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公开(公告)号：US08673194B2
公开(公告)日：2014-03-18
申请号：US12115339
申请日：2008-05-05
IPC分类号： B29C45/14
CPC分类号： H01Q1/22 , A61N1/37211 , A61N1/37229 , A61N1/3752 , H01Q1/243 , H01Q1/273 , H01Q1/36
摘要： A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
摘要翻译： 一种用于可植入医疗装置的连接器组件，其具有放置在连接器的聚合物内的已建立的物理位置的硬件部件，以及制造组件的方法。 一个实施例包括一种方法，其涉及形成第一镜头，将至少一个硬件组件耦合到第一镜头以形成子组件，将所述子组件放置在模具的相对区域的一组之间，移动所述组件的至少一个区域 的模具的相对区域以限制模具内的子组件，并且在子组件的至少一部分上引入第二次喷射以形成连接器。
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公开(公告)号：US20080303728A1
公开(公告)日：2008-12-11
申请号：US12115339
申请日：2008-05-05
CPC分类号： H01Q1/22 , A61N1/37211 , A61N1/37229 , A61N1/3752 , H01Q1/243 , H01Q1/273 , H01Q1/36
摘要： A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
摘要翻译： 一种用于可植入医疗装置的连接器组件，其具有放置在连接器的聚合物内的已建立的物理位置的硬件部件，以及制造组件的方法。 一个实施例包括一种方法，其涉及形成第一镜头，将至少一个硬件组件耦合到第一镜头以形成子组件，将所述子组件放置在模具的相对区域的一组之间，移动所述组件的至少一个区域 的模具的相对区域以限制模具内的子组件，并且在子组件的至少一部分上引入第二次喷射以形成连接器。
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3.发明授权High density interconnect multi-chip modules including embedded distributed power supply elements 失效高密度互连多芯片模块，包括嵌入式分布式电源元件
公开(公告)号：US5384691A
公开(公告)日：1995-01-24
申请号：US2374
申请日：1993-01-08
申请人： Constantine A. Neugebauer, deceased , Charles S. Korman , David A. Bates , William H. Bicknell , Wolfgang Daum
发明人： Constantine A. Neugebauer, deceased , Charles S. Korman , David A. Bates , William H. Bicknell , Wolfgang Daum
IPC分类号： H01L23/50 , H01L23/538 , H05K7/02
CPC分类号： H01L24/82 , H01L23/50 , H01L23/5389 , H01L24/24 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/82039 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011
摘要： By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltage and input current to a relatively lower output voltage and relatively higher output current, thereby decreasing the current requirements of external power supply lines connected to the multi-chip module. The current and voltage outputs may be connected to chip power inputs through relatively short, low-impedance power distribution conductors comprising copper strips direct bonded to a ceramic substrate; alternatively, or in combination with direct bonded copper conductors, the low-impedance power distribution conductors may be situated within an HDI overcoat structure. The power supply elements may be placed within cavities formed in the substrate, or on a thinner portion of the substrate. The power supply may also provide multiple output voltages.
摘要翻译： 通过采用嵌入MCM本身的分布式电源元件的高密度互连（HDI）多芯片模块（MCI），组合MCM和功率转换器的功能。 嵌入式电源元件包括DC-DC或AC-DC转换器，用于将输入电压和输入电流转换为相对较低的输出电压和相对较高的输出电流，从而降低连接到多芯片的外部电源线的电流要求 模块。 电流和电压输出可以通过相对短的低阻抗配电导体连接到芯片功率输入，该导体包括直接结合到陶瓷衬底的铜带; 或者与直接接合的铜导体结合，低阻抗配电导体可以位于HDI外涂层结构内。 电源元件可以放置在形成在基板中的空腔中，或者放置在基板的较薄部分上。 电源还可以提供多个输出电压。
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公开(公告)号：US5351001A
公开(公告)日：1994-09-27
申请号：US504803
申请日：1990-04-05
IPC分类号： G01R1/04 , H01L23/538 , H01L23/48
CPC分类号： H01L23/5389 , G01R1/04 , H01L24/18 , H01L24/82 , H01L2224/18 , H01L2224/82039 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/19041 , H01L2924/3011
摘要： A test fixture for testing microwave components enables components to be tested with high correlation between the component's test results and its operation in a system. The test fixture provides for non-destructive mounting of and connection of the component to the test fixture in the same manner as it will be connected in the final system and also provides for tailoring of the test connections as may be desired.
摘要翻译： 用于测试微波组件的测试夹具使组件能够在组件的测试结果与系统中的操作之间具有高度相关性的情况下进行测试。 测试夹具以与其将连接在最终系统中相同的方式将部件非破坏性地安装和连接到测试夹具，并且还可根据需要调整测试连接。
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公开(公告)号：US06723066B2
公开(公告)日：2004-04-20
申请号：US10054537
申请日：2002-01-22
IPC分类号： A61M106
CPC分类号： A61M1/064
摘要： A breastpump is provided with a universal suction hood base that can be used with a set of different shields. An improved shield is further disclosed which is more flexible and conforms more readily to the breast, and also provides massage.
摘要翻译： 一个吸奶器设有一个通用吸气罩底座，可以与一套不同的护罩一起使用。 进一步公开了一种改进的护罩，其更加灵活并且更容易符合乳房，并且还提供按摩。
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6.发明授权Conductively enclosed hybrid integrated circuit assembly using a silicon substrate 失效使用硅衬底的导电封闭式混合集成电路组件
公开(公告)号：US5049978A
公开(公告)日：1991-09-17
申请号：US579652
申请日：1990-09-10
申请人： David A. Bates , Ronald B. Browne , David P. Smith
发明人： David A. Bates , Ronald B. Browne , David P. Smith
IPC分类号： H01L23/10 , H01L23/14 , H01L23/498 , H01L23/538 , H01L23/58 , H01L25/16
CPC分类号： H01L23/49872 , H01L23/10 , H01L23/147 , H01L23/5384 , H01L23/585 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/16 , H01L2223/6683 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/3011
摘要： A conductively enclosed hybrid integrated circuit assembly for use with microwave and millimeter wave signals is disclosed. The enclosure utilizes a silicon substrate into which recesses are formed by conventional silicon etching processes to support individual MMIC chips with their surfaces flush with the unetched substrate surfaces. The assembly is covered with a thin solid dielectric layer, perforated over points of connection and followed by a metallization to provide point-to-point connections. The arrangement provides one or more levels of patterned metallizations with additional levels being provided either by additional dielectric layers or by forming the silicon substrate from three or more laminar elements and providing a patterned metallization on the surface of an intermediate element. Efficiency in signal grounding and in rf transmission line paths is assured by surface metallizations and the provision of low impedance paths through the substrate. Fully hermetic seals are provided using conventional silicon processing. Input/Output connections may be either electrical or optical.
摘要翻译： 公开了一种与微波和毫米波信号一起使用的导电封闭式混合集成电路组件。 外壳利用硅衬底，通过常规硅蚀刻工艺形成凹槽，以支撑各个MMIC芯片，其表面与未蚀刻的衬底表面齐平。 组件被薄的固体介电层覆盖，穿过连接点，随后进行金属化以提供点对点连接。 该布置提供一个或多个图案化金属化层，其中附加层可以由附加的介电层提供，或通过从三个或更多个层状元件形成硅衬底，并在中间元件的表面上提供图案化的金属化。 通过表面金属化和通过衬底的低阻抗路径提供信号接地和射频传输线路径的效率。 使用常规的硅加工提供完全密封的密封。 输入/输出连接可以是电的或光学的。
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公开(公告)号：US4702740A
公开(公告)日：1987-10-27
申请号：US400529
申请日：1982-07-21
申请人： David A. Bates
发明人： David A. Bates
IPC分类号： A61M1/00
CPC分类号： A61M1/0019 , A61M1/0096
摘要： A collection system for body fluids comprising, a receptacle having a collection chamber for retaining the body fluids, a first container having a supply chamber for retaining a bactericide, and a second container having a holding chamber, with the holding chamber being located above a lower portion of the collection chamber, and the supply chamber being located above a lower portion of the holding chamber. The system has a first valve member permitting the passage of bactericide from the supply chamber into the holding chamber, and a second valve member permitting the passage of the bactericide from the holding chamber into the collection chamber.
摘要翻译： 一种用于体液的收集系统，包括：具有用于保持体液的收集室的容器，具有用于保持杀菌剂的供应室的第一容器和具有保持室的第二容器，所述保持室位于下部 收集室的一部分，并且供应室位于保持室的下部的上方。 该系统具有允许杀菌剂从供给室通过到保持室中的第一阀构件和允许杀菌剂从保持室通过到收集室中的第二阀构件。
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公开(公告)号：US06481986B1
公开(公告)日：2002-11-19
申请号：US09675888
申请日：2000-09-29
申请人： Brian H. Silver , Larry D. Annis , David A. Bates
发明人： Brian H. Silver , Larry D. Annis , David A. Bates
IPC分类号： F04B4100
CPC分类号： F04B45/047 , A61M1/0037 , A61M1/06 , F04B9/045 , F04B43/0063 , F04B49/225
摘要： An improved vacuum adjustment mechanism for controlling airflow into a chamber which is subject to negative pressure, such as the chamber of a diaphragm pump which is generating vacuum for a breast shield assembly, has an air inlet conduit communicating with the chamber. A channel is formed in a base member, with the channel having a longitudinal length and a dimension perpendicular to that length. The perpendicular dimension varies from a minimum to a maximum. The channel has a bottom and is open, such as along a channel top. An airhole is formed in the channel bottom at the point of the maximum dimension. A rotary member is mounted on the base member, and has an internal channel extending across the longitudinal length of the base member channel, and overlies the channel top. The internal channel of the rotary member communicates with an air source, such as ambient air. The rotary member serves to move the internal channel along the longitudinal length of the base member channel, to thereby regulate airflow into the base member channel depending upon where the internal channel is positioned between the minimum and maximum dimensions.
摘要翻译： 改进的真空调节机构用于控制进入负压的室内的气流，例如为乳房罩组件产生真空的隔膜泵室，具有与腔室连通的空气入口导管。 通道形成在基部构件中，其中通道具有纵向长度和垂直于该长度的尺寸。 垂直尺寸从最小到最大不等。 通道具有底部并且是开放的，例如沿着通道顶部。 在最大尺寸的位置，在通道底部形成一个通气孔。 旋转构件安装在基座构件上，并且具有延伸穿过基部构件通道的纵向长度的内部通道，并且覆盖在通道顶部上。 旋转构件的内部通道与诸如环境空气的空气源连通。 旋转构件用于沿着基部构件通道的纵向长度移动内部通道，从而根据内部通道在最小和最大尺寸之间的位置来调节进入基部构件通道的气流。
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公开(公告)号：US06387072B1
公开(公告)日：2002-05-14
申请号：US09450404
申请日：1999-11-29
IPC分类号： A61M106
CPC分类号： A61M1/064
摘要： A breastpump is provided with a universal suction hood base that can be used with a set of different shields. An improved shield is further disclosed which is more flexible and conforms more readily to the breast, and also provides massage.
摘要翻译： 一个吸奶器设有一个通用吸气罩底座，可以与一套不同的护罩一起使用。 进一步公开了一种改进的护罩，其更加灵活并且更容易符合乳房，并且还提供按摩。
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公开(公告)号：US06208501B1
公开(公告)日：2001-03-27
申请号：US09332406
申请日：1999-06-14
IPC分类号： H01G4005
CPC分类号： H01G4/35 , H01G4/06 , H05K3/3442 , H05K2201/09954 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.
摘要翻译： 立体轴向引线的表面贴装电容器由夹在第一和第二块之间的介质芯片电容器形成。 端块具有与所述芯片电容器的轮廓匹配的轮廓。 端块至少在其外表面上是导电的，并且用作连接到印刷电路的金属表面迹线的引线。 在一个优选实施例中，端块是其表面上具有金属表面的陶瓷立方体。 金属化立方体使得器件围绕其长轴旋转对称，使得电容器在任何取向上具有相同的性能。 该功能可以自动将设备拾取并放置到电路板上。 优选地，电介质芯片具有与陶瓷立方体相同尺寸的正方形轮廓。 立方体和芯片的轮廓可以为20至25密耳，以匹配典型印刷电路迹线的宽度。 电容器可以是任何典型值，即在0.05和300pf之间。
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