Application of InAIAs double-layer to block dopant out-diffusion in III-V device Fabrication
    2.
    发明授权
    Application of InAIAs double-layer to block dopant out-diffusion in III-V device Fabrication 有权
    InAIAs双层在III-V器件制造中阻挡掺杂物扩散的应用

    公开(公告)号:US06706542B1

    公开(公告)日:2004-03-16

    申请号:US09645913

    申请日:2000-08-25

    IPC分类号: H01L2100

    摘要: The present invention relates to a multi-layer dopant barrier and its method of fabrication for use in semiconductor structures. In an illustrative embodiment, the multi-layer dopant barrier is disposed between a first doped layer and a second doped layer. The multi-layer dopant barrier further includes a first dopant blocking layer adjacent the first doped layer and a second dopant blocking layer adjacent the second doped layer. A technique for fabricating the multi layer dopant barrier is disclosed. A first dopant blocking layer is formed at a first temperature, and a second dopant blocking layer is formed at a second temperature over the first barrier layer.

    摘要翻译: 本发明涉及一种用于半导体结构的多层掺杂剂阻挡层及其制造方法。 在说明性实施例中,多层掺杂剂阻挡层设置在第一掺杂层和第二掺杂层之间。 多层掺杂剂阻挡层还包括与第一掺杂层相邻的第一掺杂剂阻挡层和与第二掺杂层相邻的第二掺杂剂阻挡层。 公开了一种用于制造多层掺杂剂阻挡层的技术。 在第一温度下形成第一掺杂剂阻挡层,并且在第一阻挡层上的第二温度下形成第二掺杂剂阻挡层。

    Optical device and method of manufacture thereof
    6.
    发明授权
    Optical device and method of manufacture thereof 有权
    光学装置及其制造方法

    公开(公告)号:US07008805B2

    公开(公告)日:2006-03-07

    申请号:US10729090

    申请日:2003-12-05

    IPC分类号: H01L21/00

    摘要: The present invention provides an optical device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optical device may include isolating an end of a first layer from a cladding layer located over a mesa structure that has been formed from a substrate. The end of the first layer may be isolated from the cladding layer by encapsulating the end between second and third layers located adjacent the mesa structure.

    摘要翻译: 本发明提供一种光学装置及其制造方法。 在一个实施例中,制造光学器件的方法可以包括将第一层的端部与位于由衬底形成的台面结构之上的覆层进行隔离。 第一层的端部可以通过将端部封装在位于台面结构附近的第二层和第三层之间而与包层隔离。

    InA1As etch stop layer for precise semiconductor waveguide fabrication
    10.
    发明授权
    InA1As etch stop layer for precise semiconductor waveguide fabrication 有权
    InA1As蚀刻停止层,用于精确的半导体波导制造

    公开(公告)号:US06376272B1

    公开(公告)日:2002-04-23

    申请号:US09588427

    申请日:2000-06-06

    IPC分类号: H01L2100

    摘要: A semiconductor waveguide device and method for forming the same provide an InAlAs film as an etch stop layer. The InAlAs film does not etch in the CH4/H2 etch chemistry used to produce the device using reactive ion etching techniques. The etching process etches the waveguide layer and cladding layer or layers formed above the InAlAs layer, and exposes the InAlAs etch stop film to produce a waveguide device having desired physical characteristics.

    摘要翻译: 半导体波导器件及其形成方法提供作为蚀刻停止层的InAlAs膜。 InAlAs膜不会在用于使用反应离子蚀刻技术制造器件的CH4 / H2蚀刻化学中蚀刻。 蚀刻工艺蚀刻在InAlAs层上形成的波导层和包覆层,并暴露InAlAs蚀刻停止膜以产生具有期望物理特性的波导器件。