Ge-based semiconductor structure fabricated using a non-oxygen chalcogen passivation step
    1.
    发明申请
    Ge-based semiconductor structure fabricated using a non-oxygen chalcogen passivation step 失效
    使用非氧硫族元素钝化步骤制造的基于Ge的半导体结构

    公开(公告)号:US20070093074A1

    公开(公告)日:2007-04-26

    申请号:US11259165

    申请日:2005-10-26

    IPC分类号: H01L21/31

    摘要: A method and structure in which Ge-based semiconductor devices such as FETs and MOS capacitors can be obtained are provided. Specifically, the present invention provides a method of forming a semiconductor device including a stack including a dielectric layer and a conductive material located on and/or within a Ge-containing material (layer or wafer) in which the surface thereof is non-oxygen chalcogen rich. By providing a non-oxygen chalcogen rich interface, the formation of undesirable interfacial compounds during and after dielectric growth is suppressed and interfacial traps are reduced in density.

    摘要翻译: 提供了可以获得诸如FET和MOS电容器的Ge基半导体器件的方法和结构。 具体地说,本发明提供了一种形成半导体器件的方法,该半导体器件包括一个包含电介质层和导电材料的叠层,该叠层位于其表面为非氧硫属元素的含Ge材料(层或晶片)之上和/或之内 丰富。 通过提供非氧贫硫族元素界面,抑制了电介质生长期间和之后不期望的界面化合物的形成,并且界面陷阱的密度降低。

    Si/SiGe optoelectronic integrated circuits
    6.
    发明申请
    Si/SiGe optoelectronic integrated circuits 有权
    Si / SiGe光电集成电路

    公开(公告)号:US20050023554A1

    公开(公告)日:2005-02-03

    申请号:US10883434

    申请日:2004-07-01

    摘要: An integrated optoelectronic circuit and process for making is described incorporating a photodetector and a MODFET on a chip. The chip contains a single-crystal semiconductor substrate, a buffer layer of SiGe graded in composition, a relaxed SiGe layer, a quantum well layer, an undoped SiGe spacer layer and a doped SiGe supply layer. The photodetector may be a metal-semiconductor-metal (MSM) or a p-i-n device. The detector may be integrated with an n- or p-type MODFET, or both in a CMOS configuration, and the MODFET can incorporate a Schottky or insulating gate. The invention overcomes the problem of producing Si-manufacturing-compatible monolithic high-speed optoelectronic circuits for 850 nm operation by using epixially-grown Si/SiGe heterostructure layers.

    摘要翻译: 描述了一种集成的光电子电路和制造工艺,其中结合了光电探测器和芯片上的MODFET。 该芯片包含单晶半导体衬底,组成SiGe缓冲层,弛豫SiGe层,量子阱层,未掺杂的SiGe间隔层和掺杂的SiGe供应层。 光电检测器可以是金属 - 半导体 - 金属(MSM)或p-i-n器件。 检测器可以与n型或p型MODFET集成,或者以CMOS配置集成,并且该MODFET可以并入肖特基或绝缘栅。 本发明克服了通过使用表面生长的Si / SiGe异质结构层制造用于850nm工作的Si制造兼容的单片高速光电子电路的问题。

    Structure for use in fabrication of PiN heterojunction TFET
    7.
    发明授权
    Structure for use in fabrication of PiN heterojunction TFET 有权
    用于制造PiN异质结TFET的结构

    公开(公告)号:US08263477B2

    公开(公告)日:2012-09-11

    申请号:US12684331

    申请日:2010-01-08

    摘要: A method for fabricating a structure for use in fabrication of a PiN heterojunction tunnel field effect transistor (TFET) includes forming an alignment trench in a silicon wafer; forming a silicon germanium (SiGe) growth trench in the silicon wafer; growing a p-type SiGe region in the SiGe growth trench; forming a first oxide layer over the alignment trench and the p-type SiGe region; forming a hydrogen implantation region in the silicon wafer, the hydrogen implantation region dividing the silicon wafer into a upper silicon region and a lower silicon region; bonding the first oxide layer to a second oxide layer located on a handle wafer, forming a bonded oxide layer comprising the first oxide layer and the second oxide layer; and separating the lower silicon region from the upper silicon region at the hydrogen implantation region.

    摘要翻译: 制造用于制造PiN异质结隧道场效应晶体管(TFET)的结构的方法包括在硅晶片中形成取向沟槽; 在硅晶片中形成硅锗(SiGe)生长沟槽; 在SiGe生长沟槽中生长p型SiGe区域; 在对准沟槽和p型SiGe区域上形成第一氧化物层; 在所述硅晶片中形成氢注入区域,所述氢注入区域将所述硅晶片分成上硅区和下硅区; 将第一氧化物层接合到位于处理晶片上的第二氧化物层,形成包含第一氧化物层和第二氧化物层的键合氧化物层; 以及在所述氢注入区域处从所述上硅区域分离所述下硅区域。

    FET RADIATION MONITOR
    8.
    发明申请
    FET RADIATION MONITOR 有权
    FET辐射监测器

    公开(公告)号:US20110220805A1

    公开(公告)日:2011-09-15

    申请号:US12719962

    申请日:2010-03-09

    IPC分类号: G01T1/24 H01L31/08

    CPC分类号: H01L31/119

    摘要: A semiconductor device includes a semiconductor substrate; a buried insulator layer disposed on the semiconductor substrate, the buried insulator layer configured to retain an amount of charge in a plurality of charge traps in response to a radiation exposure by the semiconductor device; a semiconductor layer disposed on the buried insulating layer; a second insulator layer disposed on the semiconductor layer; a gate conducting layer disposed on the second insulator layer; and one or more side contacts electrically connected to the semiconductor layer. A method for radiation monitoring, the method includes applying a backgate voltage to a radiation monitor, the radiation monitor comprising a field effect transistor (FET); exposing the radiation monitor to radiation; determining a change in a threshold voltage of the radiation monitor; and determining an amount of radiation exposure based on the change in threshold voltage.

    摘要翻译: 半导体器件包括半导体衬底; 设置在所述半导体衬底上的掩埋绝缘体层,所述掩埋绝缘体层被配置为响应于所述半导体器件的辐射暴露而将多个电荷量保持在多个电荷阱中; 设置在所述掩埋绝缘层上的半导体层; 设置在所述半导体层上的第二绝缘体层; 设置在所述第二绝缘体层上的栅极导电层; 以及与半导体层电连接的一个或多个侧触点。 一种用于辐射监测的方法,所述方法包括将背栅电压施加到辐射监测器,所述辐射监测器包括场效应晶体管(FET); 将辐射监测仪暴露于辐射; 确定辐射监测器的阈值电压的变化; 以及基于阈值电压的变化确定辐射暴露量。

    Structure for Use in Fabrication of PiN Heterojunction TFET
    9.
    发明申请
    Structure for Use in Fabrication of PiN Heterojunction TFET 有权
    用于制造PiN异质结TFET的结构

    公开(公告)号:US20110169051A1

    公开(公告)日:2011-07-14

    申请号:US12684331

    申请日:2010-01-08

    摘要: A method for fabricating a structure for use in fabrication of a PiN heterojunction tunnel field effect transistor (TFET) includes forming an alignment trench in a silicon wafer; forming a silicon germanium (SiGe) growth trench in the silicon wafer; growing a p-type SiGe region in the SiGe growth trench; forming a first oxide layer over the alignment trench and the p-type SiGe region; forming a hydrogen implantation region in the silicon wafer, the hydrogen implantation region dividing the silicon wafer into a upper silicon region and a lower silicon region; bonding the first oxide layer to a second oxide layer located on a handle wafer, forming a bonded oxide layer comprising the first oxide layer and the second oxide layer; and separating the lower silicon region from the upper silicon region at the hydrogen implantation region.

    摘要翻译: 制造用于制造PiN异质结隧道场效应晶体管(TFET)的结构的方法包括在硅晶片中形成取向沟槽; 在硅晶片中形成硅锗(SiGe)生长沟槽; 在SiGe生长沟槽中生长p型SiGe区域; 在对准沟槽和p型SiGe区域上形成第一氧化物层; 在所述硅晶片中形成氢注入区域,所述氢注入区域将所述硅晶片分成上硅区和下硅区; 将第一氧化物层接合到位于处理晶片上的第二氧化物层,形成包含第一氧化物层和第二氧化物层的键合氧化物层; 以及在所述氢注入区域处从所述上硅区域分离所述下硅区域。