公开(公告)号：US20110269268A1

公开(公告)日：2011-11-03

申请号：US13179468

申请日：2011-07-08

申请人： NOBUYASU MUTO ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： NOBUYASU MUTO ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US07981788B2

公开(公告)日：2011-07-19

申请号：US11482854

申请日：2006-07-10

申请人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US08530278B2

公开(公告)日：2013-09-10

申请号：US13179468

申请日：2011-07-08

申请人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US20070035002A1

公开(公告)日：2007-02-15

申请号：US11482854

申请日：2006-07-10

申请人： Nobuyasu Moto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Moto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US07669773B2

公开(公告)日：2010-03-02

申请号：US11907911

申请日：2007-10-18

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06 ,  G06K7/06 ,  G06K5/00

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US20100025480A1

公开(公告)日：2010-02-04

申请号：US12442968

申请日：2007-03-30

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

IPC分类号： G06K19/067 ,  H01R13/62

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.

摘要翻译： 提供了一种能够根据用户要求实现存储容量的大的可扩展性，存储容量和成本负担的IC技术。 本发明的IC卡是安装有闪存的闪存卡306，其特征在于，闪存卡306可以被插入到插入式SIM适配器305a和/或迷你UICC适配器305b中， 安全IC，将闪存卡306插入到插入式SIM适配器305a或迷你UICC适配器305b中，从而作为附接有扩展存储器的SIM卡或附带有扩展存储器的迷你UICC操作闪存卡 306可以从插件SIM适配器305a或迷你UICC适配器305b物理地移除。

公开(公告)号：US07656014B2

公开(公告)日：2010-02-02

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。

公开(公告)号：US20080173995A1

公开(公告)日：2008-07-24

申请号：US11898456

申请日：2007-09-12

申请人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

发明人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/566 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.

摘要翻译： 需要提供用于便携式通信设备的大容量存储卡。 存储卡1包括：主要由玻璃环氧树脂构成的布线板2; 安装在存储卡1的主表面上的多个半导体芯片（3C和3F） 以及用于封装布线板2和半导体芯片（3C和3F）的模制树脂4。 模制树脂4由含有石英填料的热固性环氧树脂制成。 配线基板2的背面未被模制树脂4覆盖，并暴露于存储卡1的背面。 布线板2的背面用于形成与半导体芯片（3C和3F）电连接的多个外部连接端子7。 当存储卡1附接到移动电话的卡槽时，外部连接端子7与包含在卡槽中的连接器端子接触。 这使得可以在存储卡1和移动电话之间交换信号或者提供电力。

公开(公告)号：US07341198B2

公开(公告)日：2008-03-11

申请号：US10588301

申请日：2004-02-20

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06

CPC分类号： G06K19/07745 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.

摘要翻译： IC卡1CD包括框架部件CB1和IC卡主体15，该IC卡主体15以其框架中的连接部分CB 2挂起的状态保持。 IC卡主体15构成具有高功能性的卡式信息介质，具有作为即插即用IC卡的功能，以及作为具有容量较大的说话存储卡的功能 并且具有比能够执行安全处理的IC卡的功能更高的功能。 IC卡主体15的外形形状符合RS-MMC外形标准。 IC卡主体15的盖部分1 CB 3的表面通过用于制造通用IC卡的步骤中使用的打印方法打印所需的字符，图案，图表和照片等，并且IC卡15 具有更高的确认性能，安全性能和前景。

公开(公告)号：US20070257346A1

公开(公告)日：2007-11-08

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。