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    INTERCONNECT STRUCTURES WITH PARTIALLY SELF ALIGNED VIAS AND METHODS TO PRODUCE SAME
    1.
    发明申请
    INTERCONNECT STRUCTURES WITH PARTIALLY SELF ALIGNED VIAS AND METHODS TO PRODUCE SAME 审中-公开
    具有部分自对准VIAS的互连结构及其生产方法

    公开(公告)号：US20090200683A1

    公开(公告)日：2009-08-13

    申请号：US12030756

    申请日：2008-02-13

    申请人： Matthew Earl Colburn ,  Nicholas C. Fuller ,  Elbert Huang ,  Satyanarayana V. Nitta

    发明人： Matthew Earl Colburn ,  Nicholas C. Fuller ,  Elbert Huang ,  Satyanarayana V. Nitta

    IPC分类号： H01L23/48 ,  H01L21/4763

    CPC分类号： H01L21/76811 ,  H01L21/76813

    摘要： An interconnect structure having partially self aligned vias with an interlayer dielectric layer on a substrate, containing at least two conducting metal lines that traverse parallel to the substrate and at least two conducting metal vias that are orthogonal to the substrate. A method of producing the self aligned vias by depositing an interlayer dielectric layer onto a substrate, depositing at least one hardmask onto the interlayer dielectric layer, lithographically forming a via pattern with elongated via features and lithographically forming a line pattern in either order, then either transferring the line patterns first into the interlayer dielectric layer forming line features or transferring the via pattern first into the interlayer dielectric layer as long as the patterns overlap to forming self aligned via features, depositing conducting metals and filling regions corresponding to the line and via features, and planarizing and removing excess metal from the line and via features.

    摘要翻译： 具有部分自对准的通孔的互连结构，其中在衬底上具有层间电介质层，其包含至少两条横穿平行于衬底的导电金属线和至少两个与衬底正交的导电金属通孔。 一种通过在衬底上沉积层间电介质层来生产自对准通孔的方法，将至少一个硬掩模沉积到层间电介质层上，以光刻方式形成具有细长通孔特征的通孔图案，并以任何顺序光刻形成线图案，然后 只要图案重叠以形成自对准的通孔特征，沉积导电金属和对应于该线的通孔特征的填充区域，首先将线图案首先转移到层间介质层形成线的特征中或者将该通孔图案转移到层间电介质层中 并且从线和通孔特征平坦化和去除多余的金属。

    Step and flash imprint lithography
    2.
    发明授权
    Step and flash imprint lithography 有权
    步进和闪光刻印光刻

    公开(公告)号：US06334960B1

    公开(公告)日：2002-01-01

    申请号：US09266663

    申请日：1999-03-11

    申请人： Carlton Grant Willson ,  Matthew Earl Colburn

    发明人： Carlton Grant Willson ,  Matthew Earl Colburn

    IPC分类号： B44C122

    CPC分类号： B82Y10/00 ,  B29C43/003 ,  B29C43/021 ,  B29C2043/025 ,  B82Y40/00 ,  G03F7/0002 ,  H05K3/061 ,  Y10S977/887 ,  Y10S977/897

    摘要： A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

    摘要翻译： 在包括基板和形成在其上的转印层的结构中形成浮雕图像的方法包括用可聚合流体组合物覆盖转印层，然后使可聚合流体组合物与其中形成有浮雕结构的模具接触，使得可聚合的 流体组合物填充模具中的浮雕结构。 可聚合流体组合物经受聚合可聚合流体组合物并在转移层上形成固化的聚合物材料的条件。 然后将模具与固体聚合物材料分离，使得在固化的聚合物材料中形成模具中的浮雕结构的复制品; 并且转印层和固化的聚合物材料经受环境以相对于固化的聚合物材料选择性地蚀刻转印层，使得在转印层中形成浮雕图像。

    Step and flash imprint lithography
    6.
    发明授权
    Step and flash imprint lithography 有权
    步进和闪光刻印光刻

    公开(公告)号：US06719915B2

    公开(公告)日：2004-04-13

    申请号：US09908765

    申请日：2001-07-19

    申请人： Carlton Grant Willson ,  Matthew Earl Colburn

    发明人： Carlton Grant Willson ,  Matthew Earl Colburn

    IPC分类号： B44C122

    CPC分类号： B82Y10/00 ,  B29C43/003 ,  B29C43/021 ,  B29C2043/025 ,  B82Y40/00 ,  G03F7/0002 ,  H05K3/061 ,  Y10S977/887 ,  Y10S977/897

    摘要： A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

    摘要翻译： 在包括基板和形成在其上的转印层的结构中形成浮雕图像的方法包括用可聚合流体组合物覆盖转印层，然后使可聚合流体组合物与其中形成有浮雕结构的模具接触，使得可聚合的 流体组合物填充模具中的浮雕结构。 可聚合流体组合物经受聚合可聚合流体组合物并在转移层上形成固化的聚合物材料的条件。 然后将模具与固体聚合物材料分离，使得在固化的聚合物材料中形成模具中的浮雕结构的复制品; 并且转印层和固化的聚合物材料经受环境以相对于固化的聚合物材料选择性地蚀刻转印层，使得在转印层中形成浮雕图像。