Abstract:
The present disclosure is directed to a physical vapor deposition system configured to heat a semiconductor substrate or wafer. In some embodiments the disclosed physical vapor deposition system comprises at least one heat source having one or more lamp modules for heating of the substrate. The lamp modules may be separated from the substrate by a shielding device. In some embodiments, the shielding device comprises a one-piece device or a two piece device. The disclosed physical vapor deposition system can heat the semiconductor substrate, reflowing a metal film deposited thereon without the necessity for separate chambers, thereby decreasing process time, requiring less thermal budget, and decreasing substrate damage.
Abstract:
A method for designing stacked pattern of PCB utilizing genetic algorithm and the system thereof are disclosed. The method comprises the following steps: First of all, information data of stacked pattern is inputted into operational interface of the software; Next, initial solution sets of stacked pattern are generated; Then, duplications of the initial solution sets of stacked pattern are generated according to a fitness function; Afterward, crossover of the duplications of stacked pattern are performed at random; Then, mutations are executed by a probability at random; Finally, identification is performed to check if the solution approaches the standard of demand and the result of stacked pattern is shown; otherwise, operational step jumps to duplicate step and repeats above steps until satisfying solution is obtained. The most suitable way for package can be arranged out through making especially mathematical calculations by the system efficiently.
Abstract:
An ultra-thin motor structure including a stator assembly and a rotator assembly is provided. The stator assembly includes at least one bearing with a bore, a base, and a winding plate. The base has a protruding portion and a deck disposed in the protruding portion. The winding plate is stacked on the deck, and includes a plurality of coils formed by an electroforming process or etching process. Furthermore, the rotator assembly is disposed on the stator assembly, and includes a spindle, a top cover, and a permanent magnet ring. The spindle is fixed in the bore of the bearing, and the permanent magnet ring is disposed on the winding plate and supports the top cover thereon. Thereby, the ultra-thin motor structure can enhance the assembly and mass-production of the motor, and satisfy demands for thinning and performance of the motor.
Abstract:
In some embodiments, the present disclosure relates to a plasma processing system configured to form a symmetric plasma distribution around a workpiece. In some embodiments, the plasma processing system comprises a plurality of coils symmetrically positioned around a processing chamber. When a current is provided to the coils, separate magnetic fields, which operate to ionize the target atoms, emanate from the separate coils. The separate magnetic fields operate upon ions within the coils to form a plasma on the interior of the coils. Furthermore, the separate magnetic fields are superimposed upon one another between coils to form a plasma on the exterior of the coils. Therefore, the disclosed plasma processing system can form a plasma that continuously extends along a perimeter of the workpiece with a high degree of uniformity (i.e., without dead spaces).
Abstract:
The present disclosure provides for methods and systems for controlling profile uniformity of a chemical vapor deposition (CVD) film. A method includes depositing a first layer on a substrate by CVD with a first shower head, the first layer having a first profile, and depositing a second layer over the first layer by CVD with a second shower head, the second layer having a second profile. The combined first layer and second layer have a third profile, and the first profile, the second profile, and the third profile are different from one another.
Abstract:
A motor module includes a bearing housing having a loading base, an electric unit, a bearing, and a magnetic rotor unit disposed on the bearing. In addition, a protruding portion is extending from the loading base, and the electric unit includes a printed circuit board (PCB) and sensing elements, wherein the PCB is utilized for disposing the loading base thereon. Moreover, signal circuits and motor windings are formed on the PCB around the loading base, the sensing elements are disposed around the motor windings, and the bearing is disposed at the protruding portion. Besides, the magnetic rotor unit is disposed on the motor windings, keeping a gap with the PCB; therefore, when electric current passes the motor windings, the magnetic rotor unit and the motor windings generate a flux linkage induction, so as to drive the magnetic rotor unit to rotate relative to the PCB.
Abstract:
An ultra-thin motor structure including a stator assembly and a rotator assembly is provided. The stator assembly includes at least one bearing with a bore, a base, and a winding plate. The base has a protruding portion and a deck disposed in the protruding portion. The winding plate is stacked on the deck, and includes a plurality of coils formed by an electroforming process or etching process. Furthermore, the rotator assembly is disposed on the stator assembly, and includes a spindle, a top cover, and a permanent magnet ring. The spindle is fixed in the bore of the bearing, and the permanent magnet ring is disposed on the winding plate and supports the top cover thereon. Thereby, the ultra-thin motor structure can enhance the assembly and mass-production of the motor, and satisfy demands for thinning and performance of the motor.
Abstract:
A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.
Abstract:
A method for determining disposition of via hole on printed circuit board (PCB) includes the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on the PCB for intersecting the geometric layout to form a plurality of points of intersection; defining line segments by segmenting the line at each of the points of intersection to form a plurality of line segments; deleting some of the line segments having one end not being point of intersection for the geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in the plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within the smallest closed region.
Abstract:
The present disclosure provides for methods and systems for controlling profile uniformity of a chemical vapor deposition (CVD) film. A method includes depositing a first layer on a substrate by CVD with a first shower head, the first layer having a first profile, and depositing a second layer over the first layer by CVD with a second shower head, the second layer having a second profile. The combined first layer and second layer have a third profile, and the first profile, the second profile, and the third profile are different from one another.