公开(公告)号：US20130277684A1

公开(公告)日：2013-10-24

申请号：US13977456

申请日：2011-12-21

申请人： Masahiro Araki ,  Shinya Yoshida ,  Haruhisa Takiguchi ,  Atsushi Ogawa ,  Takao Kinoshita ,  Tohru Murata ,  Takeshi Funaki ,  Masayuki Hoteida

发明人： Masahiro Araki ,  Shinya Yoshida ,  Haruhisa Takiguchi ,  Atsushi Ogawa ,  Takao Kinoshita ,  Tohru Murata ,  Takeshi Funaki ,  Masayuki Hoteida

IPC分类号： H01L29/20 ,  H01L21/02

CPC分类号： H01L29/2003 ,  H01L21/0242 ,  H01L21/0243 ,  H01L21/02458 ,  H01L21/02494 ,  H01L21/02502 ,  H01L21/02516 ,  H01L21/0254 ,  H01L21/0262 ,  H01L29/812 ,  H01L33/007 ,  H01L33/12 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A nitride semiconductor structure in which a first nitride semiconductor underlying layer is provided on a substrate having a recess portion and a projection portion provided between the recess portions at a surface thereof, the first nitride semiconductor underlying layer has at least 6 first oblique facet planes surrounding the projection portion on an outer side of the projection portion, and a second nitride semiconductor underlying layer buries the first oblique facet planes, a nitride semiconductor light emitting element, a nitride semiconductor transistor element, a method of manufacturing a nitride semiconductor structure, and a method of manufacturing a nitride semiconductor element are provided.

摘要翻译： 一种氮化物半导体结构，其中在具有凹部的基板上设置有第一氮化物半导体下层，在其表面设置有位于所述凹部之间的突出部，所述第一氮化物半导体下层具有至少6个第一倾斜面平面， 突出部分的外侧的突出部分和第二氮化物半导体下层掩埋第一倾斜面面，氮化物半导体发光元件，氮化物半导体晶体管元件，氮化物半导体结构的制造方法和 提供了制造氮化物半导体元件的方法。

公开(公告)号：US08963165B2

公开(公告)日：2015-02-24

申请号：US13977456

申请日：2011-12-21

申请人： Masahiro Araki ,  Shinya Yoshida ,  Haruhisa Takiguchi ,  Atsushi Ogawa ,  Takao Kinoshita ,  Tohru Murata ,  Takeshi Funaki ,  Masayuki Hoteida

发明人： Masahiro Araki ,  Shinya Yoshida ,  Haruhisa Takiguchi ,  Atsushi Ogawa ,  Takao Kinoshita ,  Tohru Murata ,  Takeshi Funaki ,  Masayuki Hoteida

IPC分类号： H01L33/00 ,  H01L29/20 ,  H01L21/02 ,  H01L33/12 ,  H01L29/812

CPC分类号： H01L29/2003 ,  H01L21/0242 ,  H01L21/0243 ,  H01L21/02458 ,  H01L21/02494 ,  H01L21/02502 ,  H01L21/02516 ,  H01L21/0254 ,  H01L21/0262 ,  H01L29/812 ,  H01L33/007 ,  H01L33/12 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A nitride semiconductor structure in which a first nitride semiconductor underlying layer is provided on a substrate having a recess portion and a projection portion provided between the recess portions at a surface thereof, the first nitride semiconductor underlying layer has at least 6 first oblique facet planes surrounding the projection portion on an outer side of the projection portion, and a second nitride semiconductor underlying layer buries the first oblique facet planes, a nitride semiconductor light emitting element, a nitride semiconductor transistor element, a method of manufacturing a nitride semiconductor structure, and a method of manufacturing a nitride semiconductor element are provided.

摘要翻译： 一种氮化物半导体结构，其中在具有凹部的基板上设置有第一氮化物半导体下层，在其表面设置有位于所述凹部之间的突出部，所述第一氮化物半导体下层具有至少6个第一倾斜面平面， 突出部分的外侧的突出部分和第二氮化物半导体下层掩埋第一倾斜面面，氮化物半导体发光元件，氮化物半导体晶体管元件，氮化物半导体结构的制造方法和 提供了制造氮化物半导体元件的方法。

公开(公告)号：US20100203228A1

公开(公告)日：2010-08-12

申请号：US12733324

申请日：2008-08-28

申请人： Takeshi Funaki ,  Tatsumori Yoshida

发明人： Takeshi Funaki ,  Tatsumori Yoshida

IPC分类号： B05D7/24 ,  C08L29/04

CPC分类号： A61K9/2893 ,  A61K9/284 ,  A61K9/2846

摘要： The present invention relates to a method for production of a coated preparation, characterized by coating a core material with a coating solution, the core material comprising an active ingredient, the coating solution comprising a) a resin composition obtained by copolymerization of polyvinyl alcohol having an average polymerization degree of 1300 or less, and at least one polymerizable vinyl monomer in a weight ratio of 6:4 to 9:1, b) water, and c) an organic solvent. The method for production make it feasible to efficiently coat a preparation such as a tablet, a granule, and a fine granule, etc. (a pharmaceutical drug, an animal drug, an agricultural chemicals, a fertilizer, or a food product) with the coating solution comprising a) the composition comprising the polyvinyl alcohol copolymer as the main component, b) water, and c) the organic solvent.

摘要翻译： 本发明涉及一种制备涂层制剂的方法，其特征在于用涂覆溶液涂覆芯材料，该芯材料包含活性成分，该涂层溶液包含a）一种树脂组合物，该树脂组合物通过聚 平均聚合度为1300以下，以及至少一种重量比为6：4〜9：1的可聚合乙烯基单体，b）水，和c）有机溶剂。 制造方法使得可以有效地涂布诸如片剂，颗粒剂和细颗粒剂等的制剂（药物，动物药物，农药，肥料或食品）与 包括a）包含聚乙烯醇共聚物作为主要组分的组合物，b）水，和c）有机溶剂。

公开(公告)号：US20060223399A1

公开(公告)日：2006-10-05

申请号：US11367484

申请日：2006-03-06

申请人： Hidekazu Kurimoto ,  Hidenori Hayashi ,  Takayuki Mohri ,  Takeshi Funaki ,  Yukio Imokawa

发明人： Hidekazu Kurimoto ,  Hidenori Hayashi ,  Takayuki Mohri ,  Takeshi Funaki ,  Yukio Imokawa

IPC分类号： B32B27/02

CPC分类号： B32B25/10 ,  B32B1/08 ,  B32B5/02 ,  B32B5/024 ,  B32B7/12 ,  B32B25/16 ,  B32B25/18 ,  B32B2250/40 ,  B32B2250/42 ,  B32B2262/0223 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/04 ,  B32B2307/5825 ,  B32B2413/00 ,  B32B2433/00 ,  B32B2597/00 ,  B32B2605/08 ,  B60C1/00 ,  B60C9/11 ,  F16L11/086 ,  Y10T442/2861

摘要： The present invention provides a rubber product with a fiber reinforcing layer, which is enabled to bond a rubber layer and a fiber reinforcing layer by a formalin-free adhesive with an adhesive strength equal to or more than that of a formalin-containing RFL. The rubber product with the fiber reinforcing layer includes a rubber layer containing a nonpolar rubber or a diene-based rubber, and a fiber reinforcing layer containing a woven fiber cord having a polarity. The rubber layer and the fiber reinforcing layer are stacked and bonded with an adhesive containing a triazine thiol and a diene-based rubber.

摘要翻译： 本发明提供一种具有纤维增强层的橡胶制品，其能够通过不含福尔马林的RFL的粘合强度的不含福尔马林的粘合剂将橡胶层和纤维增强层粘合。 具有纤维增强层的橡胶制品包括含有非极性橡胶或二烯系橡胶的橡胶层和含有极性的织造纤维帘线的纤维增强层。 橡胶层和纤维增强层用包含三嗪硫醇和二烯系橡胶的粘合剂层叠并粘合。

公开(公告)号：US08349387B2

公开(公告)日：2013-01-08

申请号：US12733324

申请日：2008-08-28

申请人： Takeshi Funaki ,  Tatsumori Yoshida

发明人： Takeshi Funaki ,  Tatsumori Yoshida

IPC分类号： A61K9/16 ,  A61K9/28 ,  B05D3/00 ,  B05D7/00

CPC分类号： A61K9/2893 ,  A61K9/284 ,  A61K9/2846

摘要： The present invention relates to a method for production of a coated preparation, characterized by coating a core material with a coating solution, the core material comprising an active ingredient, the coating solution comprising a) a resin composition obtained by copolymerization of polyvinyl alcohol having an average polymerization degree of 1300 or less, and at least one polymerizable vinyl monomer in a weight ratio of 6:4 to 9:1, b) water, and c) an organic solvent. The method for production make it feasible to efficiently coat a preparation such as a tablet, a granule, and a fine granule, etc. (a pharmaceutical drug, an animal drug, an agricultural chemicals, a fertilizer, or a food product) with the coating solution comprising a) the composition comprising the polyvinyl alcohol copolymer as the main component, b) water, and c) the organic solvent.

摘要翻译： 本发明涉及一种制备涂层制剂的方法，其特征在于用涂覆溶液涂覆芯材料，该芯材料包含活性成分，该涂层溶液包含a）一种树脂组合物，该树脂组合物通过聚 平均聚合度为1300以下，以及至少一种重量比为6：4〜9：1的可聚合乙烯基单体，b）水，和c）有机溶剂。 制造方法使得可以有效地涂布诸如片剂，颗粒剂和细颗粒剂等的制剂（药物，动物药物，农药，肥料或食品）与 包括a）包含聚乙烯醇共聚物作为主要组分的组合物，b）水，和c）有机溶剂。

公开(公告)号：US20110054043A1

公开(公告)日：2011-03-03

申请号：US12937411

申请日：2009-04-13

申请人： Takeshi Funaki ,  Yuriko Takase

发明人： Takeshi Funaki ,  Yuriko Takase

IPC分类号： A61K47/32 ,  A61P1/00 ,  A61P9/00 ,  A61P35/00 ,  A61P25/00 ,  A61P31/00 ,  A23L1/05 ,  A23L1/09 ,  A23L1/00

CPC分类号： A61K47/32 ,  A23L27/79 ,  A23P20/20 ,  A61K9/0056 ,  A61K9/006 ,  A61K9/7007

摘要： A film composition comprising (i) a resin obtained by copolymerizing polyvinyl alcohol and at least one or more polymerizable vinyl monomers; and (ii) a drug or a food component.

摘要翻译： 一种膜组合物，其包含（i）通过使聚乙烯醇与至少一种或多种可聚合乙烯基单体共聚得到的树脂; 和（ii）药物或食物成分。

公开(公告)号：US20100240711A1

公开(公告)日：2010-09-23

申请号：US12678714

申请日：2008-09-18

申请人： Masatoshi Takada ,  Yuki Murakami ,  Shunji Ichio ,  Minako Fujii ,  Asako Takakura ,  Takeshi Funaki

发明人： Masatoshi Takada ,  Yuki Murakami ,  Shunji Ichio ,  Minako Fujii ,  Asako Takakura ,  Takeshi Funaki

IPC分类号： A61K31/44 ,  A61P3/04

CPC分类号： C07D213/76 ,  A61K9/1617 ,  A61K9/1623 ,  A61K9/1652 ,  A61K9/1694

摘要： A preparation which can improve solubility of a NPYY5 receptor antagonist in water, even when the NPYY5 receptor antagonist is contained in the preparation at a high content is provided. A solid preparation containing a NPYY5 receptor antagonist, an amorphous stabilizer, and optionally an amorphousization inducing agent. Particularly, when the amorphous stabilizer is hydroxypropylmethylcellulose phthalate and/or hydroxypropylmethylcellulose acetate succinate, and the amorphousization inducing agent is urea and/or saccharine sodium at an addition amount of less than 8% by weight, dissolution out property of a water-hardly soluble NPYY5 receptor antagonist could be improved.

摘要翻译： 提供了即使NPYY5受体拮抗剂以高含量包含在制剂中，也能够提高NPYY5受体拮抗剂在水中的溶解性的制剂。 含有NPYY5受体拮抗剂，无定形稳定剂和任选的非晶化诱导剂的固体制剂。 特别是当无定形稳定剂为羟丙基甲基纤维素邻苯二甲酸酯和/或羟丙基甲基纤维素乙酸酯琥珀酸酯时，无定形诱导剂为加入量小于8重量％的尿素和/或糖精钠，水难溶性NPYY5的溶出性 受体拮抗剂可以改善。

公开(公告)号：US06708398B2

公开(公告)日：2004-03-23

申请号：US09907639

申请日：2001-07-19

申请人： Yoshiaki Wakashima ,  Naoki Fukutomi ,  Kazuhisa Suzuki ,  Takeshi Funaki

发明人： Yoshiaki Wakashima ,  Naoki Fukutomi ,  Kazuhisa Suzuki ,  Takeshi Funaki

IPC分类号： H05K300

CPC分类号： H01L21/486 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A substrate for use in a semiconductor package is fabricated by preparing a composite metal laminate consisting of a first metal layer, a second metal layer, and a carrier layer positioned in this order. The first metal layer has etching characteristics different to those of the second metal layer with respect to the same etchant. The first metal layer is selectively etched until the second metal layer is exposed, thereby forming pillar-like interconnections. The gap between the interconnections is then filled with a resin so as to form a resin base with interconnections. The carrier layer is removed from the second metal layer, and the second metal layer is selectively etched until the first metal layer or the resin base is exposed, thereby forming a conductive pattern on the resin base.

摘要翻译： 通过制备由第一金属层，第二金属层和依次定位的载体层组成的复合金属层叠体，制造用于半导体封装的基板。 第一金属层相对于相同的蚀刻剂具有与第二金属层不同的蚀刻特性。 选择性地蚀刻第一金属层直到第二金属层被暴露，从而形成柱状互连。 然后用树脂填充互连之间的间隙，以形成具有互连的树脂基底。 从第二金属层去除载体层，并且选择性地蚀刻第二金属层直到暴露第一​​金属层或树脂基底，从而在树脂基底上形成导电图案。