公开(公告)号：US20160351760A1

公开(公告)日：2016-12-01

申请号：US15167570

申请日：2016-05-27

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA ,  Suguru BEPPU ,  Kunihiro IZUNO ,  Tsuyoshi OKAHISA

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/507 ,  H01L33/48 ,  H01L33/505 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of manufacturing a covering member includes providing a first light-reflective member having a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the distributing of the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

Abstract translation: 一种制造覆盖部件的方法包括提供具有通孔的第一光反射部件，所述通孔具有第一和第二开口; 在所述通孔内配置含有波长转换材料的透光性树脂; 所述波长转换材料主要在所述透光树脂内的所述通孔的第一开口的一侧分布; 并且在分配波长转换材料之后，从通孔的第二开口的一侧去除一部分透光树脂。

公开(公告)号：US20180040776A1

公开(公告)日：2018-02-08

申请号：US15784781

申请日：2017-10-16

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

IPC: H01L33/46 ,  H01L33/48

Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.

公开(公告)号：US20150179891A1

公开(公告)日：2015-06-25

申请号：US14610030

申请日：2015-01-30

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L33/46 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4945 ,  H01L2924/01322 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.

Abstract translation: 一种制造发光器件的方法包括：将发光元件安装在具有导体布线的基板上并将发光元件与导体布线电连接的第一步骤;设置反射光的光反射树脂的第二步骤， 所述发光元件围绕所述发光元件，以及第三步骤，在硬化所述光反射树脂以覆盖所述发光元件之后设置密封构件。

公开(公告)号：US20250098389A1

公开(公告)日：2025-03-20

申请号：US18883216

申请日：2024-09-12

Applicant: NICHIA CORPORATION

Inventor： Norifumi SASAOKA ,  Shoichi YAMADA ,  Kunihiro IZUNO ,  Daisuke IWAKURA ,  Yoshiyuki KAGEYAMA ,  Hiroaki KURODA

IPC: H01L33/64 ,  H01L25/075

Abstract: A substrate includes a first member having a through hole extending from an upper surface to a lower surface thereof, and a second member disposed inside the through hole. The second member includes a first region containing graphite, a second region located outward of the first region in a top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

公开(公告)号：US20210013385A1

公开(公告)日：2021-01-14

申请号：US17034899

申请日：2020-09-28

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA ,  Suguru BEPPU ,  Kunihiro IZUNO ,  Tsuyoshi OKAHISA

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

公开(公告)号：US20190312183A1

公开(公告)日：2019-10-10

申请号：US16447935

申请日：2019-06-20

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA ,  Suguru BEPPU ,  Kunihiro IZUNO ,  Tsuyoshi OKAHISA

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/58

Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.