摘要:
A memory cell comprises a variable resistance film; a first conductive film having one surface contacted with one surface of the variable resistance film; and a second conductive film having one surface contacted with another surface of the variable resistance film. A width of the first conductive film or the second conductive film in a direction orthogonal to a direction that a current flows in the first conductive film or the second conductive film is smaller than a width of the variable resistance film in a direction orthogonal to a direction that a current flows in the variable resistance film. The width of the first conductive film and the second conductive film is smaller than a width of the first line and the second line in a direction orthogonal to a direction that a current flows in the first line and the second line.
摘要:
A memory cell comprises a variable resistance film; a first conductive film having one surface contacted with one surface of the variable resistance film; and a second conductive film having one surface contacted with another surface of the variable resistance film. A width of the first conductive film or the second conductive film in a direction orthogonal to a direction that a current flows in the first conductive film or the second conductive film is smaller than a width of the variable resistance film in a direction orthogonal to a direction that a current flows in the variable resistance film. The width of the first conductive film and the second conductive film is smaller than a width of the first line and the second line in a direction orthogonal to a direction that a current flows in the first line and the second line.
摘要:
A semiconductor memory device includes first and second memory cells each including a variable resistance element and a diode and having a pillar shape, and an insulating layer provided between the first memory cell and the second memory cell and including a void. A central portion of the diode has a smaller width than widths of upper and lower portions of the diode.
摘要:
A semiconductor memory device includes first and second memory cells each including a variable resistance element and a diode and having a pillar shape, and an insulating layer provided between the first memory cell and the second memory cell and including a void. A central portion of the diode has a smaller width than widths of upper and lower portions of the diode.
摘要:
A rectifier is formed by forming a first electrode layer, a semiconductor layer and a second electrode layer. A third electrode layer is formed between the first electrode layer and the semiconductor layer, or between the second electrode layer and the semiconductor layer.The semiconductor layer and the third electrode layer are formed as follows. First, a first layer made from amorphous silicon and including a p-type first semiconductor region and an n-type second semiconductor region is deposited. Next, a second layer made from a metal is deposited on an upper or lower layer of the first layer. The third electrode layer including a metal silicide as a material lattice-matched to polysilicon is formed by siliciding the second layer. Next, the first layer is crystallized. Subsequently, the semiconductor layer is formed by activating an impurity included in the first layer and restoring crystal imperfections included in the first layer.
摘要:
According to one embodiment, a memory device includes first to third interconnects, memory cells, and selectors. The first to third interconnects are provided along first to third directions, respectively. The memory cells includes variable resistance layers formed on two side surfaces, facing each other in the first direction, of the third interconnects. The selectors couple the third interconnects with the first interconnects. One of the selectors includes a semiconductor layer provided between associated one of the third interconnects and associated one of the first interconnects, and gates formed on two side surfaces of the semiconductor layer facing each other in the first direction with gate insulating films interposed therebetween.
摘要:
A memory includes memory cells each includes a resistance change element and a diode, and each memory cell between one of row lines and one of column lines, a first decoder which selects one of the row lines as a selected row line, a second decoder which selects one of the column lines as a selected column line, a voltage pulse generating circuit which generates a voltage pulse, a voltage pulse shaping circuit which makes a rise time and a fall time of the voltage pulse longer, and a control circuit which applies the voltage pulse outputting from the voltage pulse shaping circuit to unselected column lines except the selected column line, and which applies a fixed potential to unselected row lines except the selected row line, in a data writing to a memory cell which is provided between the selected row line and the selected column line.
摘要:
A non-volatile semiconductor memory device according to an aspect of embodiments of the present invention includes a memory cell array including: multiple first wirings; multiple second wirings crossing the multiple first wirings; and multiple electrically rewritable memory cells respectively arranged at intersections of the first wirings and the second wirings, and each formed of a variable resistor which stores a resistance value as data in a non-volatile manner. The non-volatile semiconductor memory device according to an aspect of the embodiments of the present invention further includes a controller for selecting a given one of the memory cells, generating an erase pulse which is used for erasing data, and supplying the erase pulse to the selected memory cell. The erase pulse has a pulse width which is increased or decreased exponentially in accordance with an access path length to the selected memory cell.
摘要:
According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a plurality of first wirings, a plurality of second wirings intersecting the plurality of first wirings, and a plurality of memory cells provided at the intersections of the plurality of first and second wirings and each including a non-ohmic element and a variable resistance element connected in series. The control circuit selects one of the plurality of memory cells, generates an erasing pulse for erasing data from the selected memory cell, and supplies the erasing pulse to the selected memory cell. The control circuit executes data erase by applying a voltage of the erasing pulse to the non-ohmic element in the reverse bias direction.
摘要:
The memory cell is located at respective intersections between the first wirings and the second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The rectifier element includes a p type first semiconductor region, and a n type second semiconductor region. The first semiconductor region is formed of, at least in part, silicon-germanium mixture (Si1-xGex (0