Heat pump-type hot-water supply device
    1.
    发明授权
    Heat pump-type hot-water supply device 有权
    热泵式热水供应装置

    公开(公告)号:US08308936B2

    公开(公告)日:2012-11-13

    申请号:US12600980

    申请日:2008-06-25

    IPC分类号: B01J49/00 F25B7/00 F16K15/00

    摘要: A heat pump type hot water supply device is provided with a heat source side heat pump unit having a heat radiating heat exchanger that condenses refrigerant to radiate heat from the refrigerant. The hot water supply device is provided with a water tank that stores water, a water supply pipe that supplies water to the water tank from the outside, a water circulation pipe that is extended in a bypassing manner and circulates the water in the water tank from a bottom section to an upper section, a heat absorbing heat exchanger that is arranged on the water circulation pipe and connected to the heat radiating heat exchanger of the heat source side heat pump unit so as to absorb heat, and a hot water supply unit that comprises a hot water supply pipe that supplies warm water in the upper section of the water tank to the outside.

    摘要翻译: 热泵式热水供给装置具有热源侧热泵机组,该热源侧热泵机组具有冷凝制冷剂以从制冷剂散热的散热用热交换器。 热水供给装置具备:储存水的水箱,从外部向水箱供水的供水管;以循环方式延伸并使水箱内的水循环的水循环管; 上部的底部,吸热式热交换器,其设置在所述水循环管上并与所述热源侧热泵单元的散热用热交换器连接以吸收热量;以及热水供给单元, 包括在水箱的上部向外部供给温水的热水供给管。

    HEAT PUMP-TYPE HOT-WATER SUPPLY DEVICE
    2.
    发明申请
    HEAT PUMP-TYPE HOT-WATER SUPPLY DEVICE 有权
    热泵型热水设备

    公开(公告)号:US20100155312A1

    公开(公告)日:2010-06-24

    申请号:US12600980

    申请日:2008-06-25

    摘要: A heat pump type hot water supply device is provided with a heat source side heat pump unit having a heat radiating heat exchanger that condenses refrigerant to radiate heat from the refrigerant. The hot water supply device is provided with a water tank that stores water, a water supply pipe that supplies water to the water tank from the outside, a water circulation pipe that is extended in a bypassing manner and circulates the water in the water tank from a bottom section to an upper section, a heat absorbing heat exchanger that is arranged on the water circulation pipe and connected to the heat radiating heat exchanger of the heat source side heat pump unit so as to absorb heat, and a hot water supply unit that comprises a hot water supply pipe that supplies warm water in the upper section of the water tank to the outside. The water supply pipe is branched into a plurality of water supply paths including a first water supply path and a second water supply path. The first water supply path supplies water supplied from the outside directly to the water tank. The second water supply path supplies water to the water tank after the water quality of the water from the outside is improved by the water quality adjusting unit so as to hardly generate scale. Accordingly, one of or both of the water supply paths are selectively used according to the water quality of the supplied water. This suppresses the deposition of scale.

    摘要翻译: 热泵式热水供给装置具有热源侧热泵机组,该热源侧热泵机组具有冷凝制冷剂以从制冷剂散热的散热用热交换器。 热水供给装置具备:储存水的水箱,从外部向水箱供水的供水管;以循环方式延伸并使水箱内的水循环的水循环管; 上部的底部,吸热式热交换器,其设置在所述水循环管上并与所述热源侧热泵单元的散热用热交换器连接以吸收热量;以及热水供给单元, 包括在水箱的上部向外部供给温水的热水供给管。 供水管被分支成包括第一供水路径和第二供水路径的多个供水路径。 第一供水路径将从外部供水的水直接供给到水箱。 第二供水路径通过水质调节单元改善水外面的水质,难以产生水垢,从而向水箱供水。 因此,根据供水的水质选择性地使用供水路径中的一个或两个。 这抑制了氧化皮的沉积。

    WATER HEAT EXCHANGER AND HOT WATER HEAT SOURCE APPARATUS
    3.
    发明申请
    WATER HEAT EXCHANGER AND HOT WATER HEAT SOURCE APPARATUS 审中-公开
    水热交换器和热水热源装置

    公开(公告)号:US20110271711A1

    公开(公告)日:2011-11-10

    申请号:US13144608

    申请日:2010-01-19

    IPC分类号: F25B39/02 F28F1/00

    摘要: A water heat exchanger exchanges heat between a refrigerant and water, and includes a pair of flat refrigerant pipes and a flat water pipe. Each flat refrigerant pipe has a plurality of refrigerant passageway holes. The flat water pipe has at least one water passageway hole. The number of water passageway holes is fewer than the number of refrigerant passageway holes of the flat refrigerant pipes. Long side surfaces of the flat water pipe and a long side surface of each of the pair of flat refrigerant pipes are in tight contact with each other as viewed in cross section. The flat water pipe is interposed by the pair of flat refrigerant pipes.

    摘要翻译: 水热交换器在制冷剂和水之间交换热量,并且包括一对扁平制冷剂管和扁平水管。 每个扁平制冷剂管具有多个制冷剂通道孔。 扁平水管至少有一个水通道孔。 水通道孔的数量少于扁平制冷剂管道的制冷剂通道孔的数量。 扁平水管的长边侧面和一对扁平制冷剂管道的长边侧表面在横截面中彼此紧密接触。 扁平的水管由一对扁平的制冷剂管插入。

    Fuel property detection apparatus
    4.
    发明申请
    Fuel property detection apparatus 有权
    燃料特性检测装置

    公开(公告)号:US20100020325A1

    公开(公告)日:2010-01-28

    申请号:US12311425

    申请日:2008-05-14

    IPC分类号: G01N21/00

    摘要: It is an object of the present invention to provide a fuel property detection apparatus that excels in durability and reliability and is capable of accurately detecting the biofuel concentration in a mixture of hydrocarbon fuel and biofuel with a compact and simple configuration. A fuel property sensor 22 includes a light-emitting device 28 and a light-receiving device 32, which detect the optical transmittance of a fuel in a fuel path 26; and a light-emitting device 36 and a position sensitive device 38, which detect the refractive index of the fuel. As the optical transmittance correlates with the RME concentration of the fuel, the RME concentration can be calculated from the detected optical transmittance. As the refractive index correlates with the cetane number of the fuel, the cetane number can be calculated from the detected refractive index. The optical transmittance is detected through the use of light within a wavelength range of 640 nm to 680 nm.

    摘要翻译: 本发明的目的是提供一种耐久性和可靠性优异且能够精确地检测碳氢化合物燃料和生物燃料的混合物中的生物燃料浓度的燃料特性检测装置,其结构紧凑且简单。 燃料特性传感器22包括检测燃料路径26中的燃料的光透射率的发光装置28和光接收装置32; 以及检测燃料的折射率的发光装置36和位置敏感装置38。 由于透光率与燃料的RME浓度相关,可以从检测到的光透射率计算RME浓度。 由于折射率与燃料的十六烷值相关,可以从检测的折射率计算十六烷值。 通过使用在640nm至680nm的波长范围内的光来检测光学透射率。

    ELECTROLYSIS DEVICE AND HEAT-PUMP-TYPE WATER HEATER PROVIDED WITH SAME
    5.
    发明申请
    ELECTROLYSIS DEVICE AND HEAT-PUMP-TYPE WATER HEATER PROVIDED WITH SAME 审中-公开
    电解设备和热泵型水加热器

    公开(公告)号:US20130180846A1

    公开(公告)日:2013-07-18

    申请号:US13823912

    申请日:2011-09-28

    IPC分类号: F24H9/00

    摘要: An electrolysis device includes: a container including a first circulation port functioning as one of an inlet and an outlet for water, and a second circulation port functioning as the other of the inlet and the outlet for water; a plurality of electrode pairs disposed in the container; and a power supply configured to apply a voltage to each of the electrode pairs. Each of the electrode pairs includes a pair of electrode plates. A plurality of the electrode plates are arrayed spaced apart from one another in the thickness direction of the electrode plate. In the electrolysis device, a water channel is formed by the plurality of electrode plates such that water flowing from the inlet into the container reaches the outlet after passing between the pair of electrode plates in each of the electrode pairs.

    摘要翻译: 电解装置包括:容器,其包括用作水的入口和出口中的一个的第一循环端口和用作水的入口和出口中的另一个的第二循环端口; 设置在所述容器中的多个电极对; 以及被配置为向每个电极对施加电压的电源。 每个电极对包括一对电极板。 多个电极板在电极板的厚度方向上彼此间隔开排列。 在电解装置中,通过多个电极板形成水通道,使得从入口进入容器的水在通过每个电极对中的一对电极板之后到达出口。

    Electrolytic processing apparatus and substrate processing apparatus and method
    6.
    发明授权
    Electrolytic processing apparatus and substrate processing apparatus and method 失效
    电解处理装置及基板处理装置及方法

    公开(公告)号:US07569135B2

    公开(公告)日:2009-08-04

    申请号:US11723934

    申请日:2007-03-22

    IPC分类号: C25F3/16 B23H5/06

    摘要: The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

    摘要翻译: 本发明通过使用去离子水,超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括:化学机械抛光部分,用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分,并且还具有设置在基板和处理电极之间或者基板和供电电极之间的至少一个的离子交换器,用于在存在的工件的表面进行电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

    Electrolytic processing apparatus and substrate processing apparatus and method
    7.
    发明申请
    Electrolytic processing apparatus and substrate processing apparatus and method 失效
    电解处理装置及基板处理装置及方法

    公开(公告)号:US20070181432A1

    公开(公告)日:2007-08-09

    申请号:US11723934

    申请日:2007-03-22

    IPC分类号: C25D5/10

    摘要: The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

    摘要翻译: 本发明通过使用去离子水,超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括:化学机械抛光部分,用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分,并且还具有设置在基板和处理电极之间或基板与供电电极之间的至少一个的离子交换器,用于在存在的工件的表面上电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

    Apparatus for and method for polishing workpiece
    8.
    再颁专利
    Apparatus for and method for polishing workpiece 有权
    用于抛光工件的设备和方法

    公开(公告)号:USRE38826E1

    公开(公告)日:2005-10-11

    申请号:US09589388

    申请日:2000-06-08

    IPC分类号: B24B37/30 B24B49/16 B24B1/00

    CPC分类号: B24B37/30 B24B49/16

    摘要: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

    摘要翻译: 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环,并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口,用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上,使得加压流体可以选择性地从相应区域中的开口排出。