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    Radiation-emitting semiconductor device and fabric
    4.
    发明授权
    Radiation-emitting semiconductor device and fabric 有权

    公开(公告)号：US11264550B2

    公开(公告)日：2022-03-01

    申请号：US16606538

    申请日：2018-04-18

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Rudolf Behringer ,  Alexander F. Pfeuffer ,  Andreas Plößl ,  Georg Bogner ,  Berthold Hahn ,  Frank Singer

    IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  A41D13/01 ,  A62B17/00

    Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

    Radiation-emitting semiconductor device and fabric
    6.
    发明授权
    Radiation-emitting semiconductor device and fabric 有权

    公开(公告)号：US11296265B2

    公开(公告)日：2022-04-05

    申请号：US16606538

    申请日：2018-04-18

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Rudolf Behringer ,  Alexander F. Pfeuffer ,  Andreas Plößl ,  Georg Bogner ,  Berthold Hahn ,  Frank Singer

    IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  A41D13/01 ,  A62B17/00

    Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

    LIGHT-EMITTING DIODES
    7.
    发明申请
    LIGHT-EMITTING DIODES 审中-公开
    发光二极管

    公开(公告)号：US20150041834A1

    公开(公告)日：2015-02-12

    申请号：US14515802

    申请日：2014-10-16

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

    IPC: H01L25/13 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/46

    CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

    Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

    Abstract translation: 发光二极管包括：载体，其包括具有包括安装面的外表面的金属基体; 以及至少两个发光二极管芯片至少间接地固定在所述安装面上，其中所述至少两个发光二极管芯片被嵌入到覆盖所述安装面和所述至少两个光的侧面的反射涂层中 所述至少两个发光二极管芯片具有背离载体的辐射出射表面，并且所述至少两个发光二极管芯片从辐射出射表面突出出反射涂层，或者反射涂层终止 与至少两个发光二极管芯片的辐射出射表面齐平。

    Optoelectronic component
    10.
    发明授权
    Optoelectronic component 有权

    公开(公告)号：US10026880B2

    公开(公告)日：2018-07-17

    申请号：US15509505

    申请日：2015-09-08

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： David Racz ,  Michael Zitzlsperger ,  Georg Bogner

    IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L25/075

    Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

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