Abstract:
A metal-insulator-semiconductor (MIS) semiconductor read-only memory element employs, as the gate insulator film, an alumina film formed through a novel hydrolytic deposition process.
Abstract:
A semiconductor integrated circuit includes a plurality of insulated gate field effect memory transistors arranged in a rowcolumn matrix. Each of the memory transistors has an insulating film for establishing electron tapping centers. The source areas of the memory transistors are in the form of teeth-like projections which extend into the space defined between similarly formed projections in the memory transistor drain areas.
Abstract:
A method for fabricating an integrated gate field effect transistor is disclosed wherein an induced conduction region is formed between the source and drain regions by the application of a suitable potential between the gate electrode and substrate. The surface of the device is irradiated by a high-energy beam, thereby to form a narrow channel in the conduction region which defines the gate channel of the field effect transistor.
Abstract:
A memory matrix device is disclosed in which an MIS semiconductor element is employed as the memory element. The semiconductor element has an insulating film disposed between the semiconductor substrate and conductor electrode. That film contains capture centers which capture electrons upon the application of a voltage exceeding a critical value across the electrode and substrate.
Abstract:
Data is written into a memory storage device by applying a negative voltage to the gate electrode of an MIS-type transistor, and a positive voltage to at least one of the drain and source of that transistor. The voltage difference between the gate and the source or drain exceeds a critical voltage so that electrons are injected and trapped in the gate film. Also disclosed is a memory matrix in which a plurality of MIS transistors are arranged in a matrix array and have their gate and source-drain electrodes connected to row-and-column drive lines.