Solid state light-emitting device
    1.
    发明授权
    Solid state light-emitting device 失效
    固态发光装置

    公开(公告)号:US06548836B1

    公开(公告)日:2003-04-15

    申请号:US09303101

    申请日:1999-04-29

    IPC分类号: H01L3300

    摘要: A solid state light-emitting device having a high maximum luminance, a high external efficiency, and a low operating voltage is described. The device can include a solid layer, a first inert electrode, and a second inert electrode. The solid layer includes a metal complex and has a first surface and a second surface. The first inert electrode contacts the first surface of the solid layer. The second inert electrode contacts the second surface of the solid layer. The device can have a luminance of at least 50 cd/m2 at a potential of between 2.5 and 5.0 V.

    摘要翻译: 描述了具有高最大亮度,高外部效率和低工作电压的固态发光器件。 该装置可以包括固体层,第一惰性电极和第二惰性电极。 固体层包括金属络合物并具有第一表面和第二表面。 第一惰性电极接触固体层的第一表面。 第二惰性电极接触固体层的第二表面。 在2.5至5.0V之间的电位下,器件可以具有至少50cd / m 2的亮度。

    Arbitrarily-shaped multifunctional structures and method of making
    2.
    发明授权
    Arbitrarily-shaped multifunctional structures and method of making 有权
    任意形状的多功能结构及制作方法

    公开(公告)号:US08405561B2

    公开(公告)日:2013-03-26

    申请号:US11672972

    申请日:2007-02-09

    IPC分类号: H01Q1/28 H01Q1/32

    摘要: Multifunctional structures and methods of manufacturing multifunctional structures which function as both electronic devices and load-bearing elements are disclosed. The load-bearing elements are designed to have electronic functionality using electronics designed to be load-bearing. The method of manufacturing the multifunctional structure comprises forming an electronic element directly on at least one ply of arbitrarily shaped load-bearing material using conventional lithographic techniques and/or direct write fabrication techniques, and assembling at least two plies of arbitrarily shaped load-bearing material into a multifunctional structure. The multifunctional structure may be part of an aerospace structure, part of a land vehicle, part of a watercraft or part of a spacecraft.

    摘要翻译: 公开了用作电子装置和承载元件两者的多功能结构和制造多功能结构的方法。 承载元件设计为具有使用设计为承载的电子电子功能。 制造多功能结构的方法包括使用常规的平版印刷技术和/或直接写入制造技术直接在任意形状的承载材料的至少一层上形成电子元件,并组装至少两层任意形状的承载材料 成为多功能结构。 多功能结构可以是航空航天结构的一部分,陆地车辆的一部分,船舶的一部分或航天器的一部分。

    Laser transfer article and method of making
    6.
    发明授权
    Laser transfer article and method of making 有权
    激光转印制品及其制作方法

    公开(公告)号:US07423286B2

    公开(公告)日:2008-09-09

    申请号:US10935461

    申请日:2004-09-07

    IPC分类号: H01L23/58 H01L29/10

    摘要: The present invention is directed to methods for transferring pre-formed electronic devices, such as transistors, resistors, capacitors, diodes, semiconductors, inductors, conductors, and dielectrics, and segments of materials, such as magnetic materials and crystalline materials onto a variety of receiving substrates using energetic beam transfer methods. Also provided is a consumable intermediate comprising a transfer substrate and a transfer material coated thereon, wherein the transfer material may be comprised of pre-formed electronic devices or magnetic materials and crystalline materials that may be transferred to a variety of receiving substrates. Aspects of the present invention may also be used to form multi-device electronic components such as sensor devices, electro-optical devices, communications devices, transmit-receive modules, and phased arrays using the consumable intermediates and transfer methods described herein.

    摘要翻译: 本发明涉及用于将诸如晶体管,电阻器,电容器,二极管,半导体,电感器,导体和电介质的预成型电子器件和诸如磁性材料和结晶材料的材料段转移到各种 使用能量束传递方法接收衬底。 还提供了包括转印基材和涂覆在其上的转印材料的消耗性中间体,其中转印材料可以由预先形成的电子器件或磁性材料以及可以转移到各种接收基底的结晶材料构成。 本发明的各方面也可用于使用本文描述的可消耗的中间体和转移方法来形成诸如传感器装置,电光装置,通信装置,发射 - 接收模块和相控阵列的多装置电子部件。

    ARBITRARILY-SHAPED MULTIFUNCTIONAL STRUCTURES AND METHOD OF MAKING
    8.
    发明申请
    ARBITRARILY-SHAPED MULTIFUNCTIONAL STRUCTURES AND METHOD OF MAKING 有权
    ARBITRARILY形状的多功能结构和制作方法

    公开(公告)号:US20080218416A1

    公开(公告)日:2008-09-11

    申请号:US11672972

    申请日:2007-02-09

    摘要: Multifunctional structures and methods of manufacturing multifunctional structures which function as both electronic devices and load-bearing elements are disclosed. The load-bearing elements are designed to have electronic functionality using electronics designed to be load-bearing. The method of manufacturing the multifunctional structure comprises forming an electronic element directly on at least one ply of arbitrarily shaped load-bearing material using conventional lithographic techniques and/or direct write fabrication techniques, and assembling at least two plies of arbitrarily shaped load-bearing material into a multifunctional structure. The multifunctional structure may be part of an aerospace structure, part of a land vehicle, pan of a watercraft or part of a spacecraft.

    摘要翻译: 公开了用作电子装置和承载元件两者的多功能结构和制造多功能结构的方法。 承载元件设计为具有使用设计为承载的电子电子功能。 制造多功能结构的方法包括使用常规的平版印刷技术和/或直接写入制造技术直接在任意形状的承载材料的至少一层上形成电子元件,并组装至少两层任意形状的承载材料 成为多功能结构。 多功能结构可以是航空航天结构的一部分,陆地车辆的一部分,船舶的一部分或航天器的一部分。