Vibration sensor with sliding magnet

    公开(公告)号:US11415457B2

    公开(公告)日:2022-08-16

    申请号:US16170471

    申请日:2018-10-25

    Abstract: The present invention provides a vibration sensor, which comprises a circuit board having an accommodating space. A sensing assembly is disposed in the accommodating space. A recess for magnet sliding is disposed in the sensing assembly. Dispose a magnet in the recess and then dispose a coil layer on an arbitrary side or both sides of the sensing assembly. Furthermore, a lubricating layer is coated on the recess. Alternatively, the recess can be a vacuum structure or a hollow cross-sectional structure for reducing the friction between the recess and the magnet. Alternatively, the coil layer can be coated with a protective layer or multiple layers can be stacked. Without increasing the area of the sensor, the sensing on the variation of magnetic flux can be improved. Accordingly, the vibration sensor according to the present invention can achieve wideband detection of vibrations.

    Miniature gas sensor and method for manufacturing the same

    公开(公告)号:US10533962B2

    公开(公告)日:2020-01-14

    申请号:US15370384

    申请日:2016-12-06

    Abstract: The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 μm and 10 μm; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 μm and 4 μm; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.

    MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
    存储器件及其制造方法

    公开(公告)号:US20140131716A1

    公开(公告)日:2014-05-15

    申请号:US13744594

    申请日:2013-01-18

    Abstract: A memory device comprises a substrate, a tunnel oxide layer, a charge trapping layer, a block oxide layer, a plurality of conductive quantum dots, a metal gate and a source/drain structure. The tunnel oxide layer is disposed on the substrate and has a thickness substantially less than or equal to 2 nm. The charge trapping layer is disposed on the tunnel oxide layer. The quantum dots are embedded in the charge trapping layer. The block oxide layer is disposed on the charge trapping layer. The metal gate essentially consisting of aluminum (Al), copper (Cu), tantalum nitride (TiN), titanium nitride (TaN), aluminum-silicon-copper (Al—Si—Cu) alloys or the arbitrary combinations thereof is disposed on the block oxide layer. The source/drain structure is disposed in the substrate.

    Abstract translation: 存储器件包括衬底,隧道氧化物层,电荷俘获层,块状氧化物层,多个导电量子点,金属栅极和源极/漏极结构。 隧道氧化物层设置在基板上,其厚度基本上小于或等于2nm。 电荷捕获层设置在隧道氧化物层上。 量子点嵌入电荷俘获层中。 块状氧化物层设置在电荷俘获层上。 基本上由铝(Al),铜(Cu),氮化钽(TiN),氮化钛(TaN),铝 - 硅 - 铜(Al-Si-Cu)合金或其任意组合组成的金属栅极设置在 块状氧化物层。 源极/漏极结构设置在衬底中。

    Miniature gas sensor
    5.
    发明授权

    公开(公告)号:US10656129B2

    公开(公告)日:2020-05-19

    申请号:US15837227

    申请日:2017-12-11

    Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.

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