Architectural design for cash and liquidity management application software
    1.
    发明申请
    Architectural design for cash and liquidity management application software 审中-公开
    现金和流动性管理应用软件的建筑设计

    公开(公告)号:US20070156550A1

    公开(公告)日:2007-07-05

    申请号:US11322772

    申请日:2005-12-30

    IPC分类号: G06Q40/00

    摘要: Methods, systems, and apparatus, including computer program products, for implementing a software architecture design for a software application implementing cash and liquidity management useful to assure that an organization has sufficient liquidity to fulfill all outstanding debits in time. The application is structured as multiple process components interacting with each other through service interfaces, and multiple service interface operations, each being implemented for a respective process component. The process components include a Accounting process component, a Due Item Management process component, a Payment Processing process component, and a Cash Management process component.

    摘要翻译: 方法,系统和设备,包括计算机程序产品,用于实施实施现金流动性管理的软件应用程序的软件架构设计,有助于确保组织具有足够的流动性以及时完成所有未清借款。 该应用程序被构造为多个进程组件通过服务接口彼此交互,并且多个服务接口操作,每个被实现用于相应的进程组件。 流程组件包括会计流程组件,到期项目管理流程组件,支付处理流程组件和现金管理流程组件。

    Architectural design for manual invoicing application software
    4.
    发明授权
    Architectural design for manual invoicing application software 有权
    手工发票应用软件的建筑设计

    公开(公告)号:US08321308B2

    公开(公告)日:2012-11-27

    申请号:US12327354

    申请日:2008-12-03

    IPC分类号: G07B17/00

    摘要: Methods, systems, and apparatus, including computer program products, for implementing a software architecture design for a software application implementing manual invoicing. The application is structured as multiple process components interacting with each other through service interfaces, and multiple service operations, each being implemented for a respective process component. The process components include a Customer Invoice Processing process component, a Due Item Processing process component, a Payment Processing process component, an Accounting process component, a Project Processing process component, and a Balance of Foreign Payment Management process component.

    摘要翻译: 方法,系统和装置,包括计算机程序产品,用于实施用于实施手动发票的软件应用的软件架构设计。 应用程序被构造为通过服务接口彼此交互的多个进程组件,以及针对相应进程组件实现的多个服务操作。 过程组件包括客户发票处理过程组件,到期项目处理过程组件,支付处理过程组件,会计过程组件,项目处理过程组件和外部支付管理平衡流程组件。

    Representations of cash locations
    6.
    发明申请
    Representations of cash locations 审中-公开
    现金位置的代表

    公开(公告)号:US20070174156A1

    公开(公告)日:2007-07-26

    申请号:US11323955

    申请日:2005-12-30

    IPC分类号: G07F19/00 G07B17/00

    CPC分类号: G06Q40/02 G06Q40/12

    摘要: A cash management system includes a cash location business object, an owner business object associated with the cash location business object, and a provider business object associated with the cash location business object. The cash location business object further includes a plurality of attributes including a type of cash.

    摘要翻译: 现金管理系统包括现金定位业务对象,与现金位置业务对象相关联的所有者业务对象,以及与现金定位业务对象相关联的供应商业务对象。 现金定位业务对象还包括多种属性,包括一种现金。

    Enhancing strained device performance by use of multi narrow section layout
    9.
    发明申请
    Enhancing strained device performance by use of multi narrow section layout 有权
    通过使用多窄截面布局来增强设备的应变性能

    公开(公告)号:US20050221566A1

    公开(公告)日:2005-10-06

    申请号:US10815911

    申请日:2004-03-31

    摘要: A semiconductor device having high tensile stress. The semiconductor device comprises a substrate having a source region and a drain region. Each of the source region and the drain region includes a plurality of separated source sections and drain sections, respectively. A shallow trench isolation (STI) region is formed between two separated source sections of the source region and between two separated drain sections of the drain region. A gate stack is formed on the substrate. A tensile inducing layer is formed over the substrate. The tensile inducing layer covers the STI regions, the source region, the drain region, and the gate stack. The tensile inducing layer is an insulation capable of causing tensile stress in the substrate.

    摘要翻译: 具有高拉伸应力的半导体器件。 半导体器件包括具有源极区和漏极区的衬底。 源极区域和漏极区域中的每一个分别包括多个分离的源极部分和漏极部分。 在源极区的两个分离的源极部分和漏极区域的两个分离的漏极部分之间形成浅沟槽隔离(STI)区域。 在基板上形成栅叠层。 在衬底上形成拉伸诱导层。 拉伸感应层覆盖STI区域,源极区域,漏极区域和栅极叠层。 拉伸诱导层是能够在基板中引起拉伸应力的绝缘体。