-
公开(公告)号：US20190252583A1
公开(公告)日：2019-08-15
申请号：US16395321
申请日：2019-04-26
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.
-
公开(公告)号：US20150034992A1
公开(公告)日：2015-02-05
申请号：US14517965
申请日：2014-10-20
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.
Abstract translation: 发光装置包括基板，金属化，发光元件，导线，光反射树脂和绝缘材料。 金属化被设置在由绝缘物质制成的基板的表面上。 发光元件安装在基板上。 导线将金属化和发光元件电连接。 光反射树脂设置在基板上以反射来自发光元件的光。 绝缘材料覆盖至少部分金属化表面。 建立绝缘材料以与发光元件的一侧接触。
-
公开(公告)号：US20170062682A1
公开(公告)日：2017-03-02
申请号：US15350330
申请日：2016-11-14
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device including providing a light emitting element mounted on a substrate. The light emitting element is provided within a first cavity of the light emitting device. The method further includes covering continuously, with insulating material, at least side surfaces of the light emitting element. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.
Abstract translation: 一种制造发光器件的方法，包括提供安装在衬底上的发光元件。 发光元件设置在发光器件的第一腔内。 该方法还包括使用绝缘材料连续覆盖发光元件的至少侧表面。 光反射树脂在围绕发光元件的位置处设置在绝缘材料上方以反射来自发光元件的光。
-
公开(公告)号：US20170030549A1
公开(公告)日：2017-02-02
申请号：US15220397
申请日：2016-07-27
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA , Yusaku ACHI , Tomohisa KISHIMOTO , Satoshi YOSHINAGA
IPC: F21V5/00 , G02F1/1335 , G02B3/00 , F21V9/16 , G02B5/04
CPC classification number: G02F1/133611 , F21V7/0083 , G02B3/0062 , G02B5/045 , G02F1/133603 , G02F1/133606 , G02F2001/133607
Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface.
Abstract translation: 底座有一个基面。 发光元件沿着X轴以X间距设置在基面上，并且沿着Y轴以Y间距设置以形成矩阵。 X间距小于Y间距。 镜头具有蝙蝠照明分布。 每个透镜覆盖每个发光元件。 第一双凸透镜片设置在基座上，使得第一双凸透镜片下表面与基面相对。 第二双凸透镜片设置在第一双凸透镜片上，使得第二双凸透镜片下表面与第一双凸透镜片上表面相对。
-
公开(公告)号：US20130183787A1
公开(公告)日：2013-07-18
申请号：US13789677
申请日：2013-03-08
Applicant: Nichia Corporation
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
IPC: H01L33/52
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: In method of manufacturing a light emitting device, a substrate is provided, and metallization is established on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. The surfaces of metallization and at least side surface of the light emitting element are continuously covered with insulating material. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.
Abstract translation: 在制造发光器件的方法中，提供衬底，并且在衬底的上表面上建立金属化。 发光元件安装在金属化的顶部，并且金属化和发光元件电连接。 金属化表面和发光元件的至少侧表面被绝缘材料连续覆盖。 光反射树脂在围绕发光元件的位置处设置在绝缘材料上方以反射来自发光元件的光。
-
Patent Agency Ranking
公开(公告)号：US20170250326A1
公开(公告)日：2017-08-31
申请号：US15595725
申请日：2017-05-15
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA
CPC classification number: H01L33/56 , F21K9/60 , H01L33/44 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
Abstract: A light emitting device includes a substrate, a light emitting element, a first resin member, and a second resin member. The substrate includes a base member, a plurality of wiring portions disposed on a first surface and a second surface of the base member, and a covering layer that covers the wiring portions disposed on the first surface and has an opening formed in a part of the covering layer. The light emitting element is arranged on the wiring portions disposed on the first surface in the opening of the covering layer and having an upper surface at a position higher than the covering layer. The first resin member is arranged at least in the opening of the covering layer and at periphery of the light emitting element. The second resin member seals the substrate and the light emitting element and has an outer border that is arranged above the covering layer. The covering layer is exposed at an outer side of the second resin member. The wiring portions disposed on the second surface are not directly or indirectly electrically connected to the light emitting element.
-
公开(公告)号：US20170184278A1
公开(公告)日：2017-06-29
申请号：US15388152
申请日：2016-12-22
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA
CPC classification number: F21V7/00 , F21V7/22 , F21V15/01 , F21V19/002 , F21V23/06 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: light emitting device includes: a light emitting element including a first electrode and a second electrode; a base equipped with a first conductive member and a second conductive member; a first bonding member electrically connecting the first electrode and the first conductive member, and a second bonding member electrically connecting the second electrode and the second conductive member; and one or more light reflecting members covering at least a part of the first conductive member and the second conductive member. The one or more light reflecting members are disposed in contact with the first bonding member and the second bonding member while being away from the light emitting element.
-
公开(公告)号：US20140133151A1
公开(公告)日：2014-05-15
申请号：US14077321
申请日：2013-11-12
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA
IPC: F21V21/14
CPC classification number: F21V21/14 , F21S4/22 , F21V7/22 , F21V31/005 , F21Y2103/10 , F21Y2115/10
Abstract: A light emitting device includes a flexible substrate member having a base member and a plurality of wiring portions disposed on a surface of the base member, a plurality of light emitting elements arranged on the surface of the base member and electrically connected to the plurality of wiring portions, and a plurality of sealing members sealing corresponding parts of the substrate member and the light emitting elements respectively. The substrate is curved so that at least a part of periphery of the sealing member is arranged at a position lower than the position on which the light emitting element is disposed.
Abstract translation: 一种发光器件，包括：柔性衬底构件，具有基底构件和设置在所述基底构件的表面上的多个布线部分;多个发光元件，布置在所述基底构件的表面上并电连接到所述多个布线 以及分别密封基板部件和发光元件的对应部分的多个密封部件。 基板是弯曲的，使得密封构件的周边的至少一部分布置在比设置有发光元件的位置低的位置。
-
公开(公告)号：US20230163035A1
公开(公告)日：2023-05-25
申请号：US17976949
申请日：2022-10-31
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA
IPC: H01L23/14 , H01L23/13 , H01L33/62 , H01L21/3213
CPC classification number: H01L23/142 , H01L23/13 , H01L33/62 , H01L21/32139
Abstract: A substrate for light emitting elements includes: a resin layer having a sheet shape, a first surface, and a second surface located opposite to the first surface. The second surface has one or more groove portions that includes a first groove portion. The second surface is divided by the first groove portion into a plurality of regions that include the first region and the second region. The resin layer includes a plurality of fiber bundles and a resin. The substrate includes a first electrically-conductive layer located in the first region of the resin layer; and a second electrically-conductive layer located in the second region of the resin layer. In a plan view, the at least one continuous fiber bundle extends inside the resin layer across the first region, a portion below the first groove portion, and the second region.
-
公开(公告)号：US20190294006A1
公开(公告)日：2019-09-26
申请号：US16425952
申请日：2019-05-30
Applicant: NICHIA CORPORATION
Inventor： Kazuhiro KAMADA , Yusaku ACHI , Tomohisa KISHIMOTO , Satoshi YOSHINAGA
IPC: G02F1/1335 , G02B3/00 , F21V7/00 , G02B5/04
Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.017 seconds)
