公开(公告)号：US20050064650A1

公开(公告)日：2005-03-24

申请号：US10992709

申请日：2004-11-22

申请人： Nai-Hao Kuo ,  Kai-Hsiang Yen ,  Jing-Hung Chiou ,  Po-Hao Tsai ,  Yuh-Wen Lee

发明人： Nai-Hao Kuo ,  Kai-Hsiang Yen ,  Jing-Hung Chiou ,  Po-Hao Tsai ,  Yuh-Wen Lee

IPC分类号： B81C99/00 ,  G01P15/08 ,  H01L21/8238

CPC分类号： B81C1/00619 ,  G01P15/0802

摘要： A fabrication method for microstructures with high aspect ratios uses a CMOS process to form a desired microstructure on a silicon substrate. The steps of forming a contact plug and a via plug of the process are used to form etching channels in insulation layers, polysilicon layers and metal layers, penetrating to the silicon substrate. An etching process is then performed through the etching channel to form the desired microstructure with high aspect ratio.

摘要翻译： 具有高纵横比的微结构的制造方法使用CMOS工艺在硅衬底上形成期望的微结构。 形成该工艺的接触塞和通孔的步骤用于在绝缘层，多晶硅层和金属层中形成穿透到硅衬底的蚀刻通道。 然后通过蚀刻通道进行蚀刻工艺以形成具有高纵横比的所需微结构。

公开(公告)号：US07125795B2

公开(公告)日：2006-10-24

申请号：US10992709

申请日：2004-11-22

申请人： Nai-Hao Kuo ,  Kai-Hsiang Yen ,  Jing-Hung Chiou ,  Po-Hao Tsai ,  Yuh-Wen Lee

发明人： Nai-Hao Kuo ,  Kai-Hsiang Yen ,  Jing-Hung Chiou ,  Po-Hao Tsai ,  Yuh-Wen Lee

IPC分类号： H01L21/4763

CPC分类号： B81C1/00619 ,  G01P15/0802

摘要： A fabrication method for microstructures with high aspect ratios uses a CMOS process to form a desired microstructure on a silicon substrate. The steps of forming a contact plug and a via plug of the process are used to form etching channels in insulation layers, polysilicon layers and metal layers, penetrating to the silicon substrate. An etching process is then performed through the etching channel to form the desired microstructure with high aspect ratio.

摘要翻译： 具有高纵横比的微结构的制造方法使用CMOS工艺在硅衬底上形成期望的微结构。 形成该工艺的接触塞和通孔的步骤用于在绝缘层，多晶硅层和金属层中形成穿透到硅衬底的蚀刻通道。 然后通过蚀刻通道进行蚀刻工艺以形成具有高纵横比的所需微结构。

公开(公告)号：US06804443B2

公开(公告)日：2004-10-12

申请号：US10601647

申请日：2003-06-24

申请人： Po-Hao Tsai ,  Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Wen-Jiun Liu ,  Yuh-Wen Lee

发明人： Po-Hao Tsai ,  Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Wen-Jiun Liu ,  Yuh-Wen Lee

IPC分类号： G02B610

CPC分类号： G02B6/132 ,  G02B2006/12176

摘要： Test structure and method of step coverage for optical waveguide production are disclosed. It combines the steps of producing the optical waveguide and the testing structure by forming the optical waveguide components on the chip and the test structure in the surrounding areas, so the optical waveguide and the test structure have the same upper covering layer. Etching solution is used for the etch testing of the test structure, and the step coverage of the upper covering layer for the optical waveguide is extrapolated by the etching result.

摘要翻译： 公开了用于光波导生产的步骤覆盖的测试结构和方法。 它结合了通过在芯片上形成光波导部件和周围区域的测试结构来生产光波导和测试结构的步骤，因此光波导和测试结构具有相同的上覆盖层。 蚀刻溶液用于测试结构的蚀刻测试，并且通过蚀刻结果外推了用于光波导的上覆盖层的台阶覆盖。

公开(公告)号：US06737307B2

公开(公告)日：2004-05-18

申请号：US10185034

申请日：2002-06-28

申请人： Po-Hao Tsai ,  Nai-Hao Kuo ,  Wen-Jiun Liu ,  Yuh-Wen Lee

发明人： Po-Hao Tsai ,  Nai-Hao Kuo ,  Wen-Jiun Liu ,  Yuh-Wen Lee

IPC分类号： H01L2100

CPC分类号： H01L21/32055 ,  H01L21/28556 ,  H01L21/3205

摘要： A method for forming amorphous silicon films with low defect density on single crystal silicon substrates and structures formed. The method is carried out by first providing a single crystal silicon substrate, then depositing a buffer layer by a material such as silicon oxide, silicon nitride, silicon carbide or a metal on top of the single crystal silicon substrate. An amorphous silicon film of substantial thickness, i.e. of thicker than 1 &mgr;m, is then deposited on top of the buffer layer achieving a smooth top surface.

公开(公告)号：US20130092520A1

公开(公告)日：2013-04-18

申请号：US13450486

申请日：2012-04-19

申请人： Yuh-Wen Lee ,  Hsiang-Lung Hsia ,  Yanjun Xie ,  Feng Chen ,  Fengming Lin ,  Xianbin Xu ,  Keming Ruan

发明人： Yuh-Wen Lee ,  Hsiang-Lung Hsia ,  Yanjun Xie ,  Feng Chen ,  Fengming Lin ,  Xianbin Xu ,  Keming Ruan

IPC分类号： H03K17/975 ,  G03F7/20 ,  B05D5/12

CPC分类号： G06F3/044 ,  G06F3/0412 ,  G06F2203/04103

摘要： The present disclosure relates to a touch technology, and more particularly to a touch device and a fabrication method thereof. The touch device comprises a sensing area and a peripheral area. The touch device further comprises a sensing electrode layer, a shading layer, a signal transmission line layer, and a conductive layer. The sensing electrode layer extends from the sensing area to the peripheral area. The shading layer is disposed on the peripheral area to overlay the sensing electrode layer and has a through hole to expose a portion of the sensing electrode layer. The signal transmission line layer is disposed on the shading layer and does not cover the through hole. The conductive layer fills the through hole and electrically connects the sensing electrode layer. In addition, a fabrication method of a touch device is also provided.

摘要翻译： 本公开涉及触摸技术，更具体地涉及触摸装置及其制造方法。 触摸装置包括感测区域和周边区域。 触摸装置还包括感测电极层，遮光层，信号传输线层和导电层。 感测电极层从感测区域延伸到周边区域。 遮光层设置在外围区域上以覆盖感测电极层，并且具有通孔以暴露感测电极层的一部分。 信号传输线层设置在遮光层上，不覆盖通孔。 导电层填充通孔并电连接感​​测电极层。 另外，还提供了一种触摸装置的制造方法。

公开(公告)号：US5976636A

公开(公告)日：1999-11-02

申请号：US45103

申请日：1998-03-19

申请人： Ming-Sheng Leu ,  Wei-Cheng Lih ,  Yuh-Wen Lee ,  Shau-Yi Chen ,  Wei-Jieh Chang ,  Shinn-Cherng Huang ,  Mau-Shen Liou

发明人： Ming-Sheng Leu ,  Wei-Cheng Lih ,  Yuh-Wen Lee ,  Shau-Yi Chen ,  Wei-Jieh Chang ,  Shinn-Cherng Huang ,  Mau-Shen Liou

IPC分类号： C23C14/32 ,  H05H1/50 ,  C23C14/14 ,  C23C14/00

CPC分类号： C23C14/325 ,  H05H1/50

摘要： An electric arc ion plating apparatus to coat a metal material on an object includes: (a) an vacuum chamber; (b) an electric arc bombardment chamber in the vacuum chamber, comprising an anode, a cathode target, and an arc triggering electrode to generate metal particles when a voltage is applied on the anode and the cathode, and on the arc triggering electrode; and (c) a magnetic coil having a longitudinal axis. The magnetic coil emanates from the electric arc bombardment chamber and encloses at least a part of the electric bombardment chamber. The magnetic coil contains a constant-diameter section enclosing and immediately emanating from the electric arc bombardment chamber to guide the metal particles away from the cathode and toward the object, and a varying-diameter section away from the electric arc bombardment chamber to provide optimum distribution of the metal particles before they reach the object surface. The varying-diameter section can be a diverging section for effectively coating relatively large objects, or a converging section for efficiently coating a relatively small object.

摘要翻译： 用于在物体上涂覆金属材料的电弧离子镀装置包括：（a）真空室; （b）真空室中的电弧轰击室，当在阳极和阴极上施加电压时，包括阳极，阴极靶和电弧触发电极以产生金属颗粒;以及电弧触发电极; 和（c）具有纵向轴线的电磁线圈。 电磁线圈从电弧轰击室发出并且包围电轰击室的至少一部分。 磁性线圈包含恒定直径部分，其包围并立即从电弧轰击室发出，以引导金属颗粒远离阴极并朝向物体，以及远离电弧轰击室的变化直径部分以提供最佳分布 的金属颗粒在它们到达物体表面之前。 变径部分可以是用于有效地涂覆较大物体的发散部分或用于有效地涂覆较小物体的会聚部分。

公开(公告)号：US09116587B2

公开(公告)日：2015-08-25

申请号：US13726553

申请日：2012-12-25

申请人： Yuh-Wen Lee ,  Hsiang-Lung Hsia ,  Kun-Rung Lin ,  Minghua Ye ,  Xianbin Xu ,  Tsung-Ke Chiu ,  Huilin Ye ,  Jing Yu

发明人： Yuh-Wen Lee ,  Hsiang-Lung Hsia ,  Kun-Rung Lin ,  Minghua Ye ,  Xianbin Xu ,  Tsung-Ke Chiu ,  Huilin Ye ,  Jing Yu

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04111

摘要： The present disclosure provides a method for manufacturing a touch panel, wherein the method comprises: forming a touch sensing layer on a visible region and a non-visible region of a cover substrate, wherein the non-visible region is located at periphery of the visible region forming a first opaque insulating layer on the touch sensing layer in the non-visible region; forming a wiring layer on the first opaque insulating layer: and forming a conductive layer to electrically connect the wiring layer and the touch sensing layer. Moreover, the present disclosure also provides a touch panel. Accordingly, the touch sensing accuracy is maintained, and the production rate is improved.

摘要翻译： 本公开提供了一种用于制造触摸面板的方法，其中所述方法包括：在覆盖基板的可见区域和不可见区域上形成触摸感测层，其中所述不可见区域位于所述可见区域的外围 区域，形成在不可见区域的触摸感测层上的第一不透明绝缘层; 在所述第一不透明绝缘层上形成布线层;以及形成导电层以电连接所述布线层和所述触摸感测层。 此外，本公开还提供了触摸面板。 因此，保持了触摸感测精度，并提高了生产率。

公开(公告)号：US20140168099A1

公开(公告)日：2014-06-19

申请号：US13717667

申请日：2012-12-17

申请人： Yuh-Wen Lee ,  Xianbin Xu ,  Keming Ruan ,  Qiong Yuan

发明人： Yuh-Wen Lee ,  Xianbin Xu ,  Keming Ruan ,  Qiong Yuan

IPC分类号： G06F1/16

CPC分类号： G06F1/1643 ,  G06F3/03547 ,  G06F3/044

摘要： A touch panel and a method of manufacturing the same are provided. The touch panel comprises: a cover substrate comprising a visible area and a non-visible area, wherein the non-visible area is located in a peripheral area of the visible area; an electrode layer formed on the visible area and the non-visible area of the cover substrate; a conductive masking layer formed on the non-visible area and disposed on a part of the electrode layer that is located on the non-visible area; and a plurality of connecting wires formed on the conductive masking layer and electrically connected to the electrode layer through uniaxial conduction of the conductive masking layer. The present disclosure comprises a method of manufacturing the touch panel. Accordingly, product yield is increased and touch sensing precision is maintained.

摘要翻译： 提供了触摸面板及其制造方法。 触摸面板包括：覆盖基板，包括可见区域和不可见区域，其中不可见区域位于可见区域的周边区域中; 形成在所述覆盖基板的可见区域和不可见区域上的电极层; 导电掩模层，其形成在所述不可见区域上并且设置在位于所述不可见区域上的所述电极层的一部分上; 以及形成在导电掩模层上并通过导电掩模层的单轴导电电连接到电极层的多个连接线。 本公开包括制造触摸面板的方法。 因此，产品产量增加并且保持了触摸感测精度。

公开(公告)号：US20130106739A1

公开(公告)日：2013-05-02

申请号：US13550625

申请日：2012-07-17

申请人： Yuh-Wen Lee ,  Keming Ruan ,  Xianbin Xu ,  Fengming Lin

发明人： Yuh-Wen Lee ,  Keming Ruan ,  Xianbin Xu ,  Fengming Lin

IPC分类号： G06F3/041 ,  B23P11/00

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  Y10T29/49826

摘要： The embodiments of the present disclosure provide a touch device having a sensing area and a peripheral area around the peripheral area. The touch device comprises a sensing electrode layer, a shading layer, and a signal transmission line, wherein the shading layer is disposed on the peripheral area and the sensing electrode layer. The shading layer has a hollow part and wholly overlays the peripheral area. The signal transmission line is disposed on the shading layer and filled in the hollow part. The signal transmission line is electrically connected to the sensing electrode layer through the shading layer beneath the hollow part. In addition, a fabrication method of the touch device is also provided.

摘要翻译： 本公开的实施例提供了具有感测区域和围绕周边区域的周边区域的触摸设备。 触摸装置包括感测电极层，遮光层和信号传输线，其中遮光层设置在外围区域和感测电极层上。 遮光层具有中空部分并且完全覆盖周边区域。 信号传输线设置在遮光层上并填充在中空部分中。 信号传输线通过中空部分下方的遮光层与感测电极层电连接。 此外，还提供了一种触摸装置的制造方法。

公开(公告)号：US06881369B2

公开(公告)日：2005-04-19

申请号：US10124312

申请日：2002-04-18

申请人： Yuh-Wen Lee ,  Liang-Yu Yao ,  Chao-Chiun Liang ,  Jeng-En Juang ,  Ching-Yi Wu

发明人： Yuh-Wen Lee ,  Liang-Yu Yao ,  Chao-Chiun Liang ,  Jeng-En Juang ,  Ching-Yi Wu

IPC分类号： B28B7/36 ,  B29C33/38 ,  B29C33/44 ,  G03F7/00 ,  H01L21/302 ,  H01L21/461

CPC分类号： G03F7/00

摘要： The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold. The invention shortens the electroforming time to be one third of the prior art, elongating the number of times the micro-electroforming mold can be used by a factor of more than three.

摘要翻译： 本发明公开了一种使用预成型金属作为基板的微电气模具及其制造方法。 使用预成型金属作为基板可以避免微电铸模具由于电铸金属中的残余应力而发生变形。 本文公开的制造方法包括以下步骤：在加工后在预成型金属基板的表面上形成接合材料层; 在金属基板和接合材料的表面上形成高纵横比的光致抗蚀剂微结构; 将电铸材料放入光致抗蚀剂微结构的间隙中以形成电铸金属微观结构; 并且使用热处理通过接合材料粘合金属基板和金属微结构，并同时冲击光致抗蚀剂微结构以形成微电铸模具。 本发明将电铸时间缩短到现有技术的三分之一，将微电铸模具的使用次数延长三倍以上。