公开(公告)号：US06433421B1

公开(公告)日：2002-08-13

申请号：US09826965

申请日：2001-04-06

申请人： Masachika Masuda ,  Tamaki Wada ,  Hirotaka Nishizawa ,  Koich Iro Kagaya

发明人： Masachika Masuda ,  Tamaki Wada ,  Hirotaka Nishizawa ,  Koich Iro Kagaya

IPC分类号： H01L2334

摘要： A semiconductor device comprising: a resin sealing body, plural semiconductor chips situated inside the resin sealing body and formed of rectangular-shaped plane surfaces, having a first main surface and second main surface facing each other, and having electrodes disposed on the first side of a first side and a second side of the first main surface, the first side and second side facing each other, and leads having inner parts situated inside the resin sealing body and outer parts situated outside the resin sealing body, the inner parts being electrically connected to the electrodes of the plural semiconductor chips via bonding wires, wherein: the first main surfaces are aligned in the same direction with their respective first sides situated on the same side, and the plural semiconductor chips are laminated in positions offset with respect to one another such that the electrodes of one of the mutually opposite semiconductor chips are situated further outside than the first sides of the other semiconductor chips.

公开(公告)号：US07233058B2

公开(公告)日：2007-06-19

申请号：US11203969

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US07012321B2

公开(公告)日：2006-03-14

申请号：US10377713

申请日：2003-03-04

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01R43/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US20050184380A1

公开(公告)日：2005-08-25

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

公开(公告)号：US07271475B2

公开(公告)日：2007-09-18

申请号：US11431074

申请日：2006-05-10

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  G06F1/16 ,  H01R24/00

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为一体的单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US06501173B2

公开(公告)日：2002-12-31

申请号：US09797719

申请日：2001-03-05

申请人： Hirotaka Nishizawa ,  Masachika Masuda ,  Kouichi Kanemoto ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Masachika Masuda ,  Kouichi Kanemoto ,  Tamaki Wada

IPC分类号： H01L2334

CPC分类号： H01L24/49 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip mounting method is proposed which considers facilitating the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also considers its application to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.

摘要翻译： 提出了当多个半导体芯片被密封在单个树脂密封体中时考虑促进半导体芯片的测试的芯片安装方法。 该方法还考虑其应用于各种MCP和系统LSI。 在单个封装中，第一半导体芯片的一个信号输出端子和半导体器件的第一外部端子独立地内部连接。 第二半导体芯片的一个信号输入端子和半导体器件的第二外部端子独立地内部连接。 半导体器件的第一和第二外部端子连接在半导体器件外部，以完成信号输出端子与信号输入端子之间的连接。

公开(公告)号：US06252299B1

公开(公告)日：2001-06-26

申请号：US09161725

申请日：1998-09-29

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L2328

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

摘要翻译： 一种半导体器件，包括树脂模具，位于树脂模具内部的两个半导体芯片，具有形成在前表面上的前后表面和外部端子以及从树脂模具的内部延伸到外部的引线，其中每个所述引线 至少在树脂模具中分支成两个分支引线，一个分支引线固定到一个半导体芯片的表面，并通过导线与表面上的外部端子电连接，另一个分支引线被固定到 另一个半导体芯片的表面，并通过导线与表面上的外部端子电连接，并且两个半导体芯片彼此堆叠，并且它们的背面彼此相对。

公开(公告)号：US07239011B2

公开(公告)日：2007-07-03

申请号：US11204047

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US07227251B2

公开(公告)日：2007-06-05

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： H01L23/02 ,  H01L23/48 ,  G11C8/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

摘要翻译： 半导体器件通过层叠两个半导体芯片与其背面面对面设置而形成。 每个半导体芯片设置有用于时钟使能的外部引线，时钟使能信号和芯片选择信号被单独地输入。 在访问一个半导体芯片的情况下，通过将时钟使能信号和芯片选择信号设置为非活动状态，将另一个半导体芯片设置为低功耗模式。

公开(公告)号：US20060220204A1

公开(公告)日：2006-10-05

申请号：US11431074

申请日：2006-05-10

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。