摘要:
An over-erased bit correction structure is provided for performing a correction operation on over-erased memory cells in an array of flash EEPROM memory cells during programming operations so as to render high endurance. Sensing circuitry (23) is used to detect column leakage current indicative of an over-erased bit. If an over-erased bit is determined, a pulse counter (25) is activated so as to apply programming pulses to the control gate of the selected memory cell so as to program back the negative threshold voltage of the over-erased bit to a positive voltage.
摘要:
A flash EEPROM cell array is erased by applying a zero reference voltage to the bulk substrate of the cell, a relatively high negative voltage to the control gate of the cell and a relatively low positive voltage to the source region of the cell. Because of a relatively low reverse voltage developed between the source region of the cell and the bulk substrate, the generation of hot holes is inhibited and improved performance may be obtained. The source region is preferably single diffused rather than double-diffused so that the cell can occupy a minimum area for a given design rule. The low positive voltage applied to the source is preferably less than or equal to the voltage, V.sub.CC presented at a +5V chip power supply pin. This makes it possible for the +5V pin to directly supply source current during erasure.
摘要:
A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a semiconductor substrate, and a plurality of field effect transistor memory cells each having a source, drain, floating gate and control gate formed on the substrate. A controller controls a power source to apply an operational pulse to the drain of a cell, and apply a source to substrate bias voltage to the cell while the operational pulse is being applied thereto, the bias voltage having a value selected to reduce or substantially eliminate leakage current in the cell. The operational pulse can be an overerase correction pulse. In this case, a voltage which is substantially equal to the bias voltage is applied to the control gate for the duration of the overerase correction pulse. The operational pulse can also be a programming pulse. In this case, a voltage which is higher than the bias voltage is applied to the control gate of the selected wordline for the duration of the programming pulse. The bias voltage is preferably applied during both the overerase correction and programming pulses, reducing the power requirements and reducing the background leakage of the cells to a level at which program, read and overerase correction operations can be operatively performed.
摘要:
A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of floating gate transistor memory cells, a plurality of wordlines connected to the cells and a power supply for generating erase pulses. A controller controls the power supply to apply an erase pulse to all wordlines which are not deselected. Then, an erase verify procedure is applied to the cells in sequence. If all cells connected to a wordline pass the erase verify test, the wordline is deselected such that subsequent erase pulses will not be applied to the wordline and possibly cause the cells to become overerased. In one embodiment of the invention, erase verify is performed on all of the cells after an erase pulse is applied. The erase operation is completed when all cells pass erase verify. In another embodiment, erase verify is applied to each cell in sequence, with erase pulses being applied until each current cell passes erase verify. The wordlines can be deselected individually or in groups. The invention results in a tightening of the threshold voltage distribution of the cells.
摘要:
A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of field effect transistor memory cells each having a source, drain, floating gate and control gate, and a power source for supplying a plurality of voltages to the cells. A controller controls the power source to apply at least one erase pulse to the cells. Then, at least one overerase correction or "soft programming" pulse is applied to the cells during which the source, drain and control gate voltages of the cells are such that the threshold voltages of overerased cells will be increased, but least erased cells will not be disturbed. The overerase correction pulses thereby tighten the threshold voltage distribution. A source to substrate bias voltage is applied for the duration of the overerase correction pulses which reduces the background leakage of the cells to a level at which the overerase correction operation can be effectively performed, even in applications with low supply voltages.
摘要:
A method for making a ULSI MOSFET includes covering core gate stacks with a first protective layer, etching away the first layer such that intended source regions of the substrate are exposed, and implanting dopant into the source regions. A second protective layer is then deposited over the first layer and is etched back to conform to the first layer, covering only the sides of the gate stacks, and exposing intended drain regions of the substrate. Dopant is then implanted into the drain regions. During subsequent manufacturing steps including ILD formation and metallization, mobile ions and other process-induced charges are blocked from entering the floating gates of the gate stacks by the protective layers, thereby preventing unwanted charge gain/loss.
摘要:
A method of erasing a flash electrically-erasable programmable read-only memory (EEPROM) device is provided which includes a plurality of memory cells. An erase pulse is applied to the plurality of memory cells. The plurality of memory cells is overerase verified and an overerase correction pulse is applied to the bitline to which the overerased memory cell is attached. This cycle is repeated until all cells verify as not being overerased. The plurality of memory cells is erase verified and another erase pulse is applied to the memory cells if there are undererased memory cells and the memory cells are again erase verified. This cycle is repeated until all cells verify as not being undererased. After erase verify is completed, the plurality of memory cells is soft program verified and a soft programming pulse is applied to the those memory cells in the plurality of memory cells which have a threshold voltage below a pre-defined minimum value. This cycle is repeated until all of those memory cells in the plurality of memory cells which have a threshold voltage below the pre-defined minimum value are brought above the pre-defined minimum value. The erase method is considered to be finished when there are no memory cells in the plurality of memory cells which have a threshold voltage below the pre-defined minimum value.
摘要:
A plurality of core gate stacks and periphery gates on the substrate, each core gate stack and periphery gate having at least one side and first and second protective shoulders formed on said plurality of core gate stacks and periphery gates, such that a dopant can be implanted sequentially into source and drain regions of a substrate supporting the stacks to establish transistors and such that charge migration into said at least one side of the gate stacks during interlayer dielectric (ILD) formation and device metallization is prevented, at least the second shoulder being frabricated from at least one material selected from a group consisting essentially of nitride and silicon oxynitride (SiON).
摘要:
A method for making a ULSI MOSFET includes covering core gate stacks with a first protective layer, etching away the first layer such that intended source regions of the substrate are exposed, and implanting dopant into the source regions. A second protective layer is then deposited over the first layer and is etched back to conform to the first layer, covering only the sides of the gate stacks, and exposing intended drain regions of the substrate. Dopant is then implanted into the drain regions. During subsequent manufacturing steps including ILD formation and metallization, mobile ions and other process-induced charges are blocked from entering the floating gates of the gate stacks by the protective layers, thereby preventing unwanted charge gain/loss.
摘要:
Disclosed herein is a channel hot-carrier page write including an array of stacked gate flash EEPROM memory cells operating in a very low energy programming mode permitting page writing of 1024 bits within a 20-100 .mu.S programming interval. Internal programming voltage levels are derived from on-chip circuits, such as charge pumps, operated from a single +V.sub.CC source. In a preferred embodiment, a cache memory buffers data transfers between a computer bus and the page oriented storage array. In another embodiment, core doping is increased in the channel and drain regions to enhance hot carrier injection and to lower the programming drain voltage. The stacked floating gate structure is shown to exhibit a high programming efficiency in a range from 10.sup.-6 to 10.sup.-4 at drain voltages below 5.2 VDC. In another embodiment AC components of the programming current are minimized by precharging a common source line at the start of a programming cycle.