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公开(公告)号：US06983097B2
公开(公告)日：2006-01-03
申请号：US10840846
申请日：2004-05-07
CPC分类号： G02B6/43 , G02B6/2746 , G02B6/2848
摘要： A system and method are disclosed for an optical backplane in an electronic processor that comprises of a plurality of processing units. The backplane is comprising of a network of optical waveguides which can guide polarized light. Furthermore, the backplane has magneto optic routers for steering light at the vertexes of the network, and the backplane also has optical devices for operationally connecting the processing units to the network. The backplane network affords an optical interconnection amongst all of the processing units.
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公开(公告)号：US06816637B2
公开(公告)日：2004-11-09
申请号：US10073450
申请日：2002-02-11
IPC分类号： G02B627
CPC分类号： G02B6/43 , G02B6/2746 , G02B6/2848
摘要： A system and method are disclosed for an optical backplane in an electronic processor that comprises of a plurality of processing units. The backplane is comprising of a network of optical waveguides which can guide polarized light. Furthermore, the backplane has magneto optic routers for steering light at the vertexes of the network, and the backplane also has optical devices for operationally connecting the processing units to the network. The backplane network affords an optical interconnection amongst all of the processing units.
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公开(公告)号：US07197207B2
公开(公告)日：2007-03-27
申请号：US10091515
申请日：2002-03-07
IPC分类号： G02B6/26
CPC分类号： G02B6/4206 , G02B6/4214 , G02B2006/12142
摘要： An apparatus (and method) for launching a modulated optical signal, includes a waveguide, an antenna structure for communicating with the waveguide and with an externally-applied optical field and having an output port, and an electrically-variable-impedance device connected at the antenna's output port, capable of responding at a frequency of an externally-applied optical field and having its impedance at the optical frequency changed by an applied electrical signal.
摘要翻译： 一种用于发射调制光信号的装置（和方法）包括波导，用于与波导进行通信并具有外部施加的光场并具有输出端口的天线结构，以及连接在该可变阻抗装置上的电可变阻抗装置 天线的输出端口，能够以外部施加的光场的频率进行响应，并且其在光频率处的阻抗由施加的电信号改变。
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公开(公告)号：US08877566B2
公开(公告)日：2014-11-04
申请号：US13586421
申请日：2012-08-15
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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公开(公告)号：US20100252775A1
公开(公告)日：2010-10-07
申请号：US12819697
申请日：2010-06-21
CPC分类号： C09K13/04
摘要： An indium cap layer is formed by blanket depositing indium onto a surface of metallic interconnects separated by interlayer dielectric, and then selectively chemically etching the indium located on the interlayer dielectric leaving an indium cap layer. Etchants containing a strong acid are provided for selectively removing the indium.
摘要翻译： 通过在由层间电介质分离的金属互连件的表面上覆盖沉积铟，然后选择性地化学蚀刻位于层间电介质上的铟而形成铟盖层，留下铟盖层。 提供含有强酸的蚀刻剂用于选择性地除去铟。
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公开(公告)号：US07412134B2
公开(公告)日：2008-08-12
申请号：US11540268
申请日：2006-09-30
IPC分类号： G02B6/34
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译： 描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。 外层在其内表面具有光栅结构，其空间频率与导向模式相同。 内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。 通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。 这导致两个波导的变形，使得光栅与芯接近。 光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。 输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。 因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。
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公开(公告)号：US07115996B2
公开(公告)日：2006-10-03
申请号：US10852142
申请日：2004-05-25
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.
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8.发明授权Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权选择性地与铟或锡青铜和/或其氧化物覆盖互连的方法以及如此封闭的互连公开(公告)号：US06784088B2
公开(公告)日：2004-08-31
申请号：US10345288
申请日：2003-01-16
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L2144
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
摘要翻译： 一种用Cu / Sn / Au合金选择性地覆盖铜合金BEOL端子焊盘的方法。 该方法包括提供一个或多个Cu BEOL端子焊盘并且用焊锡涂覆Sn涂层，然后用Au涂层涂覆Sn。 然后将涂覆的焊盘退火以形成Cu / Sn / Au封盖合金。
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公开(公告)号：US09143259B2
公开(公告)日：2015-09-22
申请号：US13597763
申请日：2012-08-29
CPC分类号： H04J14/00 , H04B10/801 , H04Q11/0005 , H04Q11/0066 , H04Q2011/0073
摘要： A system and method for optical switching of networks in a multi-node computing system with programmable magneto-optical switches that enable optical signal routing on optical pathways. The system includes a network of optical links interconnecting nodes with switching elements that are controlled by electrical control signals. Data transmission is along the optical links and an optical pathway is determined by the electrical control signals which are launched ahead of optical signal. If links are available, an optical pathway is reserved, and the electrical signal sets the necessary optical switches for the particular optical pathway. There is thereby eliminated the need for optical-electrical-optical conversion at each node in order to route data packets through the network. If a link or optical pathway is not available the system tries to find an alternative path. If no alternative path is available, the system reserves buffering. After transmission, all reservations are released.
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10.发明申请公开(公告)号：US20120309132A1
公开(公告)日：2012-12-06
申请号：US13586421
申请日：2012-08-15
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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