Method of producing a ferroelectric thin film coated substrate
    6.
    发明授权
    Method of producing a ferroelectric thin film coated substrate 失效
    制造铁电薄膜被覆基板的方法

    公开(公告)号:US06232167B1

    公开(公告)日:2001-05-15

    申请号:US08968938

    申请日:1997-11-12

    IPC分类号: H01L218242

    CPC分类号: H01L28/56

    摘要: A ferroelectric thin film coated substrate is obtained by a producing method of forming a crystalline thin film on a substrate by means of a MOCVD method at a substrate temperature at which crystal grows and of forming a ferroelectric thin film on the crystalline thin film by means of the MOCVD method at a film forming temperature, which is lower than the film forming temperature of the crystalline thin film. This producing method makes it possible to produce a ferroelectric thin film, where a surface of the thin film is dense and even, leakage current properties are excellent and sufficiently large remanent spontaneous polarization is shown, at a lower temperature.

    摘要翻译: 通过在晶体生长的衬底温度下通过MOCVD法在衬底上形成结晶薄膜并在结晶薄膜上形成铁电薄膜的方法获得铁电薄膜涂覆衬底,借助于 在成膜温度下的MOCVD方法,其低于结晶薄膜的成膜温度。 通过该制造方法,能够在较低温度下制造薄膜的表面致密且均匀,漏电流特性优异,剩余自发极化足够大的强电介质薄膜。

    Ferroelectric thin film, manufacturing method thereof and device incorporating the same
    7.
    发明授权
    Ferroelectric thin film, manufacturing method thereof and device incorporating the same 失效
    铁电薄膜,其制造方法和包含该铁电薄膜的装置

    公开(公告)号:US06197600B1

    公开(公告)日:2001-03-06

    申请号:US09072359

    申请日:1998-05-05

    IPC分类号: H01L2100

    摘要: A ferroelectric thin film includes: a bismuth oxide polycrystal thin film constituting a buffer layer, and a bismuth-based layered compound thin film represented by the formula: Bi2Am-1BmO3m+3 wherein A is an atom selected from the group consisting of Na, K, Pb, Ca, Sr, Ba and Bi; B is an atom selected from the group consisting of Fe, Ti, Nb, Ta, W and Mo; and m is an integer of 1 or more. The bismuth oxide polycrystal thin film and the bismuth-based layered compound thin film are formed into a single-phase.

    摘要翻译: 铁电薄膜包括:构成缓冲层的氧化铋多晶薄膜和由式Bi2Am-1BmO3m + 3表示的铋基层状化合物薄膜,其中A是选自Na,K ,Pb,Ca,Sr,Ba和Bi; B是选自Fe,Ti,Nb,Ta,W和Mo的原子; m为1以上的整数。 氧化铋多晶薄膜和铋系层状化合物薄膜形成为单相。

    Ferroelectric thin film coated substrate, producing method thereof and capacitor structure element using thereof
    10.
    发明授权
    Ferroelectric thin film coated substrate, producing method thereof and capacitor structure element using thereof 失效
    铁电薄膜涂布基板,其制造方法和电容器结构元件

    公开(公告)号:US06440591B1

    公开(公告)日:2002-08-27

    申请号:US08646630

    申请日:1996-05-08

    IPC分类号: B32B900

    CPC分类号: H01L28/56

    摘要: A ferroelectric thin film coated substrate is obtained by a producing method of forming a metal oxide buffer layer on a substrate, forming a first crystalline ferroelectric thin film thereon by means of a MOCVD method and forming a second ferroelectric thin film with a film thickness thicker than that of the first ferroelectric thin film thereon by means of the MOCVD method at a temperature lower than that of the first ferroelectric thin film. This producing method makes it possible to produce a ferroelectric thin film, where its surface is dense and even, a leakage current properties are excellent and sufficiently large remanent spontaneous polarization is shown, at a lower temperature.

    摘要翻译: 通过在基板上形成金属氧化物缓冲层的制造方法,通过MOCVD法在其上形成第一结晶性强电介质薄膜,并形成膜厚度比第二强铁电体薄膜的铁电薄膜被覆基板 在其上的第一铁电薄膜的温度低于第一铁电薄膜的温度,通过MOCVD方法。 该制造方法使得可以在较低的温度下制备其表面致密甚至漏电流性能优异并且显示足够大的剩余自发极化的铁电薄膜。