摘要:
A semiconductor memory device is disclosed. In one particular exemplary embodiment, the semiconductor memory device includes a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region connected to a source line extending in a first orientation. Each memory cell may also include a second region connected to a bit line extending a second orientation. Each memory cell may further include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The semiconductor device may also include a first barrier wall extending in the first orientation and a second barrier wall extending in the second orientation and intersecting with the first barrier wall to form a trench region configured to accommodate each of the plurality of memory cells.
摘要:
Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region connected to a source line extending in a first orientation. Each memory cell may also include a second region connected to a bit line extending a second orientation. Each memory cell may further include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The semiconductor device may also include a first barrier wall extending in the first orientation of the array and a second barrier wall extending in the second orientation of the array and intersecting with the first barrier wall to form a trench region configured to accommodate each of the plurality of memory cells.
摘要:
In accordance with an embodiment of the present invention, a method of operating a resistive switching device includes applying a signal including a pulse on a first access terminal of an access device having the first access terminal and a second access terminal. The second access terminal is coupled to a first terminal of a two terminal resistive switching device. The resistive switching device has the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period, a second ramp from the second voltage to a third voltage over a second time period, and a third ramp from the third voltage to a fourth voltage over a third time period. The second ramp and the third ramp have an opposite slope to the first ramp. The sum of the first time period and the second time period is less than the third time period.
摘要:
Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region.
摘要:
Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other.
摘要:
Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other.
摘要:
Systems, methods, and/or devices that facilitate accessing data from memory are presented. An adaptive detection component can be employed to reduce or minimize detection error and distinguish information stored in memory cells during read operations. A decoder component can include the adaptive detection component, which can employ an adaptive Linde-Buzo-Gray (LBG) algorithm. The decoder component can receive information associated with a current level from a memory location during a read operation, and can analyze and process such information. The adaptive detection component can receive the processed information and, along with other information, can process such information using the iterative LBG algorithm until reconstruction levels and corresponding threshold levels are determined. Such reconstruction levels and/or threshold levels can be compared to the value associated with the information read from the memory location to determine the data value of the data in the memory location.
摘要:
One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.
摘要:
A flash memory formed by a process wherein at least two parallel stacked gate strips are formed on a silicon substrate such that the stacked gate strips are separated by field oxide islands. Asymmetrical first and second junctions are formed in each of a set of source/drain regions and a chemical etch is applied to form the field oxide islands into oxide spacers that align a dual-function control line to the first and second junctions. The resulting flash memory includes a plurality of stacked gate islands, one or more source/drain regions between at least a subset of the plurality of stacked gate islands, first junctions in each of the source/drain regions, second junctions in each of the source/drain regions and dual function control lines in the source/drain regions.
摘要:
The present invention discloses methods and systems for generating a bias voltage during an Automatic Program Disturb Erase Verify (APDEV) operation in a memory device. During the APDEV operation, a predetermined supply voltage is generated by a regulated power supply. The predetermined supply voltage is directed to a temperature-compensated bias generator circuit. The temperature-compensated bias generator circuit is activated to generate the bias voltage based on the operating temperature of the memory device.