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103 条记录 (耗时 0.024 秒)

    Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device
    5.
    发明授权
    Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device 有权
    发光元件安装基板，发光元件封装，显示装置和照明装置

    公开(公告)号：US07977696B2

    公开(公告)日：2011-07-12

    申请号：US12303022

    申请日：2006-05-31

    申请人： Masakazu Ohashi ,  Ken-ichi Uruga ,  Masanori Ito

    发明人： Masakazu Ohashi ,  Ken-ichi Uruga ,  Masanori Ito

    IPC分类号： H01L33/00

    CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/505 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A light emitting element mounting substrate that enables a high quality light emitting element package to be readily manufactured with minimal variations in the chromaticity when manufacturing a white LED, a light emitting element package that employs the substrate, and a display device and illumination device that employs this package, are provided. In the light emitting element mounting substrate, at least a light emitting element mounting portion of a surface of a core metal is coated with a fluorescent enamel layer that consists of a fluorescent material-containing glass. In the light emitting element package, a light emitting element is mounted on the light emitting element mounting substrate, and the light emitting element is sealed with a transparent sealing resin.

    摘要翻译： 一种发光元件安装基板，其使得能够容易地制造高质量的发光元件封装，其制造白色LED时的色度变化最小，使用该基板的发光元件封装，以及采用基板的显示装置和照明装置 提供这个包装。 在发光元件安装基板中，芯体表面的至少一个发光元件安装部分涂覆有由含荧光材料的玻璃构成的荧光搪瓷层。 在发光元件封装中，发光元件安装在发光元件安装基板上，发光元件用透明密封树脂密封。

    LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LIGHT-EMITTING ELEMENT PACKAGE, DISPLAY DEVICE, AND ILLUMINATION DEVICE
    6.
    发明申请
    LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LIGHT-EMITTING ELEMENT PACKAGE, DISPLAY DEVICE, AND ILLUMINATION DEVICE 有权
    发光元件安装基板，发光元件包装，显示装置和照明装置

    公开(公告)号：US20100252843A1

    公开(公告)日：2010-10-07

    申请号：US12303022

    申请日：2006-05-31

    申请人： Masakazu Ohashi ,  Ken-ichi Uruga ,  Masanori Ito

    发明人： Masakazu Ohashi ,  Ken-ichi Uruga ,  Masanori Ito

    IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/44

    CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/505 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A light emitting element mounting substrate that enables a high quality light emitting element package to be readily manufactured with minimal variations in the chromaticity when manufacturing a white LED, a light emitting element package that employs the substrate, and a display device and illumination device that employs this package, are provided. In the light emitting element mounting substrate, at least a light emitting element mounting portion of a surface of a core metal is coated with a fluorescent enamel layer that consists of a fluorescent material-containing glass. In the light emitting element package, a light emitting element is mounted on the light emitting element mounting substrate, and the light emitting element is sealed with a transparent sealing resin.

    摘要翻译： 一种发光元件安装基板，其使得能够容易地制造高质量的发光元件封装，其制造白色LED时的色度变化最小，使用该基板的发光元件封装，以及采用基板的显示装置和照明装置 提供这个包装。 在发光元件安装基板中，芯体表面的至少一个发光元件安装部分涂覆有由含荧光材料的玻璃构成的荧光搪瓷层。 在发光元件封装中，发光元件安装在发光元件安装基板上，发光元件用透明密封树脂密封。

    Cup shaped baked confectionary and manufacturing method thereof
    8.
    发明授权
    Cup shaped baked confectionary and manufacturing method thereof 失效
    杯形烧烤糖果及其制造方法

    公开(公告)号：US08252357B2

    公开(公告)日：2012-08-28

    申请号：US12457077

    申请日：2009-06-01

    申请人： Katsuma Sasaki ,  Yoko Usami ,  Masanori Ito

    发明人： Katsuma Sasaki ,  Yoko Usami ,  Masanori Ito

    IPC分类号： A21D8/06

    CPC分类号： A21B3/13 ,  A21B5/02

    摘要： A cup shaped baked confectionary has light texture, uniform thickness and easy to release from the die. The cup shaped baked confectionary may be produced by mounting a dough of a cup shaped baked confectionary having desired contour shape on a top of a metallic three-dimensional baking die having desired shape of outer peripheral surface, in a condition extending horizontally with placing outer periphery thereof outside of the three dimensional baking die and heating the dough for softening the dough of the cup shaped baked confectionary to contact on the outer peripheral surface of the three-dimensional baking die and baking.

    摘要翻译： 杯形烧烤糖果具有质感轻盈，厚度均匀，易于从模具中释放出来。 杯形烧烤糖果可以通过将具有期望轮廓形状的杯形烘焙糖果的面团安装在具有所需外形表面形状的金属三维烘烤模具的顶部上，在水平延伸的状态下放置外周边 在三维烘烤模具外面加热面团，以使杯状烘烤糖果的面团软化，以在三维烘烤模具的外周表面上接触并烘烤。

    METHOD FOR VERIFICATION OF MASK LAYOUT OF SEMICONDUCTOR INTEGRATED CIRCUIT
    9.
    发明申请
    METHOD FOR VERIFICATION OF MASK LAYOUT OF SEMICONDUCTOR INTEGRATED CIRCUIT 审中-公开
    用于验证半导体集成电路掩模布局的方法

    公开(公告)号：US20100242011A1

    公开(公告)日：2010-09-23

    申请号：US12594271

    申请日：2009-02-17

    申请人： Kiyohito Mukai ,  Masanori Ito ,  Yoshinaga Okamoto ,  Seijiro Kojima

    发明人： Kiyohito Mukai ,  Masanori Ito ,  Yoshinaga Okamoto ,  Seijiro Kojima

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5068 ,  G03F1/36 ,  H01L27/0207

    摘要： In a semiconductor integrated circuit mask layout verification method, a layout pattern division condition 108, according to which a plurality of specific layout patterns that need to have identical circuit characteristics are included, is input in a condition input step 109. In a data division step 103, input mask layout design data is divided into a plurality of layout pattern groups according to the layout pattern division condition. In a standard pattern selection step 105, a standard pattern serving as a standard in pattern matching is selected for each of the divided layout pattern groups. In a pattern matching step 106, for each of the layout pattern groups, layout patterns included in that layout pattern group are compared with the standard pattern.

    摘要翻译： 在半导体集成电路掩模布局验证方法中，在条件输入步骤109中输入需要包含具有相同电路特性的多个特定布局图案的布局图案划分条件108.在数据分割步骤 如图103所示，输入掩模布局设计数据根据布局图案划分条件被划分为多个布局图案组。 在标准图案选择步骤105中，为每个划分的布局图案组选择用作图案匹配中的标准的标准图案。 在图案匹配步骤106中，对于每个布局图案组，将包括在该布局图案组中的布局图案与标准图案进行比较。

    STORAGE UNIT, DATA WRITE METHOD AND DATA WRITE PROGRAM
    10.
    发明申请
    STORAGE UNIT, DATA WRITE METHOD AND DATA WRITE PROGRAM 审中-公开
    存储单元，数据写入方法和数据写入程序

    公开(公告)号：US20100241802A1

    公开(公告)日：2010-09-23

    申请号：US12696219

    申请日：2010-01-29

    申请人： Atsushi IGASHIRA ,  Masanori Ito ,  Yoshihito Konta ,  Norihide Kubota ,  Kenji Kobayashi

    发明人： Atsushi IGASHIRA ,  Masanori Ito ,  Yoshihito Konta ,  Norihide Kubota ,  Kenji Kobayashi

    IPC分类号： G06F12/08 ,  G06F12/00

    CPC分类号： G06F12/0873 ,  G06F2212/262 ,  G06F2212/281

    摘要： A storage unit includes a cache memory, a cache controller which accesses the cache memory, one or more disk units, a data receiving unit, a merge interpolation determination unit, a data readout unit, a write data generation unit and a data write unit. The data receiving unit receives, from the cache controller, unit readout data that includes update records updated by the cache controller and is unit of data read from the cache memory. The merge interpolation determination unit determines whether the received unit readout data is merge interpolated. The data readout unit reads, from the disk unit, data corresponding to the unit readout data when the unit readout data is determined to be merge interpolated. The write data generation unit generates data to be written to the disk unit by merge interpolating the unit readout data. The data write unit writes, to the disk unit, the generated data.

    摘要翻译： 存储单元包括高速缓存存储器，访问高速缓冲存储器的高速缓存控制器，一个或多个盘单元，数据接收单元，合并插值确定单元，数据读出单元，写入数据生成单元和数据写入单元。 数据接收单元从高速缓存控制器接收包括由高速缓存控制器更新的更新记录的单元读出数据，并且是从高速缓冲存储器读取的数据单位。 合并插值确定单元确定接收单元读出数据是否合并内插。 当确定单元读出数据被合并内插时，数据读出单元从盘单元读取对应于单元读出数据的数据。 写数据生成单元通过合并内插单位读出数据来生成要写入到盘单元的数据。 数据写入单元向盘单元写入生成的数据。