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1.发明申请公开(公告)号：US20200321157A1
公开(公告)日：2020-10-08
申请号：US16838918
申请日：2020-04-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiraku KAWAI , Noboru SHIOKAWA , Yuichi IIDA , Yoshitaka MATSUKI , Masahiro KUBOTA , Kenji NISHIYAMA , Takaya WADA , Tadashi WASHIMORI , Rikiya SANO , Chiharu SAKAKI
Abstract: An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.
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公开(公告)号：US20240038430A1
公开(公告)日：2024-02-01
申请号：US18345745
申请日：2023-06-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromitsu ITO , Yuichi IIDA , Isamu UTSUNOMIYA
CPC classification number: H01F17/02 , H01F17/0013 , H01G4/33 , H01G4/224 , H01F27/022 , H01F41/043 , H01F2017/002
Abstract: An electronic component includes a glass substrate having a main body and a protrusion, the main body including top and bottom surfaces, and a first side surface connecting the bottom and top surfaces to each other, the first side surface of the main body being provided with the protrusion; a colored insulation layer on at least the first side surface of the main body; and a through-conductor within the main body and extending through the top surface and the bottom surface. The protrusion extends in a first direction that is orthogonal to the top surface, as viewed from a direction orthogonal to the first side surface. As viewed from the direction orthogonal to the first side surface, at least a portion of the colored insulation layer extends in the first direction and is adjacent to the protrusion in a second direction that is orthogonal to the first direction.
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公开(公告)号：US20220084733A1
公开(公告)日：2022-03-17
申请号：US17460069
申请日：2021-08-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuichi IIDA , Fumihiko NARUSE
Abstract: An inductor component comprising a single-layer glass plate of a rectangular parallelepiped shape with a width, a length longer than the width, and a height, and having a bottom surface defined by the length and width and a top surface positioned on a back side of the bottom surface; bottom-surface and top-surface conductors disposed above the bottom and top surfaces, respectively; through wirings each extending through a corresponding one of through holes formed in the glass plate; an underlying insulation layer above the bottom-surface conductors; and first and second terminal electrodes above the underlying insulation layer. The bottom-surface and top-surface conductors, and the through wirings are electrically connected as a circularly extending wiring that circularly extends around a winding axis parallel to the bottom surface and the length. The circularly extending wiring, and the first and second terminal electrodes, are electrically connected to each other as an inductor element.
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Patent Agency Ranking
公开(公告)号：US20230386733A1
公开(公告)日：2023-11-30
申请号：US18322284
申请日：2023-05-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromitsu ITO , Yuichi IIDA
CPC classification number: H01F27/292 , H01F41/041 , C03C15/00 , H01F17/0006 , C03C19/00 , H01F2017/0073 , C03C2204/08
Abstract: An electronic component includes a glass substrate, an outer surface conductor that is in contact with an outer surface of the glass substrate, and a protective film that covers the outer surface of the glass substrate and the outer surface conductor and is in contact with the outer surface of the glass substrate and the outer surface conductor. When the glass substrate has first surface roughness Ra1 at an interface between the glass substrate and the outer surface conductor, the glass substrate has second surface roughness Ra2 at an interface between the glass substrate and the protective film, and the outer surface conductor has third surface roughness Ra3 at an interface between the outer surface conductor and the protective film, Ra1
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公开(公告)号：US20130027175A1
公开(公告)日：2013-01-31
申请号：US13627013
申请日：2012-09-26
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Yusuke OTSUKA , Yuichi IIDA , Kazuo KISHIDA , Takahiro TAKADA
CPC classification number: H01C17/30 , H01C1/14 , H01C7/003 , H01C17/00 , H01C17/075 , H01L23/13 , H01L23/5385 , H01L23/66 , H01L2924/0002 , H05K1/167 , H05K3/4629 , H01L2924/00
Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.
Abstract translation: 多层陶瓷基板包括陶瓷层叠体，陶瓷层叠体包括彼此堆叠的多个陶瓷层，电阻器和电阻器连接导体以及与该电阻器重叠的部分，以及覆盖位于陶瓷的主表面上的电阻器的外涂层 层压体。 在焙烧时使外涂层相对较厚，从而使得难以产生裂纹，并且在烧制步骤之后，通过物理地刮擦外涂层的表面来降低外涂层的厚度，从而减少修整时间。 在覆盖层中，覆盖电阻器与电阻器连接导体重叠的部分的区域比覆盖另一部分的区域厚。
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公开(公告)号：US20240040699A1
公开(公告)日：2024-02-01
申请号：US18348813
申请日：2023-07-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromitsu ITO , Yuichi IIDA , Isamu UTSUNOMIYA
CPC classification number: H05K1/115 , H05K1/0306 , H05K3/002 , H05K3/28 , H05K3/4007 , H05K3/4038 , H05K2201/09581 , H05K2201/099 , H05K2203/0228 , H05K2203/107
Abstract: An electronic component includes a glass substrate having a glass body and a protruding crystallized portion, the glass body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface to each other, and the first side surface having the crystallized portion; a colored insulation layer on the first side surface; and a through-conductor within the glass body and extending through the top surface and the bottom surface. The crystallized portion extends in a first direction that is parallel to the bottom surface, as viewed from a direction orthogonal to the first side surface. As viewed from the direction orthogonal to the first side surface, at least a portion of the colored insulation layer extends in the first direction and is disposed adjacent to the crystallized portion in a second direction that is orthogonal to the first direction.
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公开(公告)号：US20220068554A1
公开(公告)日：2022-03-03
申请号：US17459862
申请日：2021-08-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshitaka MATSUKI , Hiraku KAWAI , Yuichi IIDA , Masahiro KUBOTA , Fumihiko NARUSE
Abstract: An electronic component comprising a glass body containing a photosensitizer; a conductor as at least a part of an electric element, arranged on the glass body; a terminal electrode as a terminal of the electric element, arranged above an outer surface of the glass body, with the terminal electrode being electrically connected to the conductor; and an insulating film arranged above the outer surface of the glass body. The insulating film reflects or absorbs light in a photosensitive wavelength range of the photosensitizer contained in the glass body.
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公开(公告)号：US20140361470A1
公开(公告)日：2014-12-11
申请号：US14465876
申请日：2014-08-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuichi IIDA
IPC: B28B11/24
CPC classification number: H05K1/183 , B28B11/243 , B32B3/266 , B32B7/02 , B32B18/00 , B32B2250/40 , B32B2250/42 , C04B2235/9607 , C04B2237/343 , C04B2237/348 , C04B2237/562 , C04B2237/58 , C04B2237/62 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L23/13 , H01L23/5385 , H01L2224/16225 , H01L2924/09701 , H01L2924/15153 , H01L2924/19105 , H05K1/0271 , H05K1/0306 , H05K3/462 , H05K3/4629 , H05K3/4688 , H05K3/4697 , H05K2201/068 , H05K2203/061 , H05K2203/063 , Y10S428/901 , Y10T428/24331 , Y10T428/24851 , Y10T428/24926 , Y10T428/24942
Abstract: When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved.
Abstract translation: 当具有空腔的多层陶瓷基板的厚度减小时，限定空腔底部的底壁部分的厚度减小，从而导致底壁部分容易断裂的问题。 限定多层陶瓷基板的空腔的底壁部分具有由夹在第一和第二低热膨胀系数层之间的高热膨胀系数层形成的堆叠结构。 该结构在烧成后的冷却工序中产生低热膨胀系数层的压缩应力，能够提高底壁部的机械强度。
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