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公开(公告)号：US20220204718A1
公开(公告)日：2022-06-30
申请号：US17608210
申请日：2020-05-01
Applicant: National Research Council of Canada
Inventor： Jianping Lu , Zhiyi Zhang , Ye Tao
Abstract: The present application relates to copolymer-silica hybrid aerogels as well as methods for the preparation thereof. The methods comprise hydrolyzing a silica precursor in an organic solvent to obtain a partially polymerized silica wet gel, reacting the partially polymerized silica wet gel with a copolymer of Formula (II) to obtain a copolymer-silica hybrid wet gel, reacting the copolymer-silica hybrid wet gel with a surface passivation agent and removing solvent from the copolymer-silica hybrid wet gel to obtain the copolymer-silica hybrid aerogel. The mechanical properties of the copolymer-silica hybrid aerogels can be further improved by blending cellulose nanofibrils into the hybrid aerogels. (II)
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公开(公告)号：US10125285B2
公开(公告)日：2018-11-13
申请号：US15740550
申请日：2016-06-30
Applicant: National Research Council of Canada
Inventor： Ta-Ya Chu , Christophe Py , Ye Tao , Zhiyi Zhang , Afshin Dadvand
Abstract: Disclosed is a method of printing ultranarrow-gap lines of a functional material, such as an electrically conductive silver ink. The method entails providing a substrate having an interlayer coated on the substrate and printing the ultranarrow-gap lines by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent that swells the interlayer to cause the interlayer to bulge at edges of the ink to thereby define embankments that confine the ink.
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公开(公告)号：US11185918B2
公开(公告)日：2021-11-30
申请号：US15740589
申请日：2016-06-30
Applicant: National Research Council of Canada
Inventor： Zhiyi Zhang , Ye Tao , Ta-Ya Chu , Gaozhi Xiao
IPC: B22F3/105 , B22F3/24 , B22F5/00 , B22F7/04 , G03F7/004 , G03F7/20 , G03F7/40 , H01L51/00 , H01L51/05 , H05K1/09 , H05K3/06 , H05K3/46 , B82Y20/00
Abstract: A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.
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Patent Agency Ranking
公开(公告)号：US10000652B2
公开(公告)日：2018-06-19
申请号：US14906670
申请日：2014-07-16
Applicant: National Research Council of Canada
Inventor： Zhiyi Zhang , Ye Tao , Hiroshi Fukutani , Gaozhi Xiao
IPC: C09D11/52 , C23C18/16 , C09D11/54 , C23C18/20 , C23C18/31 , C23C18/40 , C23C18/44 , H05K3/18 , H05K3/24 , C09D11/037 , C09D11/322 , C09D11/38 , C23C16/06 , H05K3/12
CPC classification number: C09D11/52 , C09D11/037 , C09D11/322 , C09D11/38 , C09D11/54 , C23C16/06 , C23C18/161 , C23C18/166 , C23C18/1676 , C23C18/1678 , C23C18/2066 , C23C18/31 , C23C18/40 , C23C18/44 , H05K3/12 , H05K3/182 , H05K3/241 , H05K2203/1105 , H05K2203/1157
Abstract: A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.
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公开(公告)号：US20180185922A1
公开(公告)日：2018-07-05
申请号：US15740589
申请日：2016-06-30
Applicant: National Research Council of Canada
Inventor： Zhiyi Zhang , Ye Tao , Ta-Ya Chu , Gaozhi Xiao
CPC classification number: B22F7/04 , B22F3/105 , B22F3/24 , B22F5/00 , B22F2003/247 , B22F2003/248 , B22F2301/052 , B22F2301/10 , B22F2301/255 , B82Y20/00 , G03F7/0043 , G03F7/2014 , G03F7/2022 , G03F7/40 , H01L51/0022 , H01L51/0023 , H01L51/0096 , H01L51/0541 , H01L51/0545 , H01L2251/301 , H05K1/097 , H05K3/06 , H05K3/064 , H05K3/4644 , H05K2201/0145 , H05K2203/013 , H05K2203/0548 , H05K2203/0766 , H05K2203/107 , H05K2203/1131
Abstract: A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.
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公开(公告)号：US10475546B2
公开(公告)日：2019-11-12
申请号：US14894542
申请日：2014-05-28
Applicant: NATIONAL RESEARCH COUNCIL OF CANADA
Inventor： Gaozhi George Xiao , Ye Tao , Zhiyi Zhang , Jianping Lu
IPC: H01B1/02 , C09D183/04 , H01B1/04 , H01B1/12 , C09D183/08 , C08G77/14 , C08G77/26 , C08G77/38
Abstract: The present disclosure relates to conductors comprising a conducting member comprising silver and a functionalized organosiloxane network having at least one functional group capable of trapping silver or a silver ion as well as to methods of preparing the same. For example, the functionalized organosiloxane network can at least substantially inhibit dendrite formation between a first conducting member and a second conducting member. For example, the conductors may be used in an electronic circuit such as a printed electronic circuit.
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公开(公告)号：US20180187036A1
公开(公告)日：2018-07-05
申请号：US15740550
申请日：2016-06-30
Applicant: National Research Council of Canada
Inventor： Ta-Ya Chu , Christophe Py , Ye Tao , Zhiyi Zhang , Afshin Dadvand
IPC: C09D11/52 , H01L29/772 , H01L51/00 , H01L51/05 , H01L51/10
CPC classification number: C09D11/52 , H01L29/772 , H01L51/0022 , H01L51/0023 , H01L51/0508 , H01L51/105 , H05K1/16
Abstract: Disclosed is a method of printing ultranarrow-gap lines of a functional material, such as an electrically conductive silver ink. The method entails providing a substrate having an interlayer coated on the substrate and printing the ultranarrow-gap lines by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent that swells the interlayer to cause the interlayer to bulge at edges of the ink to thereby define embankments that confine the ink.
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公开(公告)号：US20160160066A1
公开(公告)日：2016-06-09
申请号：US14906670
申请日：2014-07-16
Applicant: National Research Council of Canada
Inventor： Zhiyi Zhang , Ye Tao , Hiroshi Fukutani , Gaozhi Xiao
CPC classification number: C09D11/52 , C09D11/037 , C09D11/322 , C09D11/38 , C09D11/54 , C23C16/06 , C23C18/161 , C23C18/166 , C23C18/1676 , C23C18/1678 , C23C18/2066 , C23C18/31 , C23C18/40 , C23C18/44 , H05K3/12 , H05K3/182 , H05K3/241 , H05K2203/1105 , H05K2203/1157
Abstract: A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.
Abstract translation: 用于在基板上沉积金属的方法涉及以从底部向上串联的方式使用两个还原反应，从基板表面开始并向上工作。 第一还原反应在环境温度下在基材表面上开始，并且通过第一还原反应的反应热引发的第二还原反应发生在反应性油墨溶液膜上，反应性油墨溶液膜在反应后变成固体。 由还原反应产生的气体和其它小分子以及溶剂可以在形成固体金属层之前或在后处理期间容易地从薄膜的上表面逸出，而金属膜中没有留下或少量的空隙。 因此，该方法可用于在环境温度下在各种基材上形成高导电膜和特征。
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