Ultrasensitive Thermo-Mechanical Bolometer
    1.
    发明申请

    公开(公告)号:US20190390950A1

    公开(公告)日:2019-12-26

    申请号:US16449410

    申请日:2019-06-23

    Abstract: A thermo-mechanical bolometer includes a substrate and a sensing component mounted on the substrate. The sensing element comprises (a) at least one thermal-actuation component mounted in parallel with the substrate and (b) a strain sensor mounted on the at least one layer of thermal-actuation component. The at least one thermal-actuation component alone or in combination (a) absorbs electromagnetic waves and converts energy from absorbed electromagnetic waves into a change in temperature and (b) converts the change in temperature into a deformation of the at least one layer. The strain sensor comprises a layer of fragments with a gap space between the fragments, wherein the strain sensor senses the deformation or mechanical movement and exhibits a change in electrical resistance in response to the sensed deformation or mechanical movement.

    OPTICALLY CONTROLLED SEMICONDUCTOR DEVICES

    公开(公告)号:US20240405147A1

    公开(公告)日:2024-12-05

    申请号:US18627725

    申请日:2024-04-05

    Abstract: Described herein is a semiconductor structure, comprising: a drain region; a drift region comprised of a wide band gap material disposed over the drain region; and a channel structure disposed over the drift region. In some embodiments, the channel structure comprises: an optically active material disposed over the drift region, wherein the optically active material generates charge carriers in response to an optical signal; and a source region disposed over the optically active material, wherein in an off state charge carriers in the optically active material are depleted to turn off the semiconductor structure, and in an on state charge carriers in the optically active material conduct a current in the semiconductor structure when an electric field is applied across the source region and drain region, causing the current to substantially flow directly between the source region and the drain region.

    ELECTRONICS INCLUDING GRAPHENE-BASED HYBRID STRUCTURES
    6.
    发明申请
    ELECTRONICS INCLUDING GRAPHENE-BASED HYBRID STRUCTURES 审中-公开
    电子学包括基于石墨的混合结构

    公开(公告)号:US20160284811A1

    公开(公告)日:2016-09-29

    申请号:US15034051

    申请日:2014-11-04

    Abstract: Device are described that include a semiconductor material layer and at least one graphene-based electrode disposed over a portion of the semiconductor material layer, such that the at least one graphene-based electrode forms an overlap region with the semiconductor material layer. The device includes a means for providing charge carriers in the at least one graphene-based electrode proximate to the overlap region, to reduce a difference between a work function of the at least one graphene-based electrode and an electron affinity of the semiconductor material layer, to reduce a Schottky barrier height between the semiconductor material layer and the at least one graphene-based electrode.

    Abstract translation: 描述了包括半导体材料层和设置在半导体材料层的一部分上的至少一个基于石墨烯的电极的装置,使得至少一个基于石墨烯的电极与半导体材料层形成重叠区域。 该器件包括用于在靠近重叠区域的至少一个基于石墨烯的电极中提供电荷载体的装置,以减少至少一个基于石墨烯的电极的功函数与半导体材料层的电子亲和力之间的差异 以降低半导体材料层和至少一个基于石墨烯的电极之间的肖特基势垒高度。

    Optically controlled semiconductor devices

    公开(公告)号:US12176454B1

    公开(公告)日:2024-12-24

    申请号:US18627725

    申请日:2024-04-05

    Abstract: Described herein is a semiconductor structure, comprising: a drain region; a drift region comprised of a wide band gap material disposed over the drain region; and a channel structure disposed over the drift region. In some embodiments, the channel structure comprises: an optically active material disposed over the drift region, wherein the optically active material generates charge carriers in response to an optical signal; and a source region disposed over the optically active material, wherein in an off state charge carriers in the optically active material are depleted to turn off the semiconductor structure, and in an on state charge carriers in the optically active material conduct a current in the semiconductor structure when an electric field is applied across the source region and drain region, causing the current to substantially flow directly between the source region and the drain region.

    Ultrasensitive thermo-mechanical bolometer

    公开(公告)号:US10914637B2

    公开(公告)日:2021-02-09

    申请号:US16449410

    申请日:2019-06-23

    Abstract: A thermo-mechanical bolometer includes a substrate and a sensing component mounted on the substrate. The sensing element comprises (a) at least one thermal-actuation component mounted in parallel with the substrate and (b) a strain sensor mounted on the at least one layer of thermal-actuation component. The at least one thermal-actuation component alone or in combination (a) absorbs electromagnetic waves and converts energy from absorbed electromagnetic waves into a change in temperature and (b) converts the change in temperature into a deformation of the at least one layer. The strain sensor comprises a layer of fragments with a gap space between the fragments, wherein the strain sensor senses the deformation or mechanical movement and exhibits a change in electrical resistance in response to the sensed deformation or mechanical movement.

Patent Agency Ranking