公开(公告)号：US06462148B1

公开(公告)日：2002-10-08

申请号：US09297203

申请日：1999-10-07

申请人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

发明人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

IPC分类号： C08L7100

CPC分类号： C08G65/4037 ,  C08G65/4006 ,  C08G75/23 ,  C08L71/00

摘要： A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

摘要翻译： 可用作粘合剂膜的树脂组合物和用于多层布线基板或电子部件的绝缘材料包括（A）包含式（1）所示的喹啉环的聚合物，其结构如6,6'-双（2- （4-氟苯基）-4-苯基喹啉）和4,4' - （1,1,1,3,3,3-六氟-2,2-亚丙基）双酚，和（B）由式 （2）如2,2-双（（4-马来酰亚胺基苯氧基）苯基）丙烷。

公开(公告)号：US5352762A

公开(公告)日：1994-10-04

申请号：US676383

申请日：1991-03-28

申请人： Akira Nagai ,  Shin Nishimura ,  Masahiro Suzuki ,  Masao Suzuki ,  Junichi Katagiri ,  Akio Takahashi ,  Akio Mukoh

发明人： Akira Nagai ,  Shin Nishimura ,  Masahiro Suzuki ,  Masao Suzuki ,  Junichi Katagiri ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C08G12/32 ,  C08G18/30 ,  C08G18/38 ,  C08G59/40 ,  C08G73/06 ,  H01B3/30 ,  H01B3/44 ,  H01L23/12 ,  H05K1/03 ,  H05K3/46 ,  C08G83/00 ,  C08G73/12

CPC分类号： H05K3/4626 ,  H05K1/0346 ,  H05K1/034 ,  H05K2201/015 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31551 ,  Y10T442/2213 ,  Y10T442/2713 ,  Y10T442/2738

摘要： A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

摘要翻译： 包括绝缘层的多个交替层叠层和具有6.0ns / m以下的信号传输延迟时间的电路导体层的多层印刷电路板，耐热性，粘合剂，阻燃性等优异，可以通过形成 使用含氟热固性树脂组合物的绝缘层。

公开(公告)号：US5686191A

公开(公告)日：1997-11-11

申请号：US553240

申请日：1995-11-07

申请人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

发明人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

IPC分类号： C08G73/10 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B27/06

CPC分类号： H05K3/4655 ,  C08G73/1039 ,  C08G73/1071 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4605 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

摘要翻译： 包含（A）热固性聚酰亚胺和（B）双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。

公开(公告)号：US5565536A

公开(公告)日：1996-10-15

申请号：US423344

申请日：1995-04-18

申请人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

发明人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C07D207/44 ,  C07D207/444 ,  C07D207/452 ,  C07D207/456 ,  C08F12/26 ,  C08F22/36 ,  C08F22/40 ,  C08L33/24 ,  C08L35/00 ,  C08F122/40 ,  C08F114/18 ,  C08F128/02 ,  C08F130/08

CPC分类号： C07D207/452 ,  C07D207/444 ,  C07D207/456 ,  C08F12/26 ,  C08F22/40

摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

摘要翻译： 由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R 2和R 3的不饱和酰亚胺基，或其中R 2和R 3选自氢，低级烷基 基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。 可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。 固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

公开(公告)号：US5410069A

公开(公告)日：1995-04-25

申请号：US986758

申请日：1992-12-08

申请人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

发明人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C07D207/44 ,  C07D207/444 ,  C07D207/452 ,  C07D207/456 ,  C08F12/26 ,  C08F22/36 ,  C08F22/40 ,  C08L33/24 ,  C08L35/00

CPC分类号： C07D207/452 ,  C07D207/444 ,  C07D207/456 ,  C08F12/26 ,  C08F22/40

摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

摘要翻译： 由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R2和R3的不饱和酰亚胺基，或其中R2和R3选自氢，低级烷基 基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。 可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。 固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

公开(公告)号：US5098971A

公开(公告)日：1992-03-24

申请号：US589605

申请日：1990-09-28

申请人： Akira Nagai ,  Shin Nishimura ,  Akio Takahashi ,  Masamichi Maruta ,  Akihiro Fukui

发明人： Akira Nagai ,  Shin Nishimura ,  Akio Takahashi ,  Masamichi Maruta ,  Akihiro Fukui

IPC分类号： C08F22/40 ,  C08F20/52 ,  C08F22/36 ,  C08F122/40 ,  C08G73/12

CPC分类号： C08G73/123 ,  C08F122/40

摘要： A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.

摘要翻译： 通过使具有下式的双马来酰亚胺化合物（其中Rf是氟，CF 3，C 2 F 5或C 3 F 7）聚合得到具有三维交联结构的含氟热固性树脂。 该树脂的成型性，耐热性和电性能优异，介电常数低，因此适合作为成型材料，可用于成型材料，线路板，LSI等的绝缘膜等。

公开(公告)号：US5308888A

公开(公告)日：1994-05-03

申请号：US20399

申请日：1993-02-22

申请人： Shin Nishimura ,  Akira Nagai ,  Akio Takahashi ,  Akio Mukoo ,  Tadashi Narita ,  Tokio Hagiwara ,  Hiroshi Hamana ,  Junichi Katagiri

发明人： Shin Nishimura ,  Akira Nagai ,  Akio Takahashi ,  Akio Mukoo ,  Tadashi Narita ,  Tokio Hagiwara ,  Hiroshi Hamana ,  Junichi Katagiri

IPC分类号： C08F136/16 ,  H05K1/03 ,  C08J3/28

CPC分类号： C08F136/16 ,  H05K1/034

摘要： According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.

摘要翻译： 根据本发明，提供一种树脂组合物，其可以提供具有优异的耐热性和固化后的阻燃性并显示低介电常数的绝缘树脂。 含氟聚合物的含氟光固化树脂组合物，其含有通式[II]表示的氟或含氟基团的聚合物：其中R 1和R 2选自H，F，CH 3 和CF3; R3和R4选自CH2和CF2; x和y表示0〜4，m表示30〜1000，环境温度为固体的光聚合引发剂在100〜150℃之间熔融，熔融粘度不大于106泊，为光固化 。

公开(公告)号：US5294291A

公开(公告)日：1994-03-15

申请号：US947543

申请日：1992-09-21

申请人： Haruo Akahoshi ,  Toshinari Takada ,  Fujiko Yutani ,  Takeyuki Itabashi ,  Shin Nishimura ,  Satoru Amo ,  Akio Takahashi ,  Rituji Toba ,  Masashi Miyazaki

发明人： Haruo Akahoshi ,  Toshinari Takada ,  Fujiko Yutani ,  Takeyuki Itabashi ,  Shin Nishimura ,  Satoru Amo ,  Akio Takahashi ,  Rituji Toba ,  Masashi Miyazaki

IPC分类号： G03F7/40 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/108 ,  G03F7/40 ,  H05K2203/0285 ,  H05K2203/0392 ,  H05K2203/072 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/0789 ,  H05K2203/1476 ,  H05K3/062 ,  H05K3/383

摘要： A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.

摘要翻译： 提供了一种在形成在基板上的基底金属上形成导电电路图案的工艺。 在基体金属上，首先以与要形成的电路对应的图案设置电镀抗蚀剂，然后通过电镀形成电路图案。 用剥离剂处理电镀抗蚀剂，然后用汽提残渣去除剂通过脱水分解反应来切断抗蚀剂中的化学键。 用贱金属的蚀刻剂处理贱金属，除去在用剥离残渣去除剂处理后仍然残留的任何抗蚀剂残渣，并在被电镀抗蚀剂覆盖的区域上蚀刻贱金属。

公开(公告)号：US07878174B2

公开(公告)日：2011-02-01

申请号：US12284497

申请日：2008-09-23

申请人： Shin Nishimura ,  Tetsunori Iwamoto

发明人： Shin Nishimura ,  Tetsunori Iwamoto

IPC分类号： F02D9/10

CPC分类号： F02M37/0017 ,  F02M69/044 ,  F02M69/465

摘要： In a V-type multi-cylinder engine, a first fuel supply conduit is connected to fuel-injection valves in a first throttle body group corresponding to the first bank, and a second fuel supply conduit is connected to fuel injection valves in a second throttle body group corresponding to the second bank. A pair of first and second side plates connect adjacent ends of the first and second throttle body groups together. A distance between respective throttle bodies located in two ends of the first throttle body group is set shorter than a comparable distance between the throttle bodies located in two ends of the second throttle body group. A joint part for connectively receiving the fuel hose is provided at an end of the first fuel supply conduit in a way that the joint part is arranged between the two side plates.

摘要翻译： 在V型多气缸发动机中，第一燃料供给管道与第一节气门体组中的与第一组相对应的燃料喷射阀连接，第二燃料供给管路与第二节气门的燃料喷射阀连接 身体组对应第二个银行。 一对第一和第二侧板将第一和第二节气门体组的相邻端部连接在一起。 位于第一节气门体组的两端的各个节气门体之间的距离被设定为短于位于第二节气门体组的两端的节气门体之间的比较距离。 用于连接地接收燃料软管的接合部分设置在第一燃料供应管道的端部，使得接头部分布置在两个侧板之间。

公开(公告)号：US07230057B2

公开(公告)日：2007-06-12

申请号：US10717645

申请日：2003-11-21

申请人： Takefumi Okumura ,  Shin Nishimura ,  Norio Iwayasu ,  Shoichi Yokoyama ,  Takeshi Yabe

发明人： Takefumi Okumura ,  Shin Nishimura ,  Norio Iwayasu ,  Shoichi Yokoyama ,  Takeshi Yabe

IPC分类号： C08F130/06 ,  C07F5/04

CPC分类号： H01M10/0565 ,  C07F5/04 ,  C08F30/06 ,  C08G65/328 ,  C08G79/08 ,  H01B1/122 ,  H01M6/181 ,  H01M10/0525

摘要： An object of the present invention is to provide a boron-containing compound capable of forming an ion-conductive polyelectrolyte having high ion-conductive properties, and a polymer of said compound. According to the present invention, there are provided a polymerizable boron-containing compound of (formula 1), a polymer thereof, a polymer of a compound of (formula 2) and a compound of (formula 3), and a polyelectrolyte for electrochemical device comprising either of these polymers and at least one electrolyte salt:

摘要翻译： 本发明的目的是提供一种能够形成具有高离子传导性的离子传导性聚电解质的含硼化合物和所述化合物的聚合物。 根据本发明，提供了（式1）的聚合性含硼化合物，其聚合物，（式2）化合物和（式3）化合物的聚合物和电化学装置用聚电解质 包括这些聚合物中的任一种和至少一种电解质盐：