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    LASER LIGHT SOURCE
    1.
    发明申请
    LASER LIGHT SOURCE 有权

    公开(公告)号：US20230031544A1

    公开(公告)日：2023-02-02

    申请号：US17788808

    申请日：2020-09-08

    Applicant: NICHIA CORPORATION

    Inventor： Norihiro DEJIMA ,  Hideaki TAKEDA ,  Hidenori MATSUO ,  Masaki OMORI

    IPC: H01S5/02326 ,  H01S5/02253 ,  H01S5/02335 ,  H01S5/026

    Abstract: A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.

    LASER LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明公开
    LASER LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20230318256A1

    公开(公告)日：2023-10-05

    申请号：US18190727

    申请日：2023-03-27

    Applicant: NICHIA CORPORATION ,  FURUKAWA ELECTRIC CO., LTD.

    Inventor： Hideaki TAKEDA ,  Norihiro DEJIMA ,  Kazuma KOZURU ,  Toshiaki YAMASHITA ,  Akira YUKUMOTO

    IPC: H01S5/02253 ,  H01S5/0236 ,  H01S5/02326

    CPC classification number: H01S5/02253 ,  H01S5/0236 ,  H01S5/02326

    Abstract: A laser light source includes: a submount; a semiconductor laser element fixed to the submount, the semiconductor laser element having a light-exiting surface through which laser light is to be emitted; a lens member having a light incident surface on which the laser light is incident and a bonding surface that extends laterally from the light incident surface; a supporting member connecting the lens member and the submount together so that the light incident surface of the lens member faces the light-exiting surface of the semiconductor laser element; and an inorganic bonding layer bonding the bonding surface of the lens member and the supporting member together. Between the light incident surface and the bonding surface, the lens member has a surface extending in a direction intersecting the light incident surface and the bonding surface.

    METHOD OF MANUFACTURING LASER LIGHT SOURCE
    3.
    发明申请
    METHOD OF MANUFACTURING LASER LIGHT SOURCE 有权

    公开(公告)号：US20210336411A1

    公开(公告)日：2021-10-28

    申请号：US17239981

    申请日：2021-04-26

    Applicant: NICHIA CORPORATION

    Inventor： Norihiro DEJIMA ,  Hidenori MATSUO ,  Masaki OMORI ,  Hideaki TAKEDA

    IPC: H01S5/02325 ,  H01S5/0237

    Abstract: A method of manufacturing a laser light source includes: providing a submount, the submount having a principal surface on which a laser diode chip is to be fixed, and comprising a pair of lens supports each including an end surface, the end surfaces located at opposite sides with respect to an emission end surface of the laser diode chip; providing a lens having a bonding surface; performing adjustment such that end surfaces of the pair of lens supports of the submount are parallel to a reference plane; performing adjustment such that the bonding surface of the lens is parallel to the reference plane; and while maintaining the end surfaces of the pair of lens supports and the bonding surface of the lens so as to be parallel to the reference plane, bonding the end surfaces with the bonding surface of the lens using an inorganic bonding member.

    LIGHT SOURCE DEVICE
    4.
    发明申请
    LIGHT SOURCE DEVICE 有权

    公开(公告)号：US20210194208A1

    公开(公告)日：2021-06-24

    申请号：US17193165

    申请日：2021-03-05

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki MIYATA ,  Hideaki TAKEDA

    IPC: H01S5/02325 ,  H01S5/042 ,  H01S5/30 ,  H01S5/40 ,  H01S5/068 ,  H01S5/02255 ,  H01S5/02345

    Abstract: A light source device includes at least one first wiring, a plurality of second wirings, a plurality of light emitting elements each having a lower-surface-side electrode connected to a respective one of the at least one first wiring, a plurality of protective elements each having a lower-surface-side electrode connected to a respective one of the plurality of second wirings each corresponding to a respective one of the plurality of light emitting elements, each of the plurality of protective elements connected to a respective one of the plurality of light emitting elements, a plurality of first wirings each connecting an upper-surface-side electrode of each of the plurality of light emitting elements and a respective one of the plurality of second wirings, a plurality of second wires each connecting the upper-surface-side electrodes of two adjacent ones of the protective elements; and a plurality of third wires each connecting an upper-surface-side electrode of a respective one of the plurality of protective elements and a corresponding one of the at least one first wiring. The upper-surface-side electrodes of the plurality of light emitting elements and the upper-surface-side electrodes of the plurality of protective elements are of a same polarity, and the plurality of first wires are disposed below the plurality of second wires.

    LIGHT SOURCE DEVICE
    5.
    发明申请
    LIGHT SOURCE DEVICE 审中-公开

    公开(公告)号：US20200036158A1

    公开(公告)日：2020-01-30

    申请号：US16525075

    申请日：2019-07-29

    Applicant: Nichia Corporation

    Inventor： Tadaaki MIYATA ,  Hideaki TAKEDA

    IPC: H01S5/022 ,  H01S5/042 ,  H01S5/068 ,  H01S5/40 ,  H01S5/30

    Abstract: A light source device includes at least one first wiring, a plurality of second wirings, a plurality of light emitting elements each having a lower-surface-side electrode connected to a respective one of the at least one first wiring, a plurality of protective elements each having a lower-surface-side electrode connected to a respective one of the plurality of second wirings each corresponding to a respective one of the plurality of light emitting elements, each of the plurality of protective elements connected to a respective one of the plurality of light emitting elements, a plurality of first wirings each connecting an upper-surface-side electrode of each of the plurality of light emitting elements and a respective one of the plurality of second wirings, a plurality of second wires each connecting the upper-surface-side electrodes of two adjacent ones of the protective elements; and a plurality of third wires each connecting an upper-surface-side electrode of a respective one of the plurality of protective elements and a corresponding one of the at least one first wiring. The upper-surface-side electrodes of the plurality of light emitting elements and the upper-surface-side electrodes of the plurality of protective elements are of a same polarity, and the plurality of first wires are disposed below the plurality of second wires.

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