-
公开(公告)号：US5892304A
公开(公告)日：1999-04-06
申请号：US935967
申请日：1997-09-23
CPC分类号： H01M2/1044 , H05K1/144 , H05K5/0091
摘要： The power cap includes a power supply positioned between a cover and a base. The cover is provided with clips to permit the attachment and detachment of the cover to the power supply and the base. The base is provided with surface mounted NRTC or NVSRAM chips and electrical contacts. The power supply is provided with a crystal oscillator and a battery for controlling the operation of the NRTC or NVSRAM chips, and spring contacts for maintaining the electrical connection between the base and the power supply.
摘要翻译： 电源盖包括定位在盖和基座之间的电源。 盖子设有夹子，以允许盖子与电源和底座的连接和拆卸。 底座上提供了表面安装的NRTC或NVSRAM芯片和电气触点。 该电源设置有晶体振荡器和用于控制NRTC或NVSRAM芯片的操作的电池，以及用于维持基座和电源之间的电连接的弹簧触点。
-
公开(公告)号：US5821619A
公开(公告)日：1998-10-13
申请号：US568854
申请日：1995-12-07
CPC分类号： H01L23/58 , H01L23/32 , H05K1/141 , H01L2924/0002 , H05K2201/10037 , H05K2201/10075 , H05K2201/10325 , H05K2201/10515 , H05K2201/10689 , H05K3/301 , H05K3/325 , H05K3/368 , Y10S257/924
摘要： The replaceable power module includes a power section positioned between a cover and a frame. The cover is provided with clips to permit the attachment and detachment of the cover to the base as well the attachment and detachment of the power module to a surface mounted integrated circuit. The frame is provided with an opening for receiving the integrated circuit, and electrical contacts for electrically connecting the power module to the leads of an integrated circuit. The power section is electrically coupled to the frame and includes a battery and a crystal oscillator for controlling the integrated circuit.
-
公开(公告)号：US5682068A
公开(公告)日：1997-10-28
申请号：US568851
申请日：1995-12-07
CPC分类号： H01M2/1044 , H05K1/144 , H05K5/0091
摘要： The power cap includes a power supply positioned between a cover and a base. The cover is provided with clips to permit the attachment and detachment of the cover to the power supply and the base. The base is provided with surface mounted NRTC or NVSRAM chips and electrical contacts. The power supply is provided with a crystal oscillator and a battery for controlling the operation of the NRTC or NVSRAM chips, and spring contacts for maintaining the electrical connection between the base and the power supply.
摘要翻译： 电源盖包括定位在盖和基座之间的电源。 盖子设有夹子，以允许盖子与电源和底座的连接和拆卸。 底座上提供了表面安装的NRTC或NVSRAM芯片和电气触点。 该电源设置有晶体振荡器和用于控制NRTC或NVSRAM芯片的操作的电池，以及用于维持基座和电源之间的电连接的弹簧触点。
-
公开(公告)号：US6020634A
公开(公告)日：2000-02-01
申请号：US135197
申请日：1998-08-17
CPC分类号： H01L23/58 , H01L23/32 , H05K1/141 , H01L2924/0002 , H05K2201/10037 , H05K2201/10075 , H05K2201/10325 , H05K2201/10515 , H05K2201/10689 , H05K3/301 , H05K3/325 , H05K3/368 , Y10S257/924
摘要： The replaceable power module includes a power section positioned between a cover and a frame. The cover is provided with clips to permit the attachment and detachment of the cover to the base as well the attachment and detachment of the power module to a surface mounted integrated circuit. The frame is provided with an opening for receiving the integrated circuit, and electrical contacts for electrically connecting the power module to the leads of an integrated circuit. The power section is electrically coupled to the frame and includes a battery and a crystal oscillator for controlling the integrated circuit.
摘要翻译： 可更换功率模块包括位于盖和框架之间的功率部分。 盖子设置有夹子，以允许盖子附接到底座以及将功率模块附接到表面安装的集成电路上。 框架设置有用于接收集成电路的开口和用于将功率模块电连接到集成电路的引线的电触头。 功率部分电耦合到框架并且包括用于控制集成电路的电池和晶体振荡器。
-
公开(公告)号：USD384336S
公开(公告)日：1997-09-30
申请号：US51307
申请日：1996-03-06
-
公开(公告)号：US5528463A
公开(公告)日：1996-06-18
申请号：US92631
申请日：1993-07-16
申请人： Neil McLellan , Mike Strittmatter , Joseph P. Hundt , Christopher M. Sells , Francis A. Scherpenberg
发明人： Neil McLellan , Mike Strittmatter , Joseph P. Hundt , Christopher M. Sells , Francis A. Scherpenberg
IPC分类号： G04G17/02 , G11C5/00 , H01R33/74 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H05K7/10 , H01R23/68
CPC分类号： H05K7/1046 , G04G17/02 , H01R12/714 , H01R12/721 , H05K1/141 , H05K2201/10037 , H05K2201/10075 , H05K2201/10325 , H05K2201/10386 , H05K2201/10689 , H05K3/301 , H05K3/3426 , H05K3/368 , Y10T29/49121 , Y10T29/49144
摘要： A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.
摘要翻译： 一种插座系统，包括印刷电路板; 电气模块; 以及具有中空芯的插座。 插座保持电气模块，并且能够将电气模块电连接到印刷电路板。 电气模块具有至少一个电引线。 插座具有能够与电气模块的电引线电耦合的至少一个电引线。 电气模块包括具有第一和第二表面的第二印刷电路板; 位于第二印刷电路板的第一表面上并与第二印刷电路板电耦合的锂电池，位于所述第二印刷电路板的第一表面上并与第二印刷电路板电连接的晶体，以及集成 电路定位在第二印刷电路板的第二表面上。
-
公开(公告)号：US5579206A
公开(公告)日：1996-11-26
申请号：US304065
申请日：1994-09-12
申请人： Neil McLellan , Mike Strittmatter , Joseph P. Hundt , Christopher M. Sells , Francis A. Scherpenberg
发明人： Neil McLellan , Mike Strittmatter , Joseph P. Hundt , Christopher M. Sells , Francis A. Scherpenberg
IPC分类号： G04G17/02 , G11C5/00 , H01R33/74 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H05K7/10 , H05K1/11 , H05K1/16
CPC分类号： G04G17/02 , H01R12/714 , H01R12/721 , H05K1/141 , H05K7/1046 , H05K2201/10037 , H05K2201/10075 , H05K2201/10325 , H05K2201/10386 , H05K2201/10689 , H05K3/301 , H05K3/3426 , H05K3/368
摘要： A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module. The cap may also have a baffle extending from the cap to surround and secure selected electrical components housed by the cap of the electrical module. The process of providing a printed circuit board, mounting a socket on the printed circuit board, placing the printed circuit board with the socket mounted on it in surface mount reflow oven and heating the printed circuit board and the socket to bond the socket to the printed circuit board, placing a cap over and around an electrical module and bending extended edges of the cap over and around the electrical module to seal electrical components inside the electrical module; and inserting an electrical module with the cap in the socket. If baffles are used, they will need to be aligned with selected electrical component of the electrical module.
摘要翻译： 一种插座系统，包括印刷电路板; 电气模块; 以及具有中空芯的插座。 插座保持电气模块，并且能够将电气模块电连接到印刷电路板。 电气模块具有至少一个电引线。 插座具有能够与电气模块的电引线电耦合的至少一个电引线。 电气模块包括具有第一和第二表面的第二印刷电路板; 位于第二印刷电路板的第一表面上并与第二印刷电路板电耦合的锂电池，位于第二印刷电路板的第一表面上并与第二印刷电路板电连接的晶体，以及集成 电路定位在第二印刷电路板的第二表面上。 盖子围绕并围绕并密封电气模块的电气元件。 盖还可以具有从盖延伸以围绕并固定由电模块的盖容纳的所选电气部件的挡板。 提供印刷电路板的过程，将插座安装在印刷电路板上，将印刷电路板与其上安装的插座放置在表面安装回流炉中，并加热印刷电路板和插座以将插座连接到印刷电路板 将盖子放置在电气模块上并围绕电气模块，并且将盖子的延伸边缘弯曲到电气模块上方和周围，以密封电气模块内部的电气部件; 并将带有盖子的电气模块插入插座。 如果使用挡板，它们将需要与电气模块的选定电气部件对齐。
-
公开(公告)号：US08633599B2
公开(公告)日：2014-01-21
申请号：US13766193
申请日：2013-02-13
申请人： Roden Topacio , Neil McLellan
发明人： Roden Topacio , Neil McLellan
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3171 , H01L23/3192 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05567 , H01L2224/1132 , H01L2224/11849 , H01L2224/13022 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
摘要翻译： 公开了各种半导体芯片及其制造方法。 一方面，提供一种制造方法，其包括在施加到半导体芯片侧的绝缘层中形成第一开口。 第一个开口没有延伸到侧面。 在暴露一部分侧面的绝缘层中形成第二开口。
-
公开(公告)号：US08610262B1
公开(公告)日：2013-12-17
申请号：US11061895
申请日：2005-02-18
申请人： Neil McLellan , Ming Wang Sze , Kwok Cheung Tsang , Wing Keung Lam , Wai Kit Tam
发明人： Neil McLellan , Ming Wang Sze , Kwok Cheung Tsang , Wing Keung Lam , Wai Kit Tam
IPC分类号： H01L23/10
CPC分类号： H01L23/49568 , H01L21/56 , H01L23/10 , H01L23/24 , H01L23/3128 , H01L23/36 , H01L23/42 , H01L23/4334 , H01L23/49816 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/10253 , H01L2924/15311 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.
摘要翻译： 一种集成电路封装，包括具有第一和第二表面的衬底以及它们之间的多个导电迹线以及安装在衬底的第一表面上的半导体管芯。 多个引线键将半导体管芯与衬底的导电迹线连接，并且密封剂封装了引线键和半导体管芯。 散热器具有帽，帽的至少一部分向内朝向半导体管芯并且与半导体管芯间隔开。 密封剂填充盖的部分和半导体管芯之间的空间。 散热器还具有从盖延伸的至少一个侧壁，该至少一个侧壁设置在基板上。 球栅阵列设置在基板的第二表面上，球栅阵列的凸块与导电迹线电连接。
-
公开(公告)号：US20130154122A1
公开(公告)日：2013-06-20
申请号：US13766193
申请日：2013-02-13
申请人： Roden Topacio , Neil McLellan
发明人： Roden Topacio , Neil McLellan
IPC分类号： H01L23/498
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3171 , H01L23/3192 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05567 , H01L2224/1132 , H01L2224/11849 , H01L2224/13022 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
摘要翻译： 公开了各种半导体芯片及其制造方法。 一方面，提供一种制造方法，其包括在施加到半导体芯片侧的绝缘层中形成第一开口。 第一个开口没有延伸到侧面。 在暴露一部分侧面的绝缘层中形成第二开口。
-
-
-
-
-
-
-
-
-
搜索结果
94 条记录 (耗时 0.027 秒)
