Abstract:
An indicator tube having an anode structure and a hot cathode placed in front of the structure. The structure comprises a base plate and a plurality of phosphor anode segments which are capable of displaying at least one numeric, alphabetic, or similar figure. The tube dispenses with the conventionally required mask by embedding the anode segments within the base plate.
Abstract:
A metal-insulator-semiconductor (MIS) semiconductor read-only memory element employs, as the gate insulator film, an alumina film formed through a novel hydrolytic deposition process.
Abstract:
A three-dimensional memory includes MIS-type transistors as the memory elements formed on a plurality of integrated matrix boards. The transistor includes an insulating film capable of storing an electric charge in response to the application of a voltage across the gate and substrate exceeding a critical value. The row and column drive lines are respectively connected to row and column select circuitry, and a third select circuit applies a select voltage to one of the matrix boards.
Abstract:
An integrated circuit is disclosed in which the drain and source regions of an integrated gate-type field-effect transistor and the gate region of a junction-type field-effect transistor are formed in common within a semiconductor layer of one conductivity type formed on a substrate of the opposite conductivity type.
Abstract:
A memory matrix device is disclosed in which an MIS semiconductor element is employed as the memory element. The semiconductor element has an insulating film disposed between the semiconductor substrate and conductor electrode. That film contains capture centers which capture electrons upon the application of a voltage exceeding a critical value across the electrode and substrate.
Abstract:
A logic device comprises a Gunn effect element having a capacitive element connected across its electrodes. The Gunn effect element is normally biased below the threshold value, and an input pulse is applied to raise the internal field of the Gunn effect element above the threshold value. The resultant charging of the capacitive element causes the Gunn effect element to be maintained in a state of oscillation.
Abstract:
Data is written into a memory storage device by applying a negative voltage to the gate electrode of an MIS-type transistor, and a positive voltage to at least one of the drain and source of that transistor. The voltage difference between the gate and the source or drain exceeds a critical voltage so that electrons are injected and trapped in the gate film. Also disclosed is a memory matrix in which a plurality of MIS transistors are arranged in a matrix array and have their gate and source-drain electrodes connected to row-and-column drive lines.
Abstract:
According to the present invention, there is provided a semiconductor integrated circuit device comprising a semiconductor substrate of a first conductivity type; two opposite conductivity type buried layer regions, both with high impurity concentration but with different outward diffusion speeds, formed within said substrate, the region with the faster speed surrounding the other; and epitaxial layer of the first conductivity type epitaxially grown over said substrate allowing the impurities of said buried layer regions to outwardly diffuse thereinto; a diffusion region of the second conductivity type formed by diffusing second conductivity type impurities from the surface of said epitaxial layer in alignment with the buried layer of the higher outward diffusion speed; and isolated region of the higher outward diffusion speed; an isolated region of the first conductivity type thereby simultaneously formed on the surface of the buried layer of lower outward diffusion speed and surrounded by the diffusion region; an isolation region comprised of part of the epitaxial layer also simultaneously formed on the substrate surrounding the diffusion regions, and finally, metal wiring film attached to each of the regions. The two regions of the buried layer may be formed by using different impurities or by using different concentrations of the same impurity.