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    Semiconductor component having a small structural height
    2.
    发明授权
    Semiconductor component having a small structural height 有权

    公开(公告)号：US10411168B2

    公开(公告)日：2019-09-10

    申请号：US14779818

    申请日：2014-03-24

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Joachim Reill ,  Frank Singer ,  Norwin von Malm ,  Matthias Sabathil

    IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/60 ,  H01L23/498

    Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.

    LIGHT-EMITTING DIODES
    3.
    发明申请
    LIGHT-EMITTING DIODES 审中-公开
    发光二极管

    公开(公告)号：US20150041834A1

    公开(公告)日：2015-02-12

    申请号：US14515802

    申请日：2014-10-16

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

    IPC: H01L25/13 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/46

    CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

    Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

    Abstract translation: 发光二极管包括：载体，其包括具有包括安装面的外表面的金属基体; 以及至少两个发光二极管芯片至少间接地固定在所述安装面上，其中所述至少两个发光二极管芯片被嵌入到覆盖所述安装面和所述至少两个光的侧面的反射涂层中 所述至少两个发光二极管芯片具有背离载体的辐射出射表面，并且所述至少两个发光二极管芯片从辐射出射表面突出出反射涂层，或者反射涂层终止 与至少两个发光二极管芯片的辐射出射表面齐平。

    SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATING A SEMICONDUCTOR COMPONENT
    5.
    发明申请
    SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATING A SEMICONDUCTOR COMPONENT 审中-公开
    半导体元件和制造半导体元件的方法

    公开(公告)号：US20160056344A1

    公开(公告)日：2016-02-25

    申请号：US14779818

    申请日：2014-03-24

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Joachim Reill ,  Frank Singer ,  Norwin von Malm ,  Matthias Sabathil

    IPC: H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54

    CPC classification number: H01L33/486 ,  H01L23/49805 ,  H01L33/005 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.

    Abstract translation: 光电半导体元件包括半导体芯片，半导体芯片具有包括产生辐射的有源区的半导体层序列; 辐射出口表面平行于有源区域延伸; 安装侧表面，其固定所述半导体部件并且倾斜地或垂直于所述辐射出射表面延伸，并且至少一个用于外部电接触的接触区域可接近; 在半导体芯片上成型的成型体，至少在区域形成安装侧面; 以及布置在所述模制体上并将所述半导体芯片导电连接到所述至少一个接触区域的接触轨道。

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