Abstract:
A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.
Abstract:
A stack-type inductor element includes a stack including a magnetic element layer, a coil-shaped conductor pattern provided in the stack, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack and symmetric to the plurality of first pad electrodes. The stack is rectangular or substantially rectangular when viewed in a direction of stack of the stack. A first end and a second end of the coil-shaped conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.
Abstract:
In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.
Abstract:
A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.
Abstract:
Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.
Abstract:
Line conductors are provided on one principal surface of a magnetic layer, and line conductors are provided on the other principal surface of the magnetic layer. In addition, side conductors are provided on side surfaces of the magnetic layer to connect the line conductors in a coil shape. A non-magnetic layer is stacked at the one principal surface side of the magnetic layer, and a non-magnetic layer is stacked at the other principal surface side of the magnetic layer. Line conductors are provided within the non-magnetic layer, and line conductors are provided within the non-magnetic layer. Via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors. In addition, via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors.
Abstract:
Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.
Abstract:
A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.
Abstract:
In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.
Abstract:
In a laminated coil component include coil conductors are respectively included on magnetic layers and a carbon paste is included on a magnetic layer. The coil conductors include a partial coil conductor and a partial coil conductor respectively corresponding to an outer side portion circle and an inner side portion circle defining two circles. A width of the carbon paste at least partially overlaps an interval between the outer side portion circle and the inner side portion circle defining the two circles, and extends circularly along the two circles. The carbon paste is shifted to the interval between the outer side portion circle and the inner side portion circle defining the two circles at the time of pressure-bonding the magnetic layers. The carbon paste vanishes when being calcined to define an air gap.