Hot-cathode indicator tube for displaying luminescent figures
    1.
    发明授权
    Hot-cathode indicator tube for displaying luminescent figures 失效
    用于显示发光图的热阴极指示灯

    公开(公告)号:US3906286A

    公开(公告)日:1975-09-16

    申请号:US44181274

    申请日:1974-02-12

    CPC classification number: H01J31/15

    Abstract: An indicator tube having an anode structure and a hot cathode placed in front of the structure. The structure comprises a base plate and a plurality of phosphor anode segments which are capable of displaying at least one numeric, alphabetic, or similar figure. The tube dispenses with the conventionally required mask by embedding the anode segments within the base plate.

    Abstract translation: 具有放置在结构前面的阳极结构和热阴极的指示管。 该结构包括基板和多个能够显示至少一个数字,字母或类似图形的荧光体阳极段。 通过将阳极段嵌入基板内,管分配常规所需的掩模。

    Three dimensional memory utilizing semiconductor memory devices
    5.
    发明授权
    Three dimensional memory utilizing semiconductor memory devices 失效
    三维存储器利用半导体存储器件

    公开(公告)号:US3651490A

    公开(公告)日:1972-03-21

    申请号:US3651490D

    申请日:1970-06-08

    CPC classification number: G11C16/0466

    Abstract: A three-dimensional memory includes MIS-type transistors as the memory elements formed on a plurality of integrated matrix boards. The transistor includes an insulating film capable of storing an electric charge in response to the application of a voltage across the gate and substrate exceeding a critical value. The row and column drive lines are respectively connected to row and column select circuitry, and a third select circuit applies a select voltage to one of the matrix boards.

    Abstract translation: 三维存储器包括形成在多个集成矩阵板上的存储元件的MIS型晶体管。 晶体管包括能够响应于栅极和衬底上施加超过临界值的电压而存储电荷的绝缘膜。 行和列驱动线分别连接到行和列选择电路,并且第三选择电路将选择电压施加到矩阵板之一。

    Semiconductor logic device employing the gunn effect element
    8.
    发明授权
    Semiconductor logic device employing the gunn effect element 失效
    使用枪支效应元素的半导体逻辑器件

    公开(公告)号:US3651348A

    公开(公告)日:1972-03-21

    申请号:US3651348D

    申请日:1969-10-03

    CPC classification number: H03K19/02

    Abstract: A logic device comprises a Gunn effect element having a capacitive element connected across its electrodes. The Gunn effect element is normally biased below the threshold value, and an input pulse is applied to raise the internal field of the Gunn effect element above the threshold value. The resultant charging of the capacitive element causes the Gunn effect element to be maintained in a state of oscillation.

    Abstract translation: 逻辑器件包括具有连接在其电极上的电容元件的Gunn效应元件。 Gunn效应元件通常偏置在阈值以下,并且施加输入脉冲以将Gunn效应元件的内部场提高到阈值以上。 电容元件的最终充电使得Gunn效应元件保持在振荡状态。

    Semiconductor integrated circuit device and the method of manufacturing the same
    10.
    发明授权
    Semiconductor integrated circuit device and the method of manufacturing the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US3582725A

    公开(公告)日:1971-06-01

    申请号:US3582725D

    申请日:1969-08-21

    Abstract: According to the present invention, there is provided a semiconductor integrated circuit device comprising a semiconductor substrate of a first conductivity type; two opposite conductivity type buried layer regions, both with high impurity concentration but with different outward diffusion speeds, formed within said substrate, the region with the faster speed surrounding the other; and epitaxial layer of the first conductivity type epitaxially grown over said substrate allowing the impurities of said buried layer regions to outwardly diffuse thereinto; a diffusion region of the second conductivity type formed by diffusing second conductivity type impurities from the surface of said epitaxial layer in alignment with the buried layer of the higher outward diffusion speed; and isolated region of the higher outward diffusion speed; an isolated region of the first conductivity type thereby simultaneously formed on the surface of the buried layer of lower outward diffusion speed and surrounded by the diffusion region; an isolation region comprised of part of the epitaxial layer also simultaneously formed on the substrate surrounding the diffusion regions, and finally, metal wiring film attached to each of the regions. The two regions of the buried layer may be formed by using different impurities or by using different concentrations of the same impurity.

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