公开(公告)号：US08797763B2

公开(公告)日：2014-08-05

申请号：US13005718

申请日：2011-01-13

申请人： Naomi Fukunaga ,  Hisashi Yoshinaga ,  Junichi Ogou ,  Naofumi Kosugi

发明人： Naomi Fukunaga ,  Hisashi Yoshinaga ,  Junichi Ogou ,  Naofumi Kosugi

IPC分类号： H05K7/14 ,  H05K7/18

CPC分类号： H05K9/0067 ,  G06F1/181 ,  G06F1/186 ,  H05K9/0058

摘要： A shield structure for an electronic element, includes a ground pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the ground pattern.

摘要翻译： 一种用于电子元件的屏蔽结构，包括设置在板中的接地图案; 以及具有导电性的第一构件，覆盖电子元件并与接地图案连接。

公开(公告)号：US06303877B2

公开(公告)日：2001-10-16

申请号：US09109912

申请日：1998-07-02

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

IPC分类号： H01R909

CPC分类号： H05K1/115 ,  H01L23/49816 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2924/15322 ,  H05K1/113 ,  H05K3/467 ,  H05K2201/096 ,  H05K2201/0979

摘要： A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.

摘要翻译： 一种多层薄膜布线板，包括设置有多个布线层的基材和层叠在基材上的绝缘层，并且包括通过层叠布线层而形成的通孔，以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔，多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。

公开(公告)号：US6054652A

公开(公告)日：2000-04-25

申请号：US942387

申请日：1997-10-10

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

IPC分类号： H05K3/34 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

CPC分类号： H01L23/5384 ,  H01L23/49811 ,  H05K1/112 ,  H01L2224/16225 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K1/0298 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10318 ,  H05K3/467

摘要： The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.

摘要翻译： 薄膜多层基板包括绝缘基板基板和包括多个导电层和形成在基板基板上的多个绝缘层的薄膜结构。 在薄膜结构中形成通孔结构并连接到薄层结构的导电层之一。 引脚连接到通孔结构，使得通孔结构的底部直接层压在基板基板上，并且引脚固定到通孔结构上。