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    Integrated EMI shield utilizing a hybrid edge
    1.
    发明授权
    Integrated EMI shield utilizing a hybrid edge 有权
    使用混合边缘的集成EMI屏蔽

    公开(公告)号：US06288344B1

    公开(公告)日：2001-09-11

    申请号：US09378407

    申请日：1999-08-20

    申请人： Nick A. Youker ,  James E. Blood ,  John E. Hansen

    发明人： Nick A. Youker ,  James E. Blood ,  John E. Hansen

    IPC分类号： H05K103

    CPC分类号： H05K9/0039 ,  H01L23/057 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

    摘要： The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, an IC chip carrier comprises an insulating ceramic substrate and at least one internal electrically conductive layer being a circuit ground, portions of which extend to the edge of the substrate, the internal electrically conductive layer in electrical contact with an electrically conductive layer applied to a portion of the substrate edge. This provides a horizontal hybrid ground plane which can be used as an EMI shield that runs horizontally to the chip as well as a hybrid edge EMI shield perpendicular along at least a portion of the edge. This edge shield protects internal circuitry from exterior EMI emissions directed towards the chip carrier edge portion incorporating the shield.

    摘要翻译： 本实施例和相关方法提供了一种用于有效屏蔽的集成EMI屏蔽，其不仅能够垂直于集成电路（IC）芯片载体的发射，而且还与载体并行（沿边）。 在一个实施例中，IC芯片载体包括绝缘陶瓷衬底和至少一个内部导电层，其是电路接地，其部分延伸到衬底的边缘，内部导电层与导电层电接触 施加到基板边缘的一部分。 这提供了水平混合接地平面，其可以用作水平地延伸到芯片的EMI屏蔽以及沿着边缘的至少一部分垂直的混合边缘EMI屏蔽。 该边缘屏蔽件保护内部电路不受外部EMI辐射的影响，引导到结合屏蔽的芯片载体边缘部分。

    Method for integrated EMI shielding
    2.
    发明授权
    Method for integrated EMI shielding 有权
    集成EMI屏蔽方法

    公开(公告)号：US06865804B2

    公开(公告)日：2005-03-15

    申请号：US09928224

    申请日：2001-08-10

    申请人： Nick A. Youker ,  James E. Blood ,  John E. Hansen

    发明人： Nick A. Youker ,  James E. Blood ,  John E. Hansen

    IPC分类号： H01L23/057 ,  H01L23/552 ,  H05K9/00 ,  H05K3/02 ,  H05K3/10

    CPC分类号： H05K9/0039 ,  H01L23/057 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

    摘要： The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

    摘要翻译： 本实施例和相关方法提供了一种用于有效屏蔽的集成EMI屏蔽，其不仅能够垂直于集成电路（IC）芯片载体的发射，而且还与载体并行（沿边）。 在一个实施例中，一种方法包括沿着芯片载体边缘的至少一部分形成内部接地层的至少一部分，将导电层施加到芯片载体边缘的至少一部分，将导电层施加在 所述接地层的暴露部分与所述接地层电接触，并且在所述芯片载体的顶表面内形成至少一个空腔，其中所述至少一个空腔配置成在其中容纳一个或多个集成电路芯片。

    Side mount feedthrough system for sealed components
    3.
    发明授权
    Side mount feedthrough system for sealed components 有权
    用于密封组件的侧装式馈通系统

    公开(公告)号：US08954150B2

    公开(公告)日：2015-02-10

    申请号：US12878406

    申请日：2010-09-09

    申请人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    发明人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    IPC分类号： A61N1/372 ,  A61N1/375

    CPC分类号： A61N1/3754 ,  A61N1/3758 ,  Y10T29/49002

    摘要： The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.

    摘要翻译： 本主题提供了用于制造具有主电路板的可植入医疗装置的部件的装置的装置和方法。 该方法包括在外壳的外侧上形成包围孔。 外壳的侧面适于基本上平行于主电路板的表面放置。 馈通组件通过封装孔连接。 馈通组件包括至少一个端部导体，至少部分穿过封装孔。

    Integrated electromagnetic interference filters and feedthroughs
    6.
    发明授权
    Integrated electromagnetic interference filters and feedthroughs 有权
    集成电磁干扰滤波器和馈通

    公开(公告)号：US07719854B2

    公开(公告)日：2010-05-18

    申请号：US10632138

    申请日：2003-07-31

    申请人： Nick A. Youker ,  Lawrence D. Swanson ,  John E. Hansen ,  William J. Linder

    发明人： Nick A. Youker ,  Lawrence D. Swanson ,  John E. Hansen ,  William J. Linder

    IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC分类号： H05K1/0231 ,  A61N1/05 ,  A61N1/3754 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/1006 ,  H05K2201/10371 ,  H05K2203/1147

    摘要： An assembly integrating commercially available capacitors into filtered feedthroughs. A feedthrough assembly comprises a plurality of Input/Output (I/O) conductors, wherein the I/O conductors pass through a hermetic seal such that a first end of the I/O conductors reside on a non-hermetic side of the hermetic seal and a second end of the I/O conductors reside on a hermetic side of the hermetic seal, a printed circuit interconnect substrate residing on the hermetic side of the hermetic seal, and a plurality of ceramic chip capacitors mounted on the printed circuit interconnect substrate, wherein a first end of each capacitor is connected via the interconnect to the second end of an I/O conductor and a second end of each capacitor is connected via the interconnect to a constant voltage level.

    摘要翻译： 将市售的电容器集成到滤波的馈通中的组件。 馈通组件包括多个输入/输出（I / O）导体，其中I / O导体穿过气密密封，使得I / O导体的第一端位于气密密封件的非密封侧 I / O导体的第二端位于气密密封件的密封侧，位于气密密封件密封侧的印刷电路互连基板和安装在印刷电路互连基板上的多个陶瓷芯片电容器， 其中每个电容器的第一端经由互连件连接到I / O导体的第二端，并且每个电容器的第二端经由互连件连接到恒定电压电平。

    SIDE MOUNT FEEDTHROUGH SYSTEM FOR SEALED COMPONENTS
    8.
    发明申请
    SIDE MOUNT FEEDTHROUGH SYSTEM FOR SEALED COMPONENTS 有权
    密封组件的侧面安装系统

    公开(公告)号：US20110082531A1

    公开(公告)日：2011-04-07

    申请号：US12878406

    申请日：2010-09-09

    申请人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    发明人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    IPC分类号： A61N1/05 ,  H01R43/00

    CPC分类号： A61N1/3754 ,  A61N1/3758 ,  Y10T29/49002

    摘要： The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.

    摘要翻译： 本主题提供了用于制造具有主电路板的可植入医疗装置的部件的装置的装置和方法。 该方法包括在外壳的外侧上形成包围孔。 外壳的侧面适于基本上平行于主电路板的表面放置。 馈通组件通过封装孔连接。 馈通组件包括至少一个端部导体，至少部分穿过封装孔。