公开(公告)号：US20080029898A1

公开(公告)日：2008-02-07

申请号：US11461511

申请日：2006-08-01

申请人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

发明人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： Via stack structures are disclosed. In one embodiment, a structure includes a via stack including: a first substantially cross-shaped line in a first dielectric layer; a second substantially cross-shaped line set in a second dielectric layer, and a via stud coupling the first substantially cross-shaped line to the second substantially cross-shaped line. In another embodiment, a structure includes a first via stack, and a second via stack, wherein the first via stack and the second via stack extend in a divergent manner from one another. Each via stack structure is useful for support, for example, in under wire bond applications. The via stack structures can be mixed with other via stack structures and selectively placed within a layout to replace conventional metal plate and via stud array configurations.

摘要翻译： 公开了通过堆叠结构。 在一个实施例中，结构包括通孔堆叠，其包括：第一介电层中的第一基本十字形的线; 设置在第二电介质层中的第二基本上十字形的线，以及将第一基本上十字形的线耦合到第二基本十字形线的通孔柱。 在另一个实施例中，结构包括第一通孔堆叠和第二通孔堆叠，其中第一通孔堆叠和第二通孔堆叠以彼此发散的方式延伸。 每个通孔堆叠结构可用于支持，例如在引线键合应用中。 通孔堆叠结构可以与其它通孔堆叠结构混合并且选择性地放置在布局内以代替传统的金属板和经由螺柱阵列配置。

公开(公告)号：US07867887B2

公开(公告)日：2011-01-11

申请号：US12174074

申请日：2008-07-16

申请人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

发明人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

IPC分类号： H01L21/768

CPC分类号： H01L24/05 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

摘要翻译： 本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。 在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。 通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

公开(公告)号：US07573115B2

公开(公告)日：2009-08-11

申请号：US11559130

申请日：2006-11-13

申请人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

发明人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

IPC分类号： H01L23/52

CPC分类号： H01L24/05 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

摘要翻译： 本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。 在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。 通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

公开(公告)号：US20080274608A1

公开(公告)日：2008-11-06

申请号：US12174074

申请日：2008-07-16

申请人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

发明人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

IPC分类号： H01L21/768

CPC分类号： H01L24/05 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

摘要翻译： 本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。 在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。 通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

公开(公告)号：US20080111250A1

公开(公告)日：2008-05-15

申请号：US11559130

申请日：2006-11-13

申请人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

发明人： Ian D. Melville ,  Mukta G. Farooq ,  Dae Young Jung

IPC分类号： H01L23/52 ,  H01L21/768

CPC分类号： H01L24/05 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

公开(公告)号：US08826341B2

公开(公告)日：2014-09-02

申请号：US12871742

申请日：2010-08-30

申请人： Dae Young Jung

发明人： Dae Young Jung

IPC分类号： H04N5/445 ,  G06F3/00 ,  G06F13/00

CPC分类号： G06F3/0346 ,  G06F3/017 ,  H04N5/4403 ,  H04N5/44513 ,  H04N5/44543 ,  H04N21/42207 ,  H04N21/42208 ,  H04N21/4221 ,  H04N21/42221 ,  H04N21/42222 ,  H04N21/42224 ,  H04N21/4312 ,  H04N21/4316 ,  H04N21/482 ,  H04N21/4828 ,  H04N21/485 ,  H04N21/4852 ,  H04N2005/4408 ,  H04N2005/441 ,  H04N2005/4412 ,  H04N2005/4426 ,  H04N2005/4428 ,  H04N2005/443 ,  H04N2005/44556

摘要： A digital broadcast receiver controlled by a screen remote controller and a space remote controller and controlling method, the method including according to an embodiment displaying a screen remote controller, partitioning a portion of a whole screen of the broadcast receiver into at least two control regions, displaying a pointer to enable a first pointing signal outputted from the space remote controller to indicate one control region of the screen remote controller, receiving a second pointing signal from the space remote controller, and executing a function corresponding to the one control region indicated by the pointer.

摘要翻译： 一种由屏幕遥控器和空间遥控器控制的数字广播接收机和控制方法，该方法包括根据实施例的显示屏幕遥控器，将广播接收机的整个屏幕的一部分划分成至少两个控制区域， 显示指示器以使得从空间遥控器输出的第一指示信号指示屏幕遥控器的一个控制区域，从空间遥控器接收第二指示信号，并且执行与由该遥控器指示的一个控制区域相对应的功能 指针。

公开(公告)号：US06650010B2

公开(公告)日：2003-11-18

申请号：US10078174

申请日：2002-02-15

申请人： Charles R. Davis ,  David L. Hawken ,  Dae Young Jung ,  William F. Landers ,  David L. Questad

发明人： Charles R. Davis ,  David L. Hawken ,  Dae Young Jung ,  William F. Landers ,  David L. Questad

IPC分类号： H01L2312

CPC分类号： H01L22/32 ,  H01L23/5226 ,  H01L23/5329 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05096 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06155 ,  H01L2924/12044

摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.

摘要翻译： 在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。 网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。 导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。 加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。

公开(公告)号：US09237296B2

公开(公告)日：2016-01-12

申请号：US12630471

申请日：2009-12-03

申请人： Dae Young Jung ,  Hae Jin Bae ,  Jae Kyung Lee ,  Kun Sik Lee ,  Gyu Seung Kim

发明人： Dae Young Jung ,  Hae Jin Bae ,  Jae Kyung Lee ,  Kun Sik Lee ,  Gyu Seung Kim

IPC分类号： H04N7/173 ,  H04N5/445 ,  H04N1/00 ,  H04N21/462 ,  H04N21/482 ,  H04N21/426 ,  H04N21/431 ,  H04N21/4402 ,  H04N21/475 ,  H04N21/84 ,  H04N7/16

CPC分类号： H04N21/4316 ,  G06F3/0482 ,  H04N1/00448 ,  H04N1/00453 ,  H04N1/00461 ,  H04N5/44543 ,  H04N5/44582 ,  H04N5/44591 ,  H04N5/50 ,  H04N21/4263 ,  H04N21/4314 ,  H04N21/440263 ,  H04N21/4622 ,  H04N21/4755 ,  H04N21/482 ,  H04N21/84 ,  H04N2005/44556

摘要： A method for operating an image display apparatus includes providing input signals to the image display apparatus, displaying at least one image on a display based on the input signals, generating a plurality thumbnail images based on the input signals, and displaying a thumbnail-image list which includes a plurality of generated thumbnail images.

摘要翻译： 一种用于操作图像显示装置的方法包括向图像显示装置提供输入信号，基于输入信号在显示器上显示至少一个图像，基于输入信号生成多个缩略图图像，并且显示缩略图列表 其包括多个生成的缩略图图像。

公开(公告)号：US08494158B2

公开(公告)日：2013-07-23

申请号：US11455096

申请日：2006-06-19

申请人： Dae Young Jung

发明人： Dae Young Jung

IPC分类号： H04N7/167

CPC分类号： H04N21/4586 ,  H04N21/4345 ,  H04N21/818

摘要： Provided is a method of downloading, by a digital broadcast receiver, a software for upgrade through broadcast signals. According to the method, existence of a receiver software to be downloaded is checked, and a reservation time for downloading of the software is set. After that, a download and upgrade of the software are performed at the set reservation time.

摘要翻译： 提供了一种通过数字广播接收机下载用于通过广播信号进行升级的软件的方法。 根据该方法，检查要下载的接收机软件的存在，并且设置软件的下载预约时间。 之后，在设定的预约时间执行软件的下载和升级。

公开(公告)号：US06815346B2

公开(公告)日：2004-11-09

申请号：US10437208

申请日：2003-05-13

申请人： Charles R. Davis ,  David L. Hawken ,  Dae Young Jung ,  William F. Landers ,  David L. Questad

发明人： Charles R. Davis ,  David L. Hawken ,  Dae Young Jung ,  William F. Landers ,  David L. Questad

IPC分类号： H01L2144

CPC分类号： H01L22/32 ,  H01L23/5226 ,  H01L23/5329 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05096 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06155 ,  H01L2924/12044

摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.

摘要翻译： 在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。 网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。 导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。 加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。