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公开(公告)号：US20140185296A1
公开(公告)日：2014-07-03
申请号：US14136749
申请日：2013-12-20
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE
CPC classification number: F21V21/14 , F21S4/24 , F21V19/001 , F21V31/005 , F21Y2115/10 , H01L2224/73204
Abstract: A light emitting device with good handling performance for storage, transportation, or in use, which can prevent stress from concentrating on the light emitting elements. The substrate member includes a first end portion, a middle portion, and a second end portion. The first end portion defines a locking hole for insertion of a locking bar. A plurality of light emitting elements are disposed on the middle portion. On the second end portion, an electronic member such as a Zener Diode, a Bridge Diode, a connector, a fuse, a resistance etc., is disposed.
Abstract translation: 一种具有良好的存储，运输或使用处理性能的发光装置，其可以防止压力集中在发光元件上。 基板构件包括第一端部，中间部分和第二端部。 第一端部限定用于插入锁定杆的锁定孔。 多个发光元件设置在中间部分上。 在第二端部，设置齐纳二极管，桥式二极管，连接器，保险丝，电阻等电子部件。
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公开(公告)号：US20170062682A1
公开(公告)日：2017-03-02
申请号：US15350330
申请日：2016-11-14
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device including providing a light emitting element mounted on a substrate. The light emitting element is provided within a first cavity of the light emitting device. The method further includes covering continuously, with insulating material, at least side surfaces of the light emitting element. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.
Abstract translation: 一种制造发光器件的方法，包括提供安装在衬底上的发光元件。 发光元件设置在发光器件的第一腔内。 该方法还包括使用绝缘材料连续覆盖发光元件的至少侧表面。 光反射树脂在围绕发光元件的位置处设置在绝缘材料上方以反射来自发光元件的光。
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Patent Agency Ranking
公开(公告)号：US20130183787A1
公开(公告)日：2013-07-18
申请号：US13789677
申请日：2013-03-08
Applicant: Nichia Corporation
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
IPC: H01L33/52
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: In method of manufacturing a light emitting device, a substrate is provided, and metallization is established on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. The surfaces of metallization and at least side surface of the light emitting element are continuously covered with insulating material. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.
Abstract translation: 在制造发光器件的方法中，提供衬底，并且在衬底的上表面上建立金属化。 发光元件安装在金属化的顶部，并且金属化和发光元件电连接。 金属化表面和发光元件的至少侧表面被绝缘材料连续覆盖。 光反射树脂在围绕发光元件的位置处设置在绝缘材料上方以反射来自发光元件的光。
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公开(公告)号：US20190252583A1
公开(公告)日：2019-08-15
申请号：US16395321
申请日：2019-04-26
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.
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公开(公告)号：US20180040776A1
公开(公告)日：2018-02-08
申请号：US15784781
申请日：2017-10-16
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Mototaka INOBE , Kunihiro IZUNO
Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.
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公开(公告)号：US20150179891A1
公开(公告)日：2015-06-25
申请号：US14610030
申请日：2015-01-30
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Mototaka INOBE , Kunihiro IZUNO
CPC classification number: H01L33/46 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48137 , H01L2224/48465 , H01L2224/4945 , H01L2924/01322 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.
Abstract translation: 一种制造发光器件的方法包括：将发光元件安装在具有导体布线的基板上并将发光元件与导体布线电连接的第一步骤;设置反射光的光反射树脂的第二步骤， 所述发光元件围绕所述发光元件，以及第三步骤，在硬化所述光反射树脂以覆盖所述发光元件之后设置密封构件。
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公开(公告)号：US20150034992A1
公开(公告)日：2015-02-05
申请号：US14517965
申请日：2014-10-20
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.
Abstract translation: 发光装置包括基板，金属化，发光元件，导线，光反射树脂和绝缘材料。 金属化被设置在由绝缘物质制成的基板的表面上。 发光元件安装在基板上。 导线将金属化和发光元件电连接。 光反射树脂设置在基板上以反射来自发光元件的光。 绝缘材料覆盖至少部分金属化表面。 建立绝缘材料以与发光元件的一侧接触。
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