Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
    1.
    发明授权

    公开(公告)号:US09172014B2

    公开(公告)日:2015-10-27

    申请号:US14352724

    申请日:2012-10-11

    CPC分类号: H01L33/58 H01L33/22

    摘要: An optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer that generates an electromagnetic radiation and a light exit side, and a light coupling-out layer applied to the light exit side, wherein the light coupling-out layer includes of radiation-inactive nanocrystals composed of a material transmissive to the radiation generated, and a refractive index of the radiation-transmissive material for the radiation is at least 1.9.

    摘要翻译: 光电子半导体芯片包括具有生成电磁辐射和光出射侧的有源层的半导体层序列和施加到光出射侧的光耦合层,其中光耦合层包括辐射非活性的 由对所产生的辐射透射的材料构成的纳米晶体和用于辐射的辐射透射材料的折射率至少为1.9。

    Optoelectronic component
    2.
    发明授权

    公开(公告)号:US10347792B2

    公开(公告)日:2019-07-09

    申请号:US15743237

    申请日:2016-07-07

    摘要: An optoelectronic component is disclosed. In an embodiment the component includes a semiconductor layer sequence with a first layer, a second layer and an active layer arranged between the first and second layer, wherein the active layer directly borders the first and second layer, a radiation surface directly bordering the second layer, one or more contact isles for electrically contacting the first layer and one or more through-connections for electrically contacting of the second layer, wherein the through-connections are formed through the first layer and the active layer and open into the second layer, wherein the contact isles are located laterally next to one another directly on a rear side of the first layer facing away from the radiation surface, wherein the through-connections are arranged in regions between the contact isles in a top view of the rear side.

    Laser bar and semiconductor laser and method of producing laser bars and semiconductor lasers

    公开(公告)号:US11205885B2

    公开(公告)日:2021-12-21

    申请号:US16490171

    申请日:2018-04-16

    摘要: A method of producing laser bars or semiconductor lasers includes providing a carrier composite to form a plurality of carriers for the laser bars or for the semiconductor lasers, providing a semiconductor body composite including a common substrate and a common semiconductor layer sequence grown thereon, forming a plurality of separation trenches through the common semiconductor layer sequence such that the semiconductor body composite is divided into a plurality of semiconductor bodies, applying the semiconductor body composite to the carrier composite such that the separation trenches face the carrier composite, thinning or removing the common substrate, and singulating the carrier composite into a plurality of carriers, wherein a plurality of semiconductor bodies are arranged on one of the carriers, and the semiconductor bodies arranged on one common carrier are laterally spaced apart from one another by the separation trenches.

    Optoelectronic Semiconductor Chip
    8.
    发明申请

    公开(公告)号:US20180212107A1

    公开(公告)日:2018-07-26

    申请号:US15742871

    申请日:2016-07-07

    摘要: An optoelectronic semiconductor chip is disclosed. In an embodiment, the chip includes a semiconductor layer sequence with a first side, a second side and an active zone and at least one via electrically contacting the first side with the second side through the active zone, wherein the via has a base region including a cylinder, a truncated cone or a truncated pyramid, wherein the via is surrounded in a lateral direction by an electric insulation layer, wherein the via has a contact region including a truncated cone, a truncated pyramid, or a spherical or aspherical body, wherein the contract region directly follows the base region, wherein the contact region is in direct contact with the second side, wherein a first flank angle of the base region is different from a second flank angle of the contact region, and wherein the first and second flank angles are related to the lateral direction.

    OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP
    10.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP 有权
    光电半导体芯片和生产光电半导体芯片的方法

    公开(公告)号:US20140252398A1

    公开(公告)日:2014-09-11

    申请号:US14352724

    申请日:2012-10-11

    IPC分类号: H01L33/58

    CPC分类号: H01L33/58 H01L33/22

    摘要: An optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer that generates an electromagnetic radiation and a light exit side, and a light coupling-out layer applied to the light exit side, wherein the light coupling-out layer includes of radiation-inactive nanocrystals composed of a material transmissive to the radiation generated, and a refractive index of the radiation-transmissive material for the radiation is at least 1.9.

    摘要翻译: 光电子半导体芯片包括具有生成电磁辐射和光出射侧的有源层的半导体层序列和施加到光出射侧的光耦合层,其中光耦合层包括辐射非活性的 由对所产生的辐射透射的材料构成的纳米晶体和用于辐射的辐射透射材料的折射率至少为1.9。