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公开(公告)号：US06567153B1
公开(公告)日：2003-05-20
申请号：US09692685
申请日：2000-10-19
IPC分类号： G03B2742
CPC分类号： G03F7/70283 , G03F7/70325 , G03F7/70333
摘要： A multiple image photolithography system includes a radiation source (18) projecting electromagnetic radiation along a path. A reticle cartridge (26) is located in the path of the projected radiation. The cartridge (26) includes a photomask (34,36) located in the path of the projected radiation and a Fabry-Perot interferometer (54) located in the path of the projected radiation. A radiation-sensitive material (30) is located in the path of the projected radiation such that the projected radiation encounters the reticle cartridge (26) before the projected radiation encounters the radiation-sensitive material (30).
摘要翻译： 多图像光刻系统包括沿着路径投射电磁辐射的辐射源（18）。 标线盒（26）位于投影辐射的路径中。 盒（26）包括位于投影辐射的路径中的光掩模（34,36）和位于投影辐射路径中的法布里 - 珀罗干涉仪（54）。 辐射敏感材料（30）位于投影辐射的路径中，使得投射的辐射在投影辐射遇到辐射敏感材料（30）之前遇到光罩盒（26）。
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公开(公告)号：US06741333B2
公开(公告)日：2004-05-25
申请号：US10406030
申请日：2003-04-02
IPC分类号： G03B2762
CPC分类号： G03F7/70283 , G03F7/70325 , G03F7/70333
摘要： A multiple image photolithography system includes a radiation source (18) projecting electromagnetic radiation along a path. A reticle cartridge (26) is located in the path of the projected radiation. The cartridge (26) includes a photomask (34,36) located in the path of the projected radiation and a Fabry-Perot interferometer (54) located in the path of the projected radiation. A radiation-sensitive material (30) is located in the path of the projected radiation such that the projected radiation encounters the reticle cartridge (26) before the projected radiation encounters the radiation-sensitive material (30).
摘要翻译： 多图像光刻系统包括沿着路径投射电磁辐射的辐射源（18）。 标线盒（26）位于投影辐射的路径中。 盒（26）包括位于投影辐射的路径中的光掩模（34,36）和位于投影辐射路径中的法布里 - 珀罗干涉仪（54）。 辐射敏感材料（30）位于投影辐射的路径中，使得投射的辐射在投影辐射遇到辐射敏感材料（30）之前遇到光罩盒（26）。
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3.发明授权Methods for controlling microloading variation in semiconductor wafer layout and fabrication 有权用于控制半导体晶片布局和制造中的微加载变化的方法公开(公告)号：US09122832B2
公开(公告)日：2015-09-01
申请号：US12512932
申请日：2009-07-30
申请人： Brian Reed , Michael C. Smayling , Scott T. Becker
发明人： Brian Reed , Michael C. Smayling , Scott T. Becker
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G06F2217/12 , Y02P90/265
摘要： Problematic open areas are identified in a semiconductor wafer layout. The problematic open areas have a size variation relative to one or more neighboring open areas of the layout sufficient to cause adverse microloading variation. In one embodiment, the adverse microloading variation is controlled by shifting a number of layout features to interdict the problematic open areas. In another embodiment, the adverse microloading variation is controlled by defining and placing a number of dummy layout features to shield actual layout features that neighbor the problematic open areas. In another embodiment, the adverse microloading variation is controlled by utilizing sacrificial layout features which are actually fabricated on the wafer temporarily to eliminate microloading variation, and which are subsequently removed from the wafer to leave behind the desired permanent structures.
摘要翻译： 在半导体晶片布局中识别有问题的开放区域。 有问题的开放区域相对于布局的一个或多个相邻开放区域具有尺寸变化，足以导致不利的微加载变化。 在一个实施例中，通过移动多个布局特征来阻止有问题的开放区域来控制不利的微加载变化。 在另一个实施例中，通过限定和放置多个虚拟布局特征来屏蔽相邻有问题的开放区域的实际布局特征来控制不利的微加载变化。 在另一个实施例中，通过利用实际上在晶片上制造的牺牲布局特征来暂时控制不利的微加载变化，以消除微载荷变化，并且随后从晶片中移除留下期望的永久结构。
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公开(公告)号：US09009641B2
公开(公告)日：2015-04-14
申请号：US13740191
申请日：2013-01-12
申请人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
发明人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
IPC分类号： G06F17/50 , H01L27/088 , H01L27/092 , H01L21/36 , H01L21/8238 , H01L29/78
CPC分类号： H01L27/0886 , G06F17/5068 , G06F17/5072 , G06F2217/12 , H01L21/02521 , H01L21/823821 , H01L27/092 , H01L27/0924 , H01L29/7853 , Y02P90/265
摘要： A first transistor has source and drain regions within a first diffusion fin. The first diffusion fin projects from a surface of a substrate. The first diffusion fin extends lengthwise in a first direction from a first end to a second end of the first diffusion fin. A second transistor has source and drain regions within a second diffusion fin. The second diffusion fin projects from the surface of the substrate. The second diffusion fin extends lengthwise in the first direction from a first end to a second end of the second diffusion fin. The second diffusion fin is positioned next to and spaced apart from the first diffusion fin. Either the first end or the second end of the second diffusion fin is positioned in the first direction between the first end and the second end of the first diffusion fin.
摘要翻译： 第一晶体管具有在第一扩散鳍内的源区和漏区。 第一扩散鳍片从衬底的表面突出。 第一扩散鳍从第一扩散翅片的第一端到第二端在第一方向上纵向延伸。 第二晶体管具有在第二扩散鳍内的源区和漏区。 第二扩散鳍片从衬底的表面突出。 第二扩散翅片在第一方向上从第二扩散鳍片的第一端部延伸到第二端部的纵向延伸。 第二扩散翅片位于第一扩散鳍的旁边并与之隔开。 第二扩散翅片的第一端或第二端都位于第一扩散鳍片的第一端和第二端之间的第一方向上。
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公开(公告)号：US08863063B2
公开(公告)日：2014-10-14
申请号：US13841951
申请日：2013-03-15
申请人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
发明人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
IPC分类号： G06F17/50
CPC分类号： H01L27/0886 , G06F17/5068 , G06F17/5072 , G06F2217/12 , H01L21/02521 , H01L21/823821 , H01L27/092 , H01L27/0924 , H01L29/7853 , Y02P90/265
摘要： A first gate level feature forms gate electrodes of a first finfet transistor of a first transistor type and a first finfet transistor of a second transistor type. A second gate level feature forms a gate electrode of a second finfet transistor of the first transistor type. A third gate level feature forms a gate electrode of a second finfet transistor of the second transistor type. The gate electrodes of the second finfet transistors of the first and second transistor types are electrically connected to each other. The gate electrodes of the second finfet transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first finfet transistors of the first and second transistor types are positioned.
摘要翻译： 第一栅极级特征形成第一晶体管类型的第一鳍状晶体管和第二晶体管类型的第一鳍式晶体管的栅电极。 第二栅极级特征形成第一晶体管类型的第二鳍状晶体管的栅电极。 第三栅极电平特征形成第二晶体管类型的第二鳍状晶体管的栅电极。 第一和第二晶体管类型的第二finfet晶体管的栅电极彼此电连接。 第一和第二晶体管类型的第二finfet晶体管的栅电极位于栅极电极轨道的相对侧上，第一和第二晶体管类型的第一finfet晶体管的栅电极沿着栅电极轨道定位。
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6.发明授权Semiconductor device with dynamic array sections defined and placed according to manufacturing assurance halos 有权具有根据制造保证光环定义和放置的动态阵列部分的半导体器件公开(公告)号：US08759882B2
公开(公告)日：2014-06-24
申请号：US13007582
申请日：2011-01-14
IPC分类号： H01L27/118
CPC分类号： H01L27/11807 , G06F17/5068 , G06F2217/12 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L2027/1182 , H01L2027/11866 , H01L2027/11874 , H01L2027/11888 , Y02P90/265
摘要： An integrated circuit device includes a plurality of dynamic array sections, each of which includes three or more linear conductive segments formed within its gate electrode level in a parallel manner to extend lengthwise in a first direction. An adjoining pair of dynamic array sections are positioned to have co-located portions of outer peripheral boundary segments extending perpendicular to the first direction. Some of the three or more linear conductive segments within the gate electrode levels of the adjoining pair of dynamic array sections are co-aligned in the first direction and separated by an end-to-end spacing that spans the co-located portions of outer peripheral boundary segments of the adjoining pair of dynamic array sections. Each of these end-to-end spacings is sized to ensure that each gate electrode level manufacturing assurance halo portion of the first adjoining pair of dynamic array sections is devoid of the co-aligned linear conductive segments.
摘要翻译： 集成电路器件包括多个动态阵列部分，每个部分包括三个或更多个以其平行方式在其栅极电平内形成的线性导电部分，以沿第一方向纵向延伸。 相邻的一对动态阵列部分被定位成具有垂直于第一方向延伸的外周边界段的共同定位部分。 相邻的一对动态阵列部分的栅极电极层内的三个或更多个线性导电段中的一些在第一方向上共同对准并且由端对端间隔分开，该间隔跨越外周的共同定位部分 相邻的一对动态阵列部分的边界段。 这些端对端间隔中的每一个的尺寸被确定为确保第一相邻的一对动态阵列部分的每个栅电极级制造保证光晕部分没有共对齐的线性导电段。
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公开(公告)号：US08541879B2
公开(公告)日：2013-09-24
申请号：US11956305
申请日：2007-12-13
申请人： Michael C. Smayling
发明人： Michael C. Smayling
IPC分类号： H01L23/48
CPC分类号： H01L27/092 , H01L21/31144 , H01L21/76801 , H01L21/76816 , H01L21/76879 , H01L21/76897 , H01L21/823475 , H01L21/823807 , H01L21/823828 , H01L23/481 , H01L27/0207 , H01L29/0649 , H01L29/1095 , H01L29/42376 , H01L29/4933 , H01L2924/0002 , H01L2924/00
摘要： A number of first hard mask portions are formed on a dielectric layer to vertically shadow a respective one of a number of underlying gate structures. A number of second hard mask filaments are formed adjacent to each side surface of each first hard mask portion. A width of each second hard mask filament is set to define an active area contact-to-gate structure spacing. A first passage is etched between facing exposed side surfaces of a given pair of neighboring second hard mask filaments and through a depth of the semiconductor wafer to an active area. A second passage is etched through a given first hard mask portion and through a depth of the semiconductor wafer to a top surface of the underlying gate structure. An electrically conductive material is deposited within both the first and second passages to respectively form an active area contact and a gate contact.
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公开(公告)号：US20130207199A1
公开(公告)日：2013-08-15
申请号：US13841951
申请日：2013-03-15
申请人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
发明人： Scott T. Becker , Michael C. Smayling , Dhrumil Gandhi , Jim Mali , Carole Lambert , Jonathan R. Quandt , Daryl Fox
IPC分类号： H01L27/088 , G06F17/50
CPC分类号： H01L27/0886 , G06F17/5068 , G06F17/5072 , G06F2217/12 , H01L21/02521 , H01L21/823821 , H01L27/092 , H01L27/0924 , H01L29/7853 , Y02P90/265
摘要： A first gate level feature forms gate electrodes of a first finfet transistor of a first transistor type and a first finfet transistor of a second transistor type. A second gate level feature forms a gate electrode of a second finfet transistor of the first transistor type. A third gate level feature forms a gate electrode of a second finfet transistor of the second transistor type. The gate electrodes of the second finfet transistors of the first and second transistor types are electrically connected to each other. The gate electrodes of the second finfet transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first finfet transistors of the first and second transistor types are positioned.
摘要翻译： 第一栅极级特征形成第一晶体管类型的第一鳍状晶体管和第二晶体管类型的第一鳍式晶体管的栅电极。 第二栅极电平特征形成第一晶体管类型的第二鳍状晶体管的栅电极。 第三栅极电平特征形成第二晶体管类型的第二鳍状晶体管的栅电极。 第一和第二晶体管类型的第二finfet晶体管的栅电极彼此电连接。 第一和第二晶体管类型的第二finfet晶体管的栅电极位于栅极电极轨道的相对侧上，第一和第二晶体管类型的第一finfet晶体管的栅电极沿着栅电极轨道定位。
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9.发明授权Semiconductor device with dynamic array sections defined and placed according to manufacturing assurance halos 有权具有根据制造保证光环定义和放置的动态阵列部分的半导体器件公开(公告)号：US08283701B2
公开(公告)日：2012-10-09
申请号：US13007584
申请日：2011-01-14
IPC分类号： H01L27/10 , H01L29/739 , H01L29/73 , H01L29/74 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L27/11807 , G06F17/5068 , G06F2217/12 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L2027/1182 , H01L2027/11866 , H01L2027/11874 , H01L2027/11888 , Y02P90/265
摘要： An integrated circuit device includes a plurality of dynamic array sections, each of which includes three or more linear conductive segments formed within its gate electrode level in a parallel manner to extend lengthwise in a first direction. An adjoining pair of dynamic array sections are positioned to have co-located portions of outer peripheral boundary segments extending in the first direction. At least one of the linear conductive segments within the gate electrode level of a given dynamic array section is a non-gate linear conductive segment that does not form a gate electrode of a transistor. The non-gate linear conductive segment of either of the adjoining pair of dynamic array sections spans the co-located portion of outer peripheral boundary segment toward the other of the adjoining pair of dynamic array sections, and is contained within gate electrode level manufacturing assurance halo portions of the adjoining pair of dynamic array sections.
摘要翻译： 集成电路器件包括多个动态阵列部分，每个部分包括三个或更多个以其平行方式在其栅极电平内形成的线性导电部分，以沿第一方向纵向延伸。 相邻的一对动态阵列部分被定位成具有在第一方向上延伸的外周边界段的共同定位部分。 给定动态阵列部分的栅极电平内的至少一个线性导电段是不形成晶体管的栅电极的非栅极线性导电段。 相邻的一对动态阵列部分中的任一个的非栅极线性导电部分跨越相邻的一对动态阵列部分中的另一个的外周边界段的共同定位部分，并且包含在栅电极级制造保证光晕 相邻的一对动态阵列部分的部分。
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10.发明授权Semiconductor device including at least six transistor forming linear shapes with at least two transistor forming linear shapes having offset ends 有权半导体器件包括至少六个形成具有至少两个晶体管的晶体管形成线形的晶体管，其形成具有偏移端的线公开(公告)号：US08258552B2
公开(公告)日：2012-09-04
申请号：US12572243
申请日：2009-10-01
IPC分类号： H01L27/10
CPC分类号： H01L27/11807 , G06F17/5068 , G06F17/5072 , H01L21/28123 , H01L21/823871 , H01L23/5226 , H01L23/5283 , H01L27/0207 , H01L27/088 , H01L27/092 , H01L29/42372 , H01L29/42376 , H01L2027/11812 , H01L2027/11814 , H01L2027/11855 , H01L2027/11861 , H01L2027/11862 , H01L2027/11864 , H01L2027/11866 , H01L2027/11875 , H01L2027/11887 , H01L2027/11888 , H01L2924/0002 , H01L2924/00
摘要： A cell of a semiconductor device includes a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell includes a gate electrode level including conductive features defined to extend in only a first parallel direction. Adjacent conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal and minimized across the gate electrode level region. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight. A width of the conductive features within a five wavelength photolithographic interaction radius is less than a wavelength of light of 193 nanometers as used in a photolithography process for their fabrication.
摘要翻译： 半导体器件的单元包括扩散级，包括由非活性区分隔的多个扩散区。 电池包括栅极电极级，其包括限定为仅在第一平行方向上延伸的导电特征。 在相同的起始布局特征中，通过端对端间隔彼此分离的相应的导电特征，其在第一平行方向上共享共同的范围的相邻导电特征，其尺寸基本相等并且跨越栅极电极级最小化 地区。 一些导电特征形成相应的PMOS和/或NMOS晶体管器件。 单元中的PMOS和NMOS晶体管器件的总数大于或等于8。 在五波长光刻相互作用半径内的导电特征的宽度小于用于其制造的光刻工艺中使用的193纳米的光的波长。
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