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公开(公告)号：US20230085673A1
公开(公告)日：2023-03-23
申请号：US17482056
申请日：2021-09-22
申请人： Mohamed A. Abdelmoneum , Eduardo Alban , Whitney Bryks , Brent R. Carlton , Tarek A. Ibrahim , Nasser A. Kurd , Jason Mix , Srinivas Venkata Ramanuja Pietambaram , Sarah Shahraini
发明人： Mohamed A. Abdelmoneum , Eduardo Alban , Whitney Bryks , Brent R. Carlton , Tarek A. Ibrahim , Nasser A. Kurd , Jason Mix , Srinivas Venkata Ramanuja Pietambaram , Sarah Shahraini
IPC分类号： H01L41/187 , H01L41/09 , H01L41/35 , B81B3/00 , H03H9/02
摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.
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公开(公告)号：US20230087124A1
公开(公告)日：2023-03-23
申请号：US17483013
申请日：2021-09-23
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
IPC分类号： G02B6/42
摘要： Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.
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公开(公告)号：US20230090133A1
公开(公告)日：2023-03-23
申请号：US17481027
申请日：2021-09-21
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.
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公开(公告)号：US20230085646A1
公开(公告)日：2023-03-23
申请号：US17481713
申请日：2021-09-22
申请人： Jeremy D Ecton , Leonel R. Arana , Brandon C. Marin , Srinivas Venkata Ramanuja Pietambaram , Gang Duan
发明人： Jeremy D Ecton , Leonel R. Arana , Brandon C. Marin , Srinivas Venkata Ramanuja Pietambaram , Gang Duan
IPC分类号： H01L25/065 , H01L23/498 , H01L23/15 , H01L23/29 , H01L21/48 , H01L21/56 , H01L23/00
摘要： An electronic device comprises a mold layer that includes multiple integrated circuit (IC) dice having contact pads, a glass core patch embedded in encapsulating material that surrounds the top, bottom, and sides of the glass core patch, and a first redistribution layer arranged between the first mold layer and the glass core patch. The first redistribution layer includes electrically conductive interconnect that electrically connects one or more contact pads of the IC dice to the glass core patch.
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公开(公告)号：US20230082385A1
公开(公告)日：2023-03-16
申请号：US17474255
申请日：2021-09-14
申请人： Jeremy D. Ecton , Kristof Darmawikarta , Sashi S. Kandanur , Srinivas Venkata Ramanuja Pietambaram , Darko Grujicic , Marcel Arlan Wall , Suddhasattwa Nad , Benjamin Duong , Rengarajan Shanmugam , Bai Nie , Helme Castro De La Torre
发明人： Jeremy D. Ecton , Kristof Darmawikarta , Sashi S. Kandanur , Srinivas Venkata Ramanuja Pietambaram , Darko Grujicic , Marcel Arlan Wall , Suddhasattwa Nad , Benjamin Duong , Rengarajan Shanmugam , Bai Nie , Helme Castro De La Torre
IPC分类号： H01L21/48 , H01L23/498
摘要： An electronic device comprises an electronic package with a glass core. The glass core includes a first surface and a second surface opposite the first surface, at least one through-glass via (TGV) extending through the glass core from the first surface to the second surface, and including an electrically conductive material, and wherein the at least one TGV includes a first portion having a first width and a second portion having a second width different from the first width.
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公开(公告)号：US20230072096A1
公开(公告)日：2023-03-09
申请号：US17470652
申请日：2021-09-09
申请人： Hiroki Tanaka , Brandon C. Marin , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Jeremy D. Ecton , Rajeev Ranjan
发明人： Hiroki Tanaka , Brandon C. Marin , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Jeremy D. Ecton , Rajeev Ranjan
摘要： An electro-optical system having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An electro-optical system including an electro-optic switch is shown. An electro-optical system including an electro-optic modulator is shown. An electro-optical system including an optical resonator is shown.
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公开(公告)号：US20230084379A1
公开(公告)日：2023-03-16
申请号：US17472081
申请日：2021-09-10
IPC分类号： H01L23/538 , H01L25/065 , H01L23/00 , H01L23/13 , H01L23/498 , H01L21/48 , H01L21/56 , H01L21/683 , H01L25/00
摘要： Disclosed herein are local bridge-last architectures for heterogeneous integration applications and methods for manufacturing the same. The local bridge-last architectures may include a substrate, a first die, a second die, and a material. The substrate may define a cavity. The first and second dies may be connected to the substrate. The material may be attached to the substrate. The material may include a first portion and a second portion. The first portion of the material may be located proximate the first bump and the second portion of the material may be located proximate the second bump.
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公开(公告)号：US20210305108A1
公开(公告)日：2021-09-30
申请号：US16832851
申请日：2020-03-27
申请人： Robert L. Sankman , Rahul N. Manepalli , Robert Alan May , Srinivas Venkata Ramanuja Pietambaram , Bharat P. Penmecha
发明人： Robert L. Sankman , Rahul N. Manepalli , Robert Alan May , Srinivas Venkata Ramanuja Pietambaram , Bharat P. Penmecha
IPC分类号： H01L23/15 , H01L25/065 , H01L23/538 , H01L23/31 , H01L21/48
摘要： Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.
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公开(公告)号：US20230101629A1
公开(公告)日：2023-03-30
申请号：US17484315
申请日：2021-09-24
申请人： Bohan Shan , Dingying Xu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Hongxia Feng , Gang Duan , Jung Kyu Han , Xiaoying Guo , Jeremy D. Ecton , Santosh Tripathi , Bai Nie , Haobo Chen , Kyle Jordan Arrington , Yue Deng , Wei Wei
发明人： Bohan Shan , Dingying Xu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Hongxia Feng , Gang Duan , Jung Kyu Han , Xiaoying Guo , Jeremy D. Ecton , Santosh Tripathi , Bai Nie , Haobo Chen , Kyle Jordan Arrington , Yue Deng , Wei Wei
摘要： Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.
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