的半导体芯片（1）固定在具有整体形成的壳体部件（9）的引线框架（23）的芯片安装区域（24）上的方法。