摘要:
A device serves for reflecting electromagnetic waves, in particular in a length range less than 200 nm. It has a mirror carrier made of a material with at least approximately vanishing thermal expansion and at least one reflective layer applied on said mirror carrier. An intermediate layer made of a material which is formed such that its surface roughness is not significantly increased after beam processing methods is fitted between the mirror carrier and the reflective layer.
摘要:
A method of manufacturing an optical element having an optical surface extending close to a periphery of a substrate comprises: providing a substrate having a main surface extending beyond a periphery of the optical surface and also performing a polishing of the optical surface in regions of the main surface extending beyond the optical surface. Thereafter, material of the substrate carrying a portion of the surface extending beyond the optical surface is removed.
摘要:
A mirror for use in a projection exposure apparatus is described. The mirror has a main surface extending beyond an outline of an optical surface of the main surface. The optical surface has a roughness of less than 1 nm rms, and the outline of the optical surface includes a portion where the main surface extends beyond the optical surface by less than 0.2 mm. Manufacturing the mirror may involve polishing the optical surface in regions of the main surface extending beyond the optical surface and removing material of the substrate carrying a portion of the surface extending beyond the optical surface.
摘要:
There is provided a substrate material for an optical component for X-rays of wavelength λR. The substrate includes (a) a glass phase made of amorphous material having a positive coefficient of thermal expansion, and (b) a crystal phase including microcrystallites having a negative coefficient of thermal expansion and a mean size of less than about 4 λR. The substrate material has a stoichiometric ratio of the crystal phase to the glass phase such that a coefficient of thermal expansion of the substrate material is less than about 5×10−6 K−1 in a temperature range of about 20 °C. to 100°C. The substrate material, following a surface treatment, has a high spatial frequency roughness (HSFR) of less than about λR/30 rms.
摘要翻译:提供了用于波长λλX的X射线的光学部件的基板材料。 该基板包括(a)由具有正的热膨胀系数的非晶材料制成的玻璃相,和(b)包含具有负的热膨胀系数和平均尺寸小于约4λλ的微晶的结晶相, R SUB>。 衬底材料具有晶相与玻璃相的化学计量比,使得衬底材料的热膨胀系数小于约5×10 -6 K -1 在约20℃的温度范围内。 至100℃。 在表面处理之后,衬底材料具有小于约λ/ 30 / 30rms的高空间频率粗糙度(HSFR)。
摘要:
Solder compositions are described that include at least about 2% of silver, at least about 60% of bismuth, and at least one coupling element, wherein the at least one coupling element forms a complex with bismuth. Layered materials are also described that include a surface or substrate; an electrical interconnect; the solder composition described herein; and a semiconductor die or package. Methods of producing a solder composition are also described that include: a) providing at least about 2% of silver, b) providing at least about 60% of bismuth, c) providing at least one coupling element, wherein the at least one coupling element forms a complex with bismuth, and d) blending the silver, bismuth and at least one coupling element to form the solder composition.
摘要:
By using a packer which is pushed as far over an anchor as the intended length of the moulding, the cavity in a borehole in the region of the bond can be completely filled with a reactive resin. Overhead work is possible even with slowly reacting resins. By using a catalyst on the packer, the reactive resin injected into the borehole behind the packer can be made to harden very rapidly.
摘要:
By using a packer which is pushed as far over an anchor as the intended length of the moulding, the cavity in a borehole in the region of the bond can be completely filled with a reactive resin. Overhead work is possible even with slowly reacting resins. By using a catalyst on the packer, the reactive resin injected into the borehole behind the packer can be made to harden very rapidly.
摘要:
A method for operating a data receiver for audio and/or video data, wherein a planned and variable program title sequence having program titles is recorded, audio and/or video data relating to at least one program title are received via a data link and are buffered, and audio and/or video data of at least one program title are reproduced. The transmission resources of the data link for audio and/or video data to be transmitted and to be buffered are distributed over at least two program titles that have not yet been reproduced by the data receiver. Also disclosed are a data receiver associated with the method and a media reproduction system connected thereto, in particular in a vehicle.
摘要:
A method for removing at least one reflective layer (4a, 4b) from an optical element (1) for EUV lithography, wherein the optical element (1) has a substrate (2) and an interlayer (6) between the substrate (2) and the at least one reflective layer (4a, 4b). The method includes etching away the at least one reflective layer (4a, 4b) as far as the interlayer (6) with an etching gas (7), wherein the material of the interlayer (6) does not react with the etching gas (7), and wherein, after the etching away, the interlayer (6) has a surface roughness of less than 0.5 nm rms, preferably of less than 0.2 nm rms, and more preferably of less than 0.1 nm rms. Also, an optical element (1) for reflecting radiation in the EUV wavelength range includes a substrate (2), at least one reflective layer (4a, 4b), and an interlayer (6) arranged between the substrate (2) and the at least one reflective layer (4a, 4b). The interlayer (6) is composed at least partly of a material which does not react with a halogen or a halogen compound as etching gas (7) and which is selected, in particular, from one or more of the following: alkali metal halides, alkaline earth metal halides and aluminum oxide (Al2O3). The interlayer (6) has a surface roughness of less than 0.5 nm rms, preferably of less than 0.2 nm rms, and more preferably of less than 0.1 nm rms.
摘要:
The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.