公开(公告)号：US5963753A

公开(公告)日：1999-10-05

申请号：US9100

申请日：1998-01-20

申请人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki ,  Masao Tsuji

发明人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki ,  Masao Tsuji

IPC分类号： B65G1/00 ,  B65G49/07 ,  G03F7/20 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677 ,  G03D5/00

CPC分类号： H01L21/67167 ,  G03F7/7075 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778

摘要： A substrate processing apparatus comprises a first substrate transfer unit having a first transfer path and a second substrate transfer unit having a second transfer path. A spin coating unit and a spin developing unit are arranged along the first transfer path, and a substrate cassette is arranged along the second transfer path. A substrate transport robot of the second substrate transfer unit selectively introduces a substrate received from a substrate transport robot of the first substrate transfer unit in one of external exposure apparatuses arranged on both end portions of the second transfer path, and discharges the substrate from the exposure apparatus for transfering the same to the substrate transport robot of the first substrate transfer unit. Thereby the substrate processing apparatus can avoid or relieve reduction of operational efficiency even if its throughput is different from that of an exposure apparatus.

摘要翻译： 基板处理装置包括具有第一传送路径的第一基板传送单元和具有第二传送路径的第二基板传送单元。 旋转涂布单元和旋转显影单元沿着第一传送路径布置，并且沿着第二传送路径布置基板盒。 第二基板转印单元的基板输送机器人选择性地将从第一基板转印单元的基板输送机器人接收的基板引导到布置在第二输送路径的两端部的外部曝光装置中的一个，并从曝光中排出基板 用于将其传送到第一基板传送单元的基板输送机器人的装置。 因此，即使其处理量与曝光装置的吞吐量不同，也可以避免或减轻操作效率的降低。

公开(公告)号：US6099643A

公开(公告)日：2000-08-08

申请号：US993284

申请日：1997-12-18

申请人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki

发明人： Masami Ohtani ,  Minobu Matsunaga ,  Tutomu Ueyama ,  Ryuji Kitakado ,  Kaoru Aoki

IPC分类号： H01L21/00 ,  B05C13/00

CPC分类号： H01L21/67173 ,  H01L21/67017 ,  H01L21/67178 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/141

摘要： An atmospheric conditioning unit for supplying temperature- and humidity-controlled air to a chemical processing part (spin coater) is arranged immediately above a chemical processing part, between this chemical processing part and a heat treatment part (including a hot plate and a cool plate). Namely, the chemical processing part, the atmospheric conditioning unit and the heat treatment part are vertically arranged in a stacked manner. The atmospheric conditioning unit receives external air from an opening. A closed partition is provided to block air flow between the atmospheric conditioning unit and a transport area. The temperature- and humidity-controlled air supplied from the atmospheric conditioning unit to the spin coater forms a downflow in the spin coater, and thereafter rises through an opening and joins with the air flowing from the opening, to be introduced into the atmospheric conditioning unit again and reused.

摘要翻译： 用于向化学处理部件（旋转涂布机）供给温度和湿度控制的空气的大气调节单元布置在化学处理部件的正上方，该化学处理部件和热处理部件（包括热板和冷却板 ）。 也就是说，化学处理部分，大气调节单元和热处理部分以堆叠的方式垂直布置。 大气调节装置从开口接收外部空气。 提供一个封闭的隔板以阻挡大气调节单元和运输区域之间的空气流动。 从大气调节单元向旋转涂布机供应的温度和湿度控制的空气在旋转涂布机中形成向下流动，然后通过开口上升并与从开口流出的空气接合，以引入大气调节单元 再次重复使用。

公开(公告)号：US6060697A

公开(公告)日：2000-05-09

申请号：US39141

申请日：1998-03-13

申请人： Akihiko Morita ,  Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Masaki Iwami ,  Joichi Nishimura ,  Kazuhiro Nishimura ,  Tetsuya Hamada ,  Satoshi Yamamoto ,  Kenji Kamei

发明人： Akihiko Morita ,  Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Masaki Iwami ,  Joichi Nishimura ,  Kazuhiro Nishimura ,  Tetsuya Hamada ,  Satoshi Yamamoto ,  Kenji Kamei

IPC分类号： H01L21/02 ,  G05D23/19 ,  H02J3/00 ,  H02J13/00 ,  H05B1/02

CPC分类号： G05D23/1951

摘要： A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.

摘要翻译： 基板处理装置降低开启时的瞬时最大功耗。 多个处理单元的受电部分分别通过开关连接到导通开关的一端。 导通开关的另一端通过断路器连接到外部电源。 定时器值分别在定时器中设置。 当接通开关接通时，定时器分别在由定时器值定义的时间之后分别关闭相应的开关，由此处理单元被提供电力，每个具有恒定时间的延迟。

公开(公告)号：US6062852A

公开(公告)日：2000-05-16

申请号：US60422

申请日：1998-04-14

申请人： Takanori Kawamoto ,  Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Masaki Iwami ,  Joichi Nishimura ,  Akihiko Morita

发明人： Takanori Kawamoto ,  Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Masaki Iwami ,  Joichi Nishimura ,  Akihiko Morita

IPC分类号： H01L21/683 ,  F27D5/00 ,  H01L21/027 ,  H01L21/68

CPC分类号： H01L21/67109 ,  H01L21/67178 ,  H01L21/68728 ,  H01L21/68742

摘要： A substrate heat-treating apparatus includes a heat-treating plate, and support pins extending through the heat-treating plate to be vertically movable relative thereto. The support pins support each substrate at a lower surface thereof such that edges of the substrate are at a higher level than a central region of the substrate. This construction facilitates air flows into and out of a space between the lower surface of the substrate and the upper surface of the heat-treating plate when the substrate is vertically moved.

摘要翻译： 基板热处理装置包括热处理板和延伸穿过热处理板以相对于其垂直移动的支撑销。 支撑销在其下表面处支撑每个基板，使得基板的边缘处于比基板的中心区域更高的水平。 当基板垂直移动时，这种结构便于空气流入和流出基板的下表面和热处理板的上表面之间的空间。

公开(公告)号：US06051101A

公开(公告)日：2000-04-18

申请号：US39824

申请日：1998-03-16

申请人： Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Takanori Kawamoto ,  Masaki Iwami ,  Joichi Nishimura ,  Akihiko Morita

发明人： Masami Ohtani ,  Yasuo Imanishi ,  Masao Tsuji ,  Takanori Kawamoto ,  Masaki Iwami ,  Joichi Nishimura ,  Akihiko Morita

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/027 ,  H01L21/677 ,  B65H1/00

CPC分类号： H01L21/67161 ,  H01L21/67178 ,  H01L21/67742 ,  H01L21/67745

摘要： A unit arrangement part comprises a chemical cabinet on its lowermost part, while coating units for forming a resist film on a substrate and developing units for developing the substrate after exposure are arranged on four corners of an apparatus above the chemical cabinet. Further, multistage thermal processing units for thermal-processing the substrate are arranged on front and rear portions of the apparatus above these wet processing units. A cleaning unit for supplying a cleaning liquid such as pure water and cleaning the substrate is arranged on a front side of the apparatus between the coating units as a substrate processing unit. Thus provided is a substrate processing apparatus having excellent workability in maintenance with a high degree of freedom in arrangement of processing units.

摘要翻译： 单元布置部分包括在其最下部分的化学柜，而在基板上形成抗蚀剂膜的涂布单元和曝光后用于显影基板的显影单元布置在化学柜上方的设备的四个角上。 此外，用于热处理基板的多级热处理单元布置在这些湿处理单元上方的设备的前部和后部。 在作为基板处理单元的涂布单元之间的设备的前侧设置有用于供应诸如纯水的清洁液体并清洁基板的清洁单元。 因此，提供了一种具有优异的维护可加工性的基板处理装置，并且处理单元的布置自由度高。

公开(公告)号：US20080196658A1

公开(公告)日：2008-08-21

申请号：US12031674

申请日：2008-02-14

申请人： Yoshiteru Fukutomi ,  Masami Ohtani

发明人： Yoshiteru Fukutomi ,  Masami Ohtani

IPC分类号： B05C11/00 ,  B08B13/00

CPC分类号： G11B23/0021 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70916 ,  G03F7/70925 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/68728 ,  H01L21/68764

摘要： A substrate processing apparatus that is arranged adjacent to an exposure device includes a processing section including a first processing unit and a second processing unit. The first processing unit includes a development region, a first cleaning region, and a first transport region. The development region and the first cleaning region are arranged opposite to each other with the first transport region interposed therebetween. The second processing unit includes a reversing region, a second cleaning region, and a second transport region. The reversing region and the second cleaning region are arranged opposite to each other with the second transport region interposed therebetween. The second processing unit is arranged between the first processing unit and the exposure device. The substrate processing apparatus also includes a transfer section coupled to the processing section and an interface configured to receive and transfer the substrate between the processing section and the exposure device.

摘要翻译： 布置在曝光装置附近的基板处理装置包括具有第一处理单元和第二处理单元的处理部。 第一处理单元包括显影区域，第一清洁区域和第一输送区域。 显影区域和第一清洁区域彼此相对设置，其间插入有第一输送区域。 第二处理单元包括反转区域，第二清洁区域和第二输送区域。 反转区域和第二清洁区域彼此相对布置，其间插入第二输送区域。 第二处理单元布置在第一处理单元和曝光装置之间。 基板处理装置还包括耦合到处理部分的传送部分和被配置为在处理部分和曝光装置之间接收和传送基板的接口。

公开(公告)号：US4935981A

公开(公告)日：1990-06-26

申请号：US294196

申请日：1989-01-06

申请人： Masami Ohtani ,  Masami Nishida

发明人： Masami Ohtani ,  Masami Nishida

IPC分类号： H01L39/24 ,  B01J19/12 ,  C23C14/34 ,  C30B29/22 ,  H01B13/00 ,  H01L21/00 ,  H01L21/203 ,  H01L21/683

CPC分类号： H01L21/67046 ,  H01L21/6838

摘要： An improved swing type substrate cleaning apparatus comprises a substrate chuck for holding the substrate while rotating the same, a cleaning brush holding apparatus for holding a cleaning brush while rotating the same, a cleaning brush elevating apparatus for holding the cleaning brush holding apparatus in a manner enabling elevation and swing of the same, and a buffer apparatus for reducing the velocity at which the cleaning brush elevating apparatus lowers the cleaning brush holding apparatus when the cleaning brush is lowered to be in contact with the substrate. Since the velocity with which the cleaning brush is lowered is reduced to be lower than a prescribed value by means of the buffer apparatus, no significant shock is created when the cleaning brush is brought into contact with the substrate.

摘要翻译： 一种改进的摆动式基板清洁装置，包括用于在旋转基板的同时保持基板的基板卡盘，用于在旋转清洁刷的同时保持清洁刷的清洁刷保持装置，用于以清洁刷保持装置保持的清洁刷升降装置 能够使其升降和摆动;以及缓冲装置，用于降低清洁刷升降装置降低清洁刷保持装置时的速度，当清洁刷降低以与基板接触时。 由于通过缓冲装置将清洁刷降低的速度降低到低于规定值，所以当清洁刷与基板接触时不会产生显着的冲击。

公开(公告)号：US4312586A

公开(公告)日：1982-01-26

申请号：US155089

申请日：1980-06-02

申请人： Masami Ohtani

发明人： Masami Ohtani

IPC分类号： G03D3/06 ,  G03D3/13

CPC分类号： G03D3/06 ,  G03D3/132 ,  Y10T137/85954 ,  Y10T137/86196

摘要： This invention is concerned with a method and apparatus for the development of photographic films in a photographic film processor in which the films are developed when the exposed films pass through a developing tank containing developer. The object of said invention is to attain uniform development with a simple method, that is, to make the change of the activity of the developer during the development of the films to be treated very small from the leading end to the trailing end of the film. The said invention makes the influence of the momentarily changing activity of the developer in contact with the films as small as possible by compensating for the decrease of the activity due to the exhaustion of the developer by gradually increasing the immersion time of the films in the developer from the leading end toward the trailing end of the photographic films by gradually changing the relative level of the liquid surface when the films are fed into the developer.

摘要翻译： 本发明涉及用于在照相胶片处理器中开发照相胶片的方法和装置，其中当曝光的胶片通过含有显影剂的显影槽时，显影胶片。 本发明的目的是通过简单的方法来实现均匀显影，即，使得待处理的膜的显影期间显影剂的活性从薄膜的前端到尾端变化很小 。 所述发明通过逐渐增加膜在显影剂中的浸渍时间来补偿由于显影剂耗尽而导致的活性降低，使得显影剂与膜接触的瞬时变化的影响尽可能小 通过在将膜馈送到显影剂中时逐渐改变液面的相对水平，从照相胶卷的前端到尾端。

公开(公告)号：US4250956A

公开(公告)日：1981-02-17

申请号：US075482

申请日：1979-09-14

申请人： Masami Ohtani

发明人： Masami Ohtani

IPC分类号： B60H1/00 ,  F24F11/02 ,  G05D23/24 ,  G05D23/00 ,  B60H3/04 ,  F25B29/00

CPC分类号： B60H1/00828 ,  G05D23/1931 ,  G05D23/24

摘要： A temperature control door (27) controls air flow through a duct (12) and is positioned in accordance with the output of a sensor (41), (42). A slider (74) of a potentiometer (72) is connected to the door (27) so that the slider (74) is in a central position when the temperature control door (27) is in a central position. A switch (86) connects the slider (74) to one end of a resistance element (73) of the potentiometer (72) when the temperature control door (27) is on one side of the central position and the apparatus (11) is in a cooling mode and to the other end of the resistance element (73) of the potentiometer (72) when the temperature control door (27) is on the other side of the central position and the apparatus (11) is in a heating mode. The speed of a blower (16) which forces air through the duct (12) is controlled in accordance with the resistance of the potentiometer (72). A switch (87) controls the blower (16) to run a maximum speed when the apparatus (11) is in a maximum cooling mode.

摘要翻译： 温度控制门（27）控制通过管道（12）的空气流并且根据传感器（41）的输出（42）定位。 电位器（72）的滑块（74）连接到门（27），使得当温度控制门（27）处于中心位置时，滑块（74）处于中心位置。 当温度控制门（27）位于中心位置的一侧时，开关（86）将滑块（74）连接到电位器（72）的电阻元件（73）的一端，并且设备（11）是 在温度控制门（27）处于中心位置的另一侧并且装置（11）处于加热模式时，处于冷却模式和电位计（72）的电阻元件（73）的另一端 。 根据电位器（72）的阻力来控制迫使空气通过管道（12）的鼓风机（16）的速度。 当设备（11）处于最大冷却模式时，开关（87）控制鼓风机（16）运行最大速度。

公开(公告)号：US20080198341A1

公开(公告)日：2008-08-21

申请号：US12031667

申请日：2008-02-14

申请人： Yoshiteru Fukutomi ,  Masami Ohtani

发明人： Yoshiteru Fukutomi ,  Masami Ohtani

IPC分类号： G03B27/52

CPC分类号： H01L21/68764 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/68707 ,  H01L21/68728

摘要： In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.

摘要翻译： 在基板处理装置中，按顺序并排设置分度器块，抗蚀剂膜处理块，清洁/干燥处理块，显影处理块和界面块。 曝光装置设置在接口块附近。 曝光装置通过液浸法对基板进行曝光处理。 在清洁/干燥处理块和用于在其间接收和转移基板的显影处理块之间彼此靠近地提供基板平台。 将基板的一个表面和另一个表面反转的反转单元分别堆叠在基板平台的上方和下方。