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    Post etch clean sequence for making a semiconductor device
    1.
    发明授权
    Post etch clean sequence for making a semiconductor device 失效
    用于制造半导体器件的后蚀刻清洁序列

    公开(公告)号：US06465358B1

    公开(公告)日：2002-10-15

    申请号：US09684550

    申请日：2000-10-06

    申请人： Michael S. Nashner ,  Bruce Beattie

    发明人： Michael S. Nashner ,  Bruce Beattie

    IPC分类号： H01L21311

    CPC分类号： H01L21/76808 ,  H01L21/02063 ,  H01L21/31116 ,  H01L21/31133 ,  H01L21/31138 ,  Y10S438/906 ,  Y10S438/963

    摘要： An improved method of forming a semiconductor device is described. The method comprises forming a dielectric layer on a substrate, forming a photoresist layer on the dielectric layer, then patterning the photoresist layer to define a region to be etched. After forming an etched region within the dielectric layer, the photoresist layer is removed and the etched region is cleaned. The etched region is cleaned by applying a buffered oxide etch dip, followed by an amine based dip.

    摘要翻译： 描述了一种形成半导体器件的改进方法。 该方法包括在基底上形成电介质层，在电介质层上形成光致抗蚀剂层，然后对光致抗蚀剂层进行构图以限定待蚀刻的区域。 在电介质层内形成蚀刻区域之后，去除光致抗蚀剂层并清洁蚀刻区域。 通过施加缓冲氧化物蚀刻浸渍，然后进行胺基浸渍来清洁蚀刻区域。

    Laser machining of fired ceramic and other hard and/or thick materials
    2.
    发明授权
    Laser machining of fired ceramic and other hard and/or thick materials 有权
    烧结陶瓷和其他硬质和/或厚材料的激光加工

    公开(公告)号：US08093532B2

    公开(公告)日：2012-01-10

    申请号：US12060023

    申请日：2008-03-31

    申请人： James N. O'Brien ,  Peter Y. Pirogovsky ,  Michael S. Nashner

    发明人： James N. O'Brien ,  Peter Y. Pirogovsky ,  Michael S. Nashner

    IPC分类号： B23K26/16

    CPC分类号： B23K26/16 ,  B23K26/40 ,  B23K2103/52

    摘要： Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

    摘要翻译： 激光加工烧制陶瓷和其他硬质和/或厚的材料包括在工件的切口区域内沿着一系列平行激光路径用激光束刻划工件。 划线在切割区域中产生切割，随着激光束沿着该序列的前进而变宽。 顺序可以从切口区域的内部开始并且以其外边缘结束，使得碎屑被引导离开激光路径以增加生产量并且在工件中产生高质量的开口。 也可以从工件切出高质量的结构。 该方法包括将高速气流引导到激光束和工件的界面，以重定向碎屑流并冷却界面。 该方法还可以在其加深切口时调节激光束的聚焦深度。

    PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING
    9.
    发明申请
    PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING 有权
    通过填充的光学透明过程

    公开(公告)号：US20070291496A1

    公开(公告)日：2007-12-20

    申请号：US11742862

    申请日：2007-05-01

    申请人： Michael S. Nashner ,  Jeffrey Howerton

    发明人： Michael S. Nashner ,  Jeffrey Howerton

    IPC分类号： G02B6/10 ,  F21V17/00

    CPC分类号： B29D11/00663

    摘要： A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

    摘要翻译： 一种用光学透射材料和所得产品形成填充的通孔的方法。 该方法包括在面板中钻孔，并用透光材料填充通孔。 该方法还可以用于创建壳体的透光部分。 通过透光材料可以看到指向通孔一侧的光源，以便在观察通孔第二面处的表面的观察者可见。