公开(公告)号：US07365441B2

公开(公告)日：2008-04-29

申请号：US11362783

申请日：2006-02-28

申请人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.

摘要翻译： 一种半导体器件制造方法，包括在粘合片50所包含的粘合剂层上形成多个单独的导电焊盘20的基板形成工序，以及半导体芯片安装工序，将半导体芯片与未设置的表面接合， 任何电极与粘合片50接触，并且用导线30将形成在半导体芯片10上的电极11和导电焊盘20的上部电连接。 将半导体芯片10，导线30和导电焊盘20密封在密封树脂模制件40中，然后将粘合片50与密封树脂模制件40分离。 每个导电焊盘20具有缩小部分20b，以及从缩小部分20b突出的突出部分20a。 具有这种结构的导电垫20可以牢固地结合到密封树脂模制件40上。

公开(公告)号：US20060145363A1

公开(公告)日：2006-07-06

申请号：US11362783

申请日：2006-02-28

申请人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/28 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.

摘要翻译： 一种半导体器件制造方法，包括在粘合片50所包含的粘合剂层上形成多个单独的导电焊盘20的基板形成工序，以及半导体芯片安装工序，将半导体芯片与未设置的表面接合在粘合片50上 任何电极与粘合片50接触，并且用导线30将形成在半导体芯片10上的电极11和导电焊盘20的上部电连接。 将半导体芯片10，导线30和导电焊盘20密封在密封树脂模制件40中，然后将粘合片50与密封树脂模制件40分离。 每个导电焊盘20具有缩小部分20b，以及从缩小部分20b突出的突出部分20a。 具有这种结构的导电垫20可以牢固地结合到密封树脂模制件40上。

公开(公告)号：US20080251902A1

公开(公告)日：2008-10-16

申请号：US12213277

申请日：2008-06-17

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L23/28 ,  H01L21/48

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor device provided with terminal pads connected to the inner terminals with bond wires; and a resin molding sealing the terminal members, the semiconductor device and the bond wires therein. The inner terminals of the terminal members are thinner than the outer terminals and have contact surfaces. The upper, the lower and the outer side surfaces of the outer terminals, and the lower surfaces of the semiconductor device are exposed outside. The inner terminals, the bond wires, the semiconductor device and the resin molding are included in the thickness of the outer terminals.

摘要翻译： 塑料包装件包括多个端子构件，每个端子构件具有外端子，内端子和连接外端子和内端子的连接部件; 半导体器件，其具有用接合线连接到内部端子的端子焊盘; 以及密封端子部件，半导体器件和接合线的树脂成型体。 端子构件的内部端子比外部端子薄，并且具有接触表面。 外部端子的上部，下部和外侧表面以及半导体器件的下表面暴露在外部。 内端子，接合线，半导体器件和树脂模制件包括在外端子的厚度中。

公开(公告)号：US20100276806A1

公开(公告)日：2010-11-04

申请号：US12801896

申请日：2010-06-30

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L23/532

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor device provided with terminal pads connected to the inner terminals with bond wires; and a resin molding sealing the terminal members, the semiconductor device and the bond wires therein. The inner terminals of the terminal members are thinner than the outer terminals and have contact surfaces. The upper, the lower and the outer side surfaces of the outer terminals, and the lower surfaces of the semiconductor device are exposed outside. The inner terminals, the bond wires, the semiconductor device and the resin molding are included in the thickness of the outer terminals.

摘要翻译： 塑料包装件包括多个端子构件，每个端子构件具有外端子，内端子和连接外端子和内端子的连接部件; 半导体器件，其具有用接合线连接到内部端子的端子焊盘; 以及密封端子部件，半导体器件和接合线的树脂成型体。 端子构件的内部端子比外部端子薄，并且具有接触表面。 外部端子的上部，下部和外侧表面以及半导体器件的下表面暴露在外部。 内端子，接合线，半导体器件和树脂模制件包括在外端子的厚度中。

公开(公告)号：US07271471B2

公开(公告)日：2007-09-18

申请号：US11086238

申请日：2005-03-23

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L23/495 ,  H01L21/00 ,  H05K7/18

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A metal substrate apparatus comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus comprises a thin metal strip of processing material, and each metal substrate has connecting parts. Each metal substrate has a die pad for loading an IC chip. Antenna terminals to connect antenna coils are located outside the die pad and a resin-sealed region. The antenna terminals of one metal substrate and those of a longitudinally adjacent metal substrate overlap a shared region of the processing material in a width direction. The metal substrates can be separated by sealing and then making longitudinal cuts on the processing material on the outer parts of the metal substrates along two connecting lines.

摘要翻译： 金属基板装置包括形成用于制造转印模型型非接触式IC卡的IC卡模块的多个金属基板。 金属基板装置包括处理材料的薄金属带，每个金属基板具有连接部分。 每个金属基板具有用于加载IC芯片的管芯焊盘。 用于连接天线线圈的天线端子位于管芯焊盘的外部和树脂密封区域。 一个金属基板的天线端子和纵向相邻的金属基板的天线端子在宽度方向上与处理材料的共享区域重叠。 可以通过密封分离金属基板，然后沿着两条连接线在金属基板的外部部分上的处理材料上进行纵向切割。

公开(公告)号：US07851902B2

公开(公告)日：2010-12-14

申请号：US12302113

申请日：2007-06-22

申请人： Masachika Masuda ,  Chikao Ikenaga ,  Koji Tomita

发明人： Masachika Masuda ,  Chikao Ikenaga ,  Koji Tomita

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.

摘要翻译： 本发明提供了一种树脂密封半导体器件，其包括半导体元件; 多个端子构件，每个端子构件围绕半导体元件并且包括外部端子部分，内部端子部分和连接部分; 每个将所述半导体元件与所述内部端子部分连接的接合线; 以及密封半导体元件，端子构件和接合线的树脂密封部。 每个端子构件由形成内部端子部分的内部变薄部分和形成外部端子部分的外部加厚部分组成。 每个内部端子部分的后表面以及每个外部端子部分的前表面，后表面和外侧面分别从树脂密封部分暴露于外部。

公开(公告)号：US20090140411A1

公开(公告)日：2009-06-04

申请号：US12302113

申请日：2007-06-22

申请人： Masachika Masuda ,  Chikao Ikenaga ,  Koji Tomita

发明人： Masachika Masuda ,  Chikao Ikenaga ,  Koji Tomita

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.

摘要翻译： 本发明提供了一种树脂密封半导体器件，其包括半导体元件; 多个端子构件，每个端子构件围绕半导体元件并且包括外部端子部分，内部端子部分和连接部分; 每个将所述半导体元件与所述内部端子部分连接的接合线; 以及密封半导体元件，端子构件和接合线的树脂密封部。 每个端子构件由形成内部端子部分的内部变薄部分和形成外部端子部分的外部加厚部分组成。 每个内部端子部分的后表面以及每个外部端子部分的前表面，后表面和外侧面分别从树脂密封部分暴露于外部。

公开(公告)号：US07405468B2

公开(公告)日：2008-07-29

申请号：US10821173

申请日：2004-04-09

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L23/495

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor device provided with terminal pads connected to the inner terminals with bond wires; and a resin molding sealing the terminal members, the semiconductor device and the bond wires therein. The inner terminals of the terminal members are thinner than the outer terminals and have contact surfaces. The upper, the lower and the outer side surfaces of the outer terminals, and the lower surfaces of the semiconductor device are exposed outside. The inner terminals, the bond wires, the semiconductor device and the resin molding are included in the thickness of the outer terminals.

公开(公告)号：US07064011B2

公开(公告)日：2006-06-20

申请号：US10781947

申请日：2004-02-20

申请人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  You Shimazaki ,  Masachika Masuda ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L21/44 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.

公开(公告)号：US20050275071A1

公开(公告)日：2005-12-15

申请号：US11086238

申请日：2005-03-23

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A metal substrate apparatus comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus comprises a thin metal strip of processing material, and each metal substrate has connecting parts. Each metal substrate has a die pad for loading an IC chip. Antenna terminals to connect antenna coils are located outside the die pad and a resin-sealed region. The antenna terminals of one metal substrate and those of a longitudinally adjacent metal substrate overlap a shared region of the processing material in a width direction. The metal substrates can be separated by sealing and then making longitudinal cuts on the processing material on the outer parts of the metal substrates along two connecting lines.

摘要翻译： 金属基板装置包括形成用于制造转印模型型非接触式IC卡的IC卡模块的多个金属基板。 金属基板装置包括处理材料的薄金属带，每个金属基板具有连接部分。 每个金属基板具有用于加载IC芯片的管芯焊盘。 用于连接天线线圈的天线端子位于管芯焊盘的外部和树脂密封区域。 一个金属基板的天线端子和纵向相邻的金属基板的天线端子在宽度方向上与处理材料的共享区域重叠。 可以通过密封分离金属基板，然后沿着两条连接线在金属基板的外部部分上的处理材料上进行纵向切割。