Abstract:
A manufacturing method of a silicon carbide-based honeycomb structure, including a firing step of introducing extruded honeycomb formed bodies containing a silicon carbide-based component, together with firing members into a firing furnace, and firing the honeycomb formed bodies, to manufacture the silicon carbide-based honeycomb structure, wherein the firing members are formed by using a ceramic material containing 70 wt % or more of alumina, and the firing step further includes: an inert gas supplying step of supplying an inert gas to a furnace space of the firing furnace, and a gas adding step of adding a reducing gas to the furnace space.
Abstract:
A wafer placement table includes: a ceramic substrate that has a wafer placement surface at an upper surface of the ceramic substrate; an electrode that is incorporated in the ceramic substrate; and an electrically conductive electrode extraction portion that is incorporated in the ceramic substrate and is electrically connected to the electrode. A volume content percentage of a ceramic material that is identical to a main component of the ceramic substrate is high in the electrode extraction portion compared with the electrode.
Abstract:
A nozzle is mounted on an end of an ejector for ejecting an aerosol on an ejection side in a honeycomb filter production apparatus. The nozzle is formed into a shape having a longitudinal direction. A single introduction port is formed at an end surface of the nozzle on one side in the longitudinal direction, and a plurality of discharge ports are formed at an end surface of the nozzle on the other side in the longitudinal direction. A single introduction passage extends linearly from the single introduction port in the longitudinal direction. A plurality of discharge passages are each branched from an end portion of the introduction passage on a side opposite to the introduction port and extend to corresponding one of the discharge ports in a direction tilted from the longitudinal direction.
Abstract:
The manufacturing method of the honeycomb structure includes a step of coating a surface of each of releasing sheets with a paste for an electrode, to prepare electrode forming sheets in which the releasing sheets are provided with electrode paste films; a formed honeycomb body with the electrode forming sheets forming step of attaching the electrode forming sheets to a side surface of a tubular formed ceramic honeycomb body which is the curved surface to prepare a formed honeycomb body with the electrode forming sheets; and a honeycomb structure forming step of firing the formed honeycomb body, or removing releasing sheets from the formed honeycomb body to form the formed honeycomb body with the pastes for the electrodes, and then firing the formed honeycomb body with the pastes for the electrodes, to obtain a honeycomb structure having a side surface provided with the electrodes.
Abstract:
A member for semiconductor manufacturing apparatus has a ceramic plate, a porous plug, an insulating lid, and pores. The ceramic plate has a wafer placement surface as an upper surface. The porous plug is disposed in a plug insertion hole penetrating the ceramic plate in an up-down direction, and allows a gas to flow. The insulating lid is provided in contact with an upper surface of the porous plug, and exposed to the wafer placement surface. A plurality of pores are provided in the insulating lid, and penetrate the insulating lid in an up-down direction.
Abstract:
A method of assembling or disassembling a housing shelf configured at least from shelf plates and frames, including a step in which a chuck holds a frame; a step of determining, based on an image captured by an imager that captures an image of the frame held by the chuck and positioned at an imaged position, a position of a target portion of the frame on the image; and a step of determining, based on the determined position on the image, at least one correction value for causing a change in a release position for the frame when the frame is released from the chuck onto the shelf plate. The target portion may be an inner wall surface of the frame. An illumination unit may be arranged between the imager and the imaged position of the frame.
Abstract:
A drying apparatus includes a furnace body 10; a conveyor belt 20 configured to move in an interior space of the furnace body 10, with an object to be dried loaded thereon; and a plurality of infrared heaters 40 arranged above the conveyor belt 20 in the interior space of the furnace body 10. A division wall 50 is provided, which divides the interior space of the furnace body 10 into a space S1 including the conveyor belt 20 and a space S2 including the infrared heaters 40. In the division wall 50, first portions 51 located at positions corresponding to the respective infrared heaters 40 in the longitudinal direction are made of a material that transmits infrared radiation, whereas second portions 52 located at positions corresponding to respective spaces between adjacent infrared heaters 40 in the longitudinal direction are made of a material that does not transmit infrared radiation.
Abstract:
A heat conduction member includes: a cylindrical ceramic body, a metal pipe on the outer periphery side of the cylindrical ceramic body, and an intermediate member held between the cylindrical ceramic body and the metal pipe. The cylindrical ceramic body has passages passing through from one end face to the other end face and allowing the first fluid to flow therethrough. The intermediate member is made of material having at least a part having a Young's modulus of 150 Gpa or less. The first fluid is allowed to flow through the inside of the cylindrical ceramic body while the second fluid having lower temperature than that of the first fluid is allowed to flow on the outer peripheral face side of the metal pipe to perform heat exchange between the first fluid and the second fluid.
Abstract:
A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.
Abstract:
A method of producing a ceramic fired body may includes a step of passing a first accommodating shelf through a firing kiln, the first accommodating shelf including a stack of units of a shelf plate and a frame placed on the shelf plate, one or more ceramic bodies placed on the shelf plate being surrounded by the frame extending in a circumferential direction between the shelf plates; a step of retrieving one or more frames from the first accommodating shelf which has passed through the firing kiln; a step of using the one or more retrieved frames to build a second accommodating shelf for passing through the firing kiln; and a step of rotating the retrieved frame such that a rotational position of the retrieved frame when the second accommodating shelf passes through the firing kiln is different from a rotational position of the retrieved frame when the first accommodating shelf passed through the firing kiln.