摘要:
In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell.
摘要:
In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell.
摘要:
In various exemplary embodiments, a solar cell is provided, including a layer structure having at least one photovoltaic layer; and a plurality of contact wires running on the surface of the layer structure. The contact wires are wire-bonded radially with respect to their axis onto the surface of the layer structure.
摘要:
In various embodiments, a solar cell is provided. The solar cell may include a base region doped with dopant of a first doping type; an emitter region doped with dopant of a second doping type, wherein the second doping type is opposite to the first doping type; a plurality of regions in the emitter region having an increased dopant concentration of the second doping type compared with the emitter region; and a plurality of metallic soldering pads, wherein each soldering pad is at least partially arranged on a region having an increased dopant concentration.
摘要:
An apparatus for coating a substrate with a layer of inhomogeneous but continuous thickness is provided. The apparatus may include a holding device configured to hold a substrate to be coated; a coating device comprising at least one coating source for providing a coating material, which is arranged at a distance from the holding device; and at least one magnetizing device configured to generate a predetermined magnetic field in the region between the substrate to be coated and the coating source. The magnetizing device may be arranged on the opposite side of the holding device to the coating source.
摘要:
A semiconductor component, especially in the form of a solar cell, comprises a semiconductor substrate of a planar design having a first side, a second side lying opposite thereto and a surface normal standing vertically on sides and, at least one dielectric passivation layer arranged on the second side, at least one electrically conductive contact layer arranged on the passivation layer, a well solderable cover layer arranged on the contact layer and an adhesive layer arranged between the cover layer and the contact layer.
摘要:
A semiconductor component, in particular in the form of a solar cell, comprises a two-dimensional semiconductor substrate with a first side, a second side which is arranged opposite thereto, a surface normal which is perpendicular to said first and second sides, and a plurality of recesses which are at least arranged on the second side and extend in the direction of the surface normal, at least one dielectric passivation layer which is arranged on the second side, an electrically conducting contact layer arranged on the passivation layer, a plurality of contact elements for electrically connecting the contact layer with the semiconductor substrate, which contact elements are electrically conductive, are in electrically conducting connection with both the semiconductor substrate and with the contact layer, fill at least 50%, in particular at least 90%, preferably 100% of in each case one of the recesses, project beyond the recesses with a projection in the direction perpendicular to the surface normal and are of an easily solderable material.
摘要:
A semiconductor component comprising a substrate with a first side and a second side a multi-layer contact structure arranged on at least one side of the substrate, the contact structure exhibiting a barrier layer to prevent the diffusion of ions from the side of barrier layer opposite to the substrate into the substrate.
摘要:
A method for producing a semiconductor component with an easily solderable contact structure comprising the provision of a semiconductor substrate of a planar design with a first side, a second side, a surface normal standing vertically thereon, a dielectric passivation layer arranged on at least one of the sides and a first contact layer arranged on passivation layer, the application, at least in some areas, of at least one second contact layer onto the first contact layer, the at least one second contact layer comprising at least a partial layer made of an easily solderable metal, especially of nickel and/or silver and/or tin and/or a compound thereof, and the making of an electrically conductive contact between the second contact layer and the semiconductor substrate.
摘要:
A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.