SHOWER PLATE AND MANUFACTURING METHOD THEREOF, AND PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD USING THE SHOWER PLATE
    5.
    发明申请
    SHOWER PLATE AND MANUFACTURING METHOD THEREOF, AND PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD USING THE SHOWER PLATE 审中-公开
    淋浴板及其制造方法,等离子体处理装置,等离子体处理方法和使用淋浴板的电子装置制造方法

    公开(公告)号:US20090311869A1

    公开(公告)日:2009-12-17

    申请号:US12374405

    申请日:2007-07-18

    CPC分类号: C23C16/45565 H01J37/3244

    摘要: Provided is a shower plate capable of more securely preventing the occurrence of backflow of plasma and enabling efficient plasma excitation. A shower plate 106 is disposed in a processing chamber 102 of a plasma processing apparatus and is provided with a plurality of gas discharge holes 113a for discharging a plasma excitation gas to generate plasma in the processing chamber 102, wherein an aspect ratio of a length of the gas discharge hole to a hole diameter thereof (length/hole diameter) is equal to or greater than about 20. The gas discharge holes 113a are made of ceramics members 113 which are separated from the shower plate 106, and the ceramics members 113 are installed in vertical holes 105 opened in the shower plate 106.

    摘要翻译: 提供一种能够更可靠地防止等离子体回流的发生并能够实现有效的等离子体激发的喷淋板。 喷淋板106设置在等离子体处理装置的处理室102中,并且设置有多个用于排出等离子体激发气体以在处理室102中产生等离子体的气体排出孔113a,其中长度 气体排出孔的孔径(长度/孔径)为大于等于20°。排气孔113a由与喷淋板106分离的陶瓷部件113构成,陶瓷部件113为 安装在在淋浴板106上打开的垂直孔105中。

    PLASMA PROCESSING APPARATUS
    8.
    发明申请
    PLASMA PROCESSING APPARATUS 有权
    等离子体加工设备

    公开(公告)号:US20120267048A1

    公开(公告)日:2012-10-25

    申请号:US13454513

    申请日:2012-04-24

    IPC分类号: B05C5/00

    摘要: A plasma processing apparatus includes a processing chamber, a stage, a dielectric member, a microwave introduction device, an injector, and an electric field shield. The processing chamber has a processing space therein. The stage is provided within the processing chamber. The dielectric member has a through hole and is provided to face the stage. The microwave introduction device is configured to introduce microwave into the processing space via the dielectric member. The injector has at least one through hole and is made of a dielectric material, e.g., a bulk dielectric material. The injector is provided within the dielectric member. The injector and the through hole of the dielectric member form a path for supplying a processing gas into the processing space. The electric field shield encloses the injector.

    摘要翻译: 等离子体处理装置包括处理室,载物台,电介质构件,微波引入装置,注射器和电场屏蔽。 处理室在其中具有处理空间。 工作台设置在处理室内。 电介质构件具有通孔并且设置成面向台。 微波引入装置经由电介质构件将微波引入处理空间。 喷射器具有至少一个通孔,并且由介电材料制成,例如大体电介质材料。 喷射器设置在电介质构件内。 介电构件的注射器和通孔形成用于将处理气体供应到处理空间的路径。 电场屏蔽封闭注射器。

    PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    9.
    发明申请
    PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    等离子体处理装置和基板处理方法

    公开(公告)号:US20120160809A1

    公开(公告)日:2012-06-28

    申请号:US13391310

    申请日:2010-08-16

    摘要: A microwave supply unit 20 of a plasma processing apparatus 11 includes a stub member 51 configured to be extensible from the outer conductor 33 toward the inner conductor 32. The stub member 51 serves as a distance varying device for varying a distance in the radial direction between a part of the outer surface 36 of the inner conductor 32 and a facing member facing the part of the outer surface of the inner conductor 32 in the radial direction, i.e., the cooling plate protrusion 47. The stub member 51 includes a rod-shaped member 52 supported at the outer conductor 33 and configured to be extended in the radial direction; and a screw 53 as a moving distance adjusting member for adjusting a moving distance of the rod-shaped member 52 in the radial direction.

    摘要翻译: 等离子体处理装置11的微波供给单元20包括构造成可从外导体33向内导体32延伸的短截线构件51.短截线构件51用作变距装置,用于改变径向方向上的距离 内导体32的外表面36的一部分和面向内径部分的内导体32的外表面的一部分的面对构件即冷却板突起47.短针构件51包括杆状 构件52支撑在外导体33处并且构造成沿径向方向延伸; 以及作为用于调节棒状构件52在径向上的移动距离的移动距离调节构件的螺钉53。

    Plasma processing apparatus
    10.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US07940009B2

    公开(公告)日:2011-05-10

    申请号:US12274650

    申请日:2008-11-20

    IPC分类号: H01B31/26 C23C16/00

    CPC分类号: H01J37/32192 H01J37/32238

    摘要: A plasma processing apparatus includes a chamber for carrying out plasma processing inside, a top plate made of a dielectric material for sealing the upper side of this chamber, and an antenna section that serves as a high frequency supply for supplying high frequency waves into the chamber via this top plate. The top plate is provided with reflecting members inside thereof. The sidewalls of the reflecting members work as wave reflector for reflecting high frequency waves that propagate inside the top plate in the radius direction. Alternatively, no reflecting members may be provided in a manner in which the sidewalls of a recess of the top plate serve as a wave reflector means.

    摘要翻译: 等离子体处理装置包括用于在内部进行等离子体处理的室,由用于密封该室的上侧的电介质材料制成的顶板和用作将高频波供应到室中的高频电源的天线部分 通过这个顶板。 顶板在其内设有反射构件。 反射部件的侧壁作为反射用于反射在顶板内部沿半径方向传播的高频波的波反射体。 或者,不能以顶板的凹部的侧壁用作波反射器装置的方式设置反射部件。